知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

13 records (took 0.05 seconds)

    METHOD FOR MANUFACTURING PASSIVE OPTICAL COMPONENTS, AND DEVICES COMPRISING THE SAME
    2.
    发明申请
    METHOD FOR MANUFACTURING PASSIVE OPTICAL COMPONENTS, AND DEVICES COMPRISING THE SAME 审中-公开

    公开(公告)号：US20170235026A1

    公开(公告)日：2017-08-17

    申请号：US15441515

    申请日：2017-02-24

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Susanne Westenhöfer ,  Bojan Tesanovic

    IPC: G02B3/00 ,  H01L25/16 ,  B29D11/00

    Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).

    Method for manufacturing passive optical components, and devices comprising the same
    3.
    发明授权
    Method for manufacturing passive optical components, and devices comprising the same 有权
    无源光学元件的制造方法以及包括该无源光学元件的器件的方法

    公开(公告)号：US09193120B2

    公开(公告)日：2015-11-24

    申请号：US14288755

    申请日：2014-05-28

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Susanne Westenhöfer ,  Bojan Tesanovic

    IPC: G02B27/10 ,  B29D11/00 ,  G02B3/00 ,  G02B5/20 ,  G02B13/00 ,  H01L27/146 ,  B29L11/00

    CPC classification number: G02B3/0031 ,  B29D11/00307 ,  B29D11/00375 ,  B29D11/0074 ,  B29D11/00932 ,  B29K2063/00 ,  B29L2011/00 ,  G02B3/00 ,  G02B5/20 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).

    Abstract translation: 一种装置包括至少一个包括至少一个透明部分（t）和至少一个阻挡部分（b）的光学元件（O）。 所述至少一个透明部分（t）由对于至少一个特定光谱范围的光基本上透明的一种或多种材料制成，称为透明材料，并且所述至少一个阻挡部分（b）由一个或多个 对于特定光谱范围的光而言，材料基本上不透明，被称为不透明材料。 透明部分（t）包括至少一个无源光学部件（L）。 所述至少一个无源光学部件（L）包括透明元件（6），所述透明元件（6）具有大致垂直于垂直方向的两个相对的大致平坦表面，所述近似平面大致等于所述至少一个阻挡部分（b）的厚度， 至少一个光学结构（5），连接到透明元件（6）。

    Molded Circuit Substrates
    5.
    发明申请
    Molded Circuit Substrates 审中-公开

    公开(公告)号：US20180302990A1

    公开(公告)日：2018-10-18

    申请号：US15766943

    申请日：2016-10-07

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Bojan Tesanovic ,  Simon Gubser ,  Robert Lenart ,  Mario Cesana

    IPC: H05K3/00 ,  H05K1/02 ,  H01L27/146 ,  H01L33/48 ,  H01L33/58

    Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

    METHOD FOR MANUFACTURING PASSIVE OPTICAL COMPONENTS, AND DEVICES COMPRISING THE SAME
    6.
    发明申请
    METHOD FOR MANUFACTURING PASSIVE OPTICAL COMPONENTS, AND DEVICES COMPRISING THE SAME 有权
    用于制造被动光学元件的方法，以及包括其的装置

    公开(公告)号：US20140347747A1

    公开(公告)日：2014-11-27

    申请号：US14288755

    申请日：2014-05-28

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Susanne Westenhöfer ,  Bojan Tesanovic

    IPC: B29D11/00 ,  G02B3/00 ,  G02B13/00 ,  G02B5/20

    CPC classification number: G02B3/0031 ,  B29D11/00307 ,  B29D11/00375 ,  B29D11/0074 ,  B29D11/00932 ,  B29K2063/00 ,  B29L2011/00 ,  G02B3/00 ,  G02B5/20 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).

    Abstract translation: 一种装置包括至少一个包括至少一个透明部分（t）和至少一个阻挡部分（b）的光学元件（O）。 所述至少一个透明部分（t）由对于至少一个特定光谱范围的光基本上透明的一种或多种材料制成，称为透明材料，并且所述至少一个阻挡部分（b）由一个或多个 对于特定光谱范围的光而言，材料基本上不透明，被称为不透明材料。 透明部分（t）包括至少一个无源光学部件（L）。 所述至少一个无源光学部件（L）包括透明元件（6），所述透明元件（6）具有大致垂直于垂直方向的两个相对的大致平坦表面，所述近似平面大致等于所述至少一个阻挡部分（b）的厚度， 至少一个光学结构（5），连接到透明元件（6）。

    OPTICAL ELEMENT STACK ASSEMBLIES
    10.
    发明申请
    OPTICAL ELEMENT STACK ASSEMBLIES 审中-公开

    公开(公告)号：US20180329175A1

    公开(公告)日：2018-11-15

    申请号：US15775232

    申请日：2016-11-04

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Ji Wang ,  Kam Wah Leong ,  Bojan Tesanovic ,  Qichuan Yu ,  Tobias Senn ,  Nicola Spring ,  Robert Lenart

    IPC: G02B9/04 ,  B29C39/10 ,  B29C39/42 ,  G02B7/02

    CPC classification number: G02B9/04 ,  B29C39/10 ,  B29C39/42 ,  B29K2995/0031 ,  B29L2011/00 ,  B29L2011/0016 ,  G02B7/021

    Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.

Patent Agency Ranking