Thermal-responsive polymer networks, compositions, and methods and applications related thereto
    1.
    发明授权
    Thermal-responsive polymer networks, compositions, and methods and applications related thereto 有权
    热响应聚合物网络,组合物,和其相关的方法和应用

    公开(公告)号:US08597630B2

    公开(公告)日:2013-12-03

    申请号:US12748301

    申请日:2010-03-26

    申请人: Jie Song Jianwen Xu

    发明人: Jie Song Jianwen Xu

    IPC分类号: A61K47/30 C08G63/08

    摘要: The invention relates to materials comprising polymer network containing siloxanes or organic-based core structures, preferably the materials have thermal-responsive properties. In some embodiments, the invention relates to an organic core functionalized with polymers. In another embodiment, organic core-polymer conjugates comprise polylactone segments. The organic core-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices. In some embodiments, the invention relates to silsesquioxane groups functionalized with polymers. In another embodiment, silsequioxane-polymer conjugates comprise polylactone segments. The silsequioxane-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices. In further embodiments, the invention relates to composite materials that contain a polymer matrix and aggregates, and in some embodiments, methods of making, and methods of using these materials. Preferably, the aggregates are calcium phosphate aggregates. Preferably, the material is resistant to fracture. In further embodiments, the materials are used in surgical procedures of bone replacement. In further embodiments, the materials contain polyhedral silsesquioxanes and/or biodegradable segments.

    摘要翻译: 本发明涉及包含含有硅氧烷或有机基核心结构的聚合物网络的材料,优选该材料具有热响应特性。 在一些实施方案中,本发明涉及用聚合物官能化的有机核。 在另一个实施方案中,有机核 - 聚合物缀合物包含聚内酯片段。 有机核 - 聚合物共轭物可以一起交联以形成材料,并且这些材料可以用生物活性化合物官能化,使得当用于医疗装置时,这些材料具有期望的生物相容性或生物活性。 在一些实施方案中,本发明涉及用聚合物官能化的倍半硅氧烷基团。 在另一个实施方案中,硅二恶烷 - 聚合物共轭物包含聚内酯片段。 硅氧烷 - 聚合物共轭物可以一起交联以形成材料,并且这些材料可以用生物活性化合物官能化,使得当用于医疗装置时,这些材料具有期望的生物相容性或生物活性。 在另外的实施方案中,本发明涉及包含聚合物基质和聚集体的复合材料,并且在一些实施方案中涉及制备方法和使用这些材料的方法。 优选地,聚集体是磷酸钙聚集体。 优选地,该材料耐断裂。 在另外的实施方案中,所述材料用于骨置换的外科手术中。 在另外的实施方案中,材料含有多面体倍半硅氧烷和/或可生物降解的片段。

    Thermal responsive polymer siloxanes, compositions, and method and applications related thereto
    3.
    发明授权
    Thermal responsive polymer siloxanes, compositions, and method and applications related thereto 有权
    热响应聚合物硅氧烷,组合物以及与其有关的方法和应用

    公开(公告)号:US08765112B2

    公开(公告)日:2014-07-01

    申请号:US12450872

    申请日:2008-04-18

    申请人: Jie Song Jianwen Xu

    发明人: Jie Song Jianwen Xu

    摘要: The invention relates to materials comprising siloxanes, preferably the materials have thermal-responsive properties. In some embodiments, the invention relates to silsesquioxane groups functionalized with polymers. In another embodiment, silsequioxane-polymer conjugates comprise polylactone segments. The silsequioxane-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices. In further embodiments, the invention relates to composite materials that contain a polymer matrix and aggregates, and in some embodiments, methods of making, and methods of using these materials. Preferably, the aggregates are calcium phosphate aggregates. Preferably, the material is resistant to fracture. In further embodiments, the materials are used in surgical procedures of bone replacement. In further embodiments, the materials contain polyhedral silsesquioxanes and/or biodegradable segments.

