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公开(公告)号：US09699902B1
公开(公告)日：2017-07-04
申请号：US14340432
申请日：2014-07-24
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , David Geiger , Anwar Mohammed
CPC classification number: H05K1/144 , H05K1/0271 , H05K1/09 , H05K1/097 , H05K1/115 , H05K1/116 , H05K3/36 , H05K3/42 , H05K3/4623 , H05K2201/035 , H05K2201/0394 , H05K2201/044 , H05K2201/096 , H05K2203/0545 , H05K2203/061 , H05K2203/1131
Abstract: A printed circuit board is formed from a plurality of thinner PCBs stacked on top of each other with an intermediate metal interconnect material selectively positioned between adjacent PCBs. The metal interconnect material is selectively positioned on surface contact points of correspondingly aligned plated through holes on the adjacent printed circuit boards. The stacked printed circuit boards and intermediate metal interconnect material are laminated, thereby sintering the metal interconnect material and the surface contact points of the plated through holes to form electrical interconnects between plated through holes on adjacent printed circuit boards. The metal interconnect material is preferably the same as the plating material used to plate the through holes, such as copper.
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公开(公告)号：US10231333B1
公开(公告)日：2019-03-12
申请号：US14307201
申请日：2014-06-17
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed , David Geiger , Murad Kurwa
Abstract: Methods of making a copper interconnect plated through hole assembly are disclosed. Nano copper ink dispersed in an organic solvent is able to be filled in the plated through hole and forming the copper interconnect by sintering at a temperature below the melting of the copper.
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公开(公告)号：US09659359B1
公开(公告)日：2017-05-23
申请号：US14704822
申请日：2015-05-05
Applicant: Flextronics AP, LLC
Inventor： Zhen Feng , Weifeng Liu , David Geiger , Anwar Mohammed , Murad Kurwa
CPC classification number: G06T7/0004 , G01N21/9501 , G01N21/956 , G01N2021/95646 , G06T11/206 , G06T2207/30152
Abstract: Methods of and Devices for quality control that can be used with automated optical inspection (AOI), solder paste inspection (SPI), and automated x-ray inspection (AXI) are disclosed. Plurality of threshold settings are entered in a testing process. Multiple testing results are obtained from the testing process. A graphic presentation is generated showing the numerical relationship among the data points, such that a quality control person is able to fine-tune the testing process to have a predetermined ratio of Defect Escaped % to False Call ppm.
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公开(公告)号：US09593939B1
公开(公告)日：2017-03-14
申请号：US14584951
申请日：2014-12-29
Applicant: Flextronics AP, LLC
Inventor： Hongqiang Xie , An Qi Zhao , Jiyang Zhang , Zhen Feng , David Geiger
CPC classification number: G01B11/0625 , G01B11/06 , G01B11/0608 , G01B11/0691 , G01B17/025 , H05K1/00 , H05K1/0266
Abstract: A glue thickness inspection system automates a thickness measurement functionality for determining the thickness of both non-transparent and transparent materials including, but not limited to, glue, gel, solder and epoxy. The glue thickness inspection system includes a laser detector, a movable platform for positioning a unit under test, and a controller for controlling movement of the platform, angle of the laser detector, and calculation of the transparent material thickness. The laser detector includes a laser for emitting a laser light onto the unit under test and a sensