公开(公告)号：US08461676B2

公开(公告)日：2013-06-11

申请号：US13228925

申请日：2011-09-09

申请人： Mark Wendell Schwarz ,  Jianwen Xu

发明人： Mark Wendell Schwarz ,  Jianwen Xu

IPC分类号： H01L23/02 ,  H01L23/12 ,  H01L23/053 ,  H01L21/00

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49811 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  Y02P70/613 ,  H01L2924/00

摘要： A semiconductor device includes a substrate having a first side and a second side, the second side having a mounting location for at least one semiconductor element, and the first side having a plurality of locations electrically connected to locations on the second side. A plurality of electrically conductive interconnects are provided at the locations, each having a first end attached at the location and a second end spaced from the substrate, and an encapsulant partially encapsulates the plurality of interconnects and has a surface lying in a first plane. The second ends are located on the side of the first plane opposite from the substrate first side, an annular space in the encapsulant surrounds each of the plurality of electrically conductive interconnects, and the annular space has a bottom located between the first plane and the substrate first side. Also a method for making such a semiconductor device.

摘要翻译： 半导体器件包括具有第一侧和第二侧的衬底，第二侧具有用于至少一个半导体元件的安装位置，并且第一侧具有电连接到第二侧上的位置的多个位置。 在位置处设置多个导电互连件，每个导电互连件具有附接在该位置处的第一端和与衬底间隔开的第二端，并且密封剂部分地封装多个互连件，并且具有位于第一平面中的表面。 第二端位于与衬底第一侧相对的第一平面的侧面上，密封剂中的环形空间围绕多个导电互连件中的每一个，并且环形空间具有位于第一平面和衬底之间的底部 第一面。 也是制造这种半导体器件的方法。

公开(公告)号：US20130062746A1

公开(公告)日：2013-03-14

申请号：US13228925

申请日：2011-09-09

申请人： Mark Wendell Schwarz ,  Jianwen Xu

发明人： Mark Wendell Schwarz ,  Jianwen Xu

IPC分类号： H01L23/495 ,  H01L21/58 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49811 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  Y02P70/613 ,  H01L2924/00

摘要： A semiconductor device includes a substrate having a first side and a second side, the second side having a mounting location for at least one semiconductor element, and the first side having a plurality of locations electrically connected to locations on the second side. A plurality of electrically conductive interconnects are provided at the locations, each having a first end attached at the location and a second end spaced from the substrate, and an encapsulant partially encapsulates the plurality of interconnects and has a surface lying in a first plane. The second ends are located on the side of the first plane opposite from the substrate first side, an annular space in the encapsulant surrounds each of the plurality of electrically conductive interconnects, and the annular space has a bottom located between the first plane and the substrate first side. Also a method for making such a semiconductor device.

摘要翻译： 半导体器件包括具有第一侧和第二侧的衬底，第二侧具有用于至少一个半导体元件的安装位置，并且第一侧具有电连接到第二侧上的位置的多个位置。 在位置处设置多个导电互连件，每个导电互连件具有附接在该位置处的第一端和与衬底间隔开的第二端，并且密封剂部分地封装多个互连件，并且具有位于第一平面中的表面。 第二端位于与衬底第一侧相对的第一平面的侧面上，密封剂中的环形空间围绕多个导电互连件中的每一个，并且环形空间具有位于第一平面和衬底之间的底部 第一面。 也是制造这种半导体器件的方法。