    摘要翻译: 本发明涉及包含硅氧烷的材料,优选该材料具有热响应特性。 在一些实施方案中,本发明涉及用聚合物官能化的倍半硅氧烷基团。 在另一个实施方案中,硅二恶烷 - 聚合物共轭物包含聚内酯片段。 硅氧烷 - 聚合物共轭物可以一起交联以形成材料,并且这些材料可以用生物活性化合物官能化,使得当用于医疗装置时,这些材料具有期望的生物相容性或生物活性。 在另外的实施方案中,本发明涉及包含聚合物基质和聚集体的复合材料,并且在一些实施方案中涉及制备方法和使用这些材料的方法。 优选地,聚集体是磷酸钙聚集体。 优选地,该材料耐断裂。 在另外的实施方案中,所述材料用于骨置换的外科手术中。 在另外的实施方案中,材料含有多面体倍半硅氧烷和/或可生物降解的片段。

    Thermal-Responsive Polymer Networks, Compositions, And Methods And Applications Related Thereto
    4.
    发明申请
    Thermal-Responsive Polymer Networks, Compositions, And Methods And Applications Related Thereto 有权
    热响应聚合物网络,组合物及其相关方法和应用

    公开(公告)号:US20100280561A1

    公开(公告)日:2010-11-04

    申请号:US12748301

    申请日:2010-03-26

    申请人: Jie Song Jianwen Xu

    发明人: Jie Song Jianwen Xu

    IPC分类号: A61B17/56 C08G63/91 A61F2/00

    摘要: The invention relates to materials comprising polymer network containing siloxanes or organic-based core structures, preferably the materials have thermal-responsive properties. In some embodiments, the invention relates to an organic core functionalized with polymers. In another embodiment, organic core-polymer conjugates comprise polylactone segments. The organic core-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices. In some embodiments, the invention relates to silsesquioxane groups functionalized with polymers. In another embodiment, silsequioxane-polymer conjugates comprise polylactone segments. The silsequioxane-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices. In further embodiments, the invention relates to composite materials that contain a polymer matrix and aggregates, and in some embodiments, methods of making, and methods of using these materials. Preferably, the aggregates are calcium phosphate aggregates. Preferably, the material is resistant to fracture. In further embodiments, the materials are used in surgical procedures of bone replacement. In further embodiments, the materials contain polyhedral silsesquioxanes and/or biodegradable segments

    摘要翻译: 本发明涉及包含含有硅氧烷或有机基核心结构的聚合物网络的材料,优选该材料具有热响应特性。 在一些实施方案中,本发明涉及用聚合物官能化的有机核。 在另一个实施方案中,有机核 - 聚合物缀合物包含聚内酯片段。 有机核 - 聚合物共轭物可以一起交联以形成材料,并且这些材料可以用生物活性化合物官能化,使得当用于医疗装置时,这些材料具有期望的生物相容性或生物活性。 在一些实施方案中,本发明涉及用聚合物官能化的倍半硅氧烷基团。 在另一个实施方案中,硅二恶烷 - 聚合物共轭物包含聚内酯片段。 硅氧烷 - 聚合物共轭物可以一起交联以形成材料,并且这些材料可以用生物活性化合物官能化,使得当用于医疗装置时,这些材料具有期望的生物相容性或生物活性。 在另外的实施方案中,本发明涉及包含聚合物基质和聚集体的复合材料,并且在一些实施方案中涉及制备方法和使用这些材料的方法。 优选地,聚集体是磷酸钙聚集体。 优选地,该材料耐断裂。 在另外的实施方案中,所述材料用于骨置换的外科手术中。 在另外的实施方案中,材料含有多面体倍半硅氧烷和/或可生物降解的片段

    Polymer Compositions For Biomedical And Material Applications
    5.
    发明申请
    Polymer Compositions For Biomedical And Material Applications 审中-公开
    聚合物组合物用于生物医学和材料应用

    公开(公告)号:US20100098761A1

    公开(公告)日:2010-04-22

    申请号:US12183307

    申请日:2008-07-31

    申请人: Jie Song Jianwen Xu

    发明人: Jie Song Jianwen Xu

    摘要: The invention relates to composite materials that contain a polymer matrix and aggregates, and in some embodiments, methods of making, and methods of using these materials. Preferably, the aggregates are calcium phosphate aggregates. Preferably, the material is resistant to fracture. In further embodiments, the materials are used in surgical procedures of bone replacement. In further embodiments, the materials contain polyhedral silsesquioxanes and/or biodegradable segments. In further embodiments, the polymer matrix comprises biomolecules.

    摘要翻译: 本发明涉及包含聚合物基质和聚集体的复合材料,并且在一些实施方案中涉及制备方法和使用这些材料的方法。 优选地,聚集体是磷酸钙聚集体。 优选地,该材料耐断裂。 在另外的实施方案中,所述材料用于骨置换的外科手术中。 在另外的实施方案中,材料含有多面体倍半硅氧烷和/或可生物降解的片段。 在另外的实施方案中,聚合物基质包含生物分子。

    THERMAL RESPONSIVE POLYMER SILOXANES, COMPOSITIONS, AND METHOD AND APPLICATIONS RELATED THERETO
    7.
    发明申请
    THERMAL RESPONSIVE POLYMER SILOXANES, COMPOSITIONS, AND METHOD AND APPLICATIONS RELATED THERETO 有权
    热反应性聚合物硅氧烷,组合物及其相关方法及应用

    公开(公告)号:US20100068168A1

    公开(公告)日:2010-03-18

    申请号:US12450872

    申请日:2008-04-18

    申请人: Jie Song Jianwen Xu

    发明人: Jie Song Jianwen Xu

    IPC分类号: C08G18/61 A61K31/74 A61P19/00

    摘要: The invention relates to materials comprising siloxanes, preferably the materials have thermal-responsive properties. In some embodiments, the invention relates to silsesquioxane groups functionalized with polymers. In another embodiment, silsequioxane-polymer conjugates comprise polylactone segments. The silsequioxane-polymer conjugates may be crosslinked together to form a material, and these materials may be functionalized with bioactive compounds so that the materials have desirable biocompatibility or bioactivity when used in medical devices. In further embodiments, the invention relates to composite materials that contain a polymer matrix and aggregates, and in some embodiments, methods of making, and methods of using these materials. Preferably, the aggregates are calcium phosphate aggregates. Preferably, the material is resistant to fracture. In further embodiments, the materials are used in surgical procedures of bone replacement. In further embodiments, the materials contain polyhedral silsesquioxanes and/or biodegradable segments.

    摘要翻译: 本发明涉及包含硅氧烷的材料,优选该材料具有热响应特性。 在一些实施方案中,本发明涉及用聚合物官能化的倍半硅氧烷基团。 在另一个实施方案中,硅二恶烷 - 聚合物共轭物包含聚内酯片段。 硅氧烷 - 聚合物共轭物可以一起交联以形成材料,并且这些材料可以用生物活性化合物官能化,使得当用于医疗装置时,这些材料具有期望的生物相容性或生物活性。 在另外的实施方案中,本发明涉及包含聚合物基质和聚集体的复合材料,并且在一些实施方案中涉及制备方法和使用这些材料的方法。 优选地,聚集体是磷酸钙聚集体。 优选地,该材料耐断裂。 在另外的实施方案中,所述材料用于骨置换的外科手术中。 在另外的实施方案中,材料含有多面体倍半硅氧烷和/或可生物降解的片段。

    METHOD OF PACKAGING AN INTEGRATED CIRCUIT DIE
    8.
    发明申请
    METHOD OF PACKAGING AN INTEGRATED CIRCUIT DIE 有权
    封装集成电路的方法

    公开(公告)号:US20090061564A1

    公开(公告)日:2009-03-05

    申请号:US11846671

    申请日:2007-08-29

    IPC分类号: H01L23/48 H01L21/00

    摘要: A structure (40) for holding an integrated circuit die (38) during packaging includes a support substrate (42), a release film (44) attached to the substrate (42), and a swelling agent (60). A method (34) of packaging the die (38) includes placing the die (38) on the substrate (42) with its active surface (52) and bond pads (54) in contact with the film (44). The agent (60) is applied over an adhesive coating (50) of the film (44). The agent (60) causes the adhesive (50) to swell into contact with the bond pads (54) and/or to form fillets (64) of adhesive (50) about the die (38). The die (38) is encapsulated in a molding material (72) and released from the substrate (42) as a panel (74) of dies (38). Swelling of the adhesive (50) about the bond pads (54) prevents the molding material (72) from bleeding onto the bond pads (54).

    摘要翻译: 用于在封装期间保持集成电路管芯(38)的结构(40)包括支撑基板(42),附着在基板(42)上的脱模膜(44)和膨胀剂(60)。 封装模具(38)的方法(34)包括将模具(38)放置在基板(42)上,其活性表面(52)和与薄膜(44)接触的粘结垫(54)。 将试剂(60)施加在薄膜(44)的粘合剂涂层(50)上。 试剂(60)使得粘合剂(50)与粘合垫(54)膨胀和/或形成围绕模具(38)的粘合剂(50)的圆角(64)。 模具(38)被封装在模制材料(72)中并且作为模具(38)的面板(74)从基板(42)释放。 粘合剂(50)围绕接合焊盘(54)的膨胀防止模制材料(72)渗透到接合焊盘(54)上。

    High dielectric polymer composites and methods of preparation thereof
    9.
    发明授权
    High dielectric polymer composites and methods of preparation thereof 有权
    高介电聚合物复合材料及其制备方法

    公开(公告)号:US06864306B2

    公开(公告)日:2005-03-08

    申请号:US10135744

    申请日:2002-04-30

    摘要: Polymer composites and methods of making the polymer composites are presented. A representative polymer composite includes a polymer resin and a conductive material, wherein the polymer composite is characterized by a dielectric constant greater the 200. A representative method of making the polymer composite can be broadly summarized by the following steps: providing a polymer resin and a conductive material; mixing the polymer resin and the conductive material; and forming the polymer composite, wherein the polymer composite is characterized by a dielectric constant greater than 200.

    摘要翻译: 提出了聚合物复合材料和制备聚合物复合材料的方法。 代表性的聚合物复合材料包括聚合物树脂和导电材料,其中聚合物复合材料的特征在于介电常数大于200.制备聚合物复合材料的代表性方法可以通过以下步骤大致概括:提供聚合物树脂和 导电材料; 混合聚合物树脂和导电材料; 以及形成所述聚合物复合材料,其中所述聚合物复合材料的特征在于介电常数大于200。

    Soldering relief method and semiconductor device employing same
    10.
    发明授权
    Soldering relief method and semiconductor device employing same 有权
    焊接补救方法和使用其的半导体器件

    公开(公告)号:US08461676B2

    公开(公告)日:2013-06-11

    申请号:US13228925

    申请日:2011-09-09

    摘要: A semiconductor device includes a substrate having a first side and a second side, the second side having a mounting location for at least one semiconductor element, and the first side having a plurality of locations electrically connected to locations on the second side. A plurality of electrically conductive interconnects are provided at the locations, each having a first end attached at the location and a second end spaced from the substrate, and an encapsulant partially encapsulates the plurality of interconnects and has a surface lying in a first plane. The second ends are located on the side of the first plane opposite from the substrate first side, an annular space in the encapsulant surrounds each of the plurality of electrically conductive interconnects, and the annular space has a bottom located between the first plane and the substrate first side. Also a method for making such a semiconductor device.

    摘要翻译: 半导体器件包括具有第一侧和第二侧的衬底,第二侧具有用于至少一个半导体元件的安装位置,并且第一侧具有电连接到第二侧上的位置的多个位置。 在位置处设置多个导电互连件,每个导电互连件具有附接在该位置处的第一端和与衬底间隔开的第二端,并且密封剂部分地封装多个互连件,并且具有位于第一平面中的表面。 第二端位于与衬底第一侧相对的第一平面的侧面上,密封剂中的环形空间围绕多个导电互连件中的每一个,并且环形空间具有位于第一平面和衬底之间的底部 第一面。 也是制造这种半导体器件的方法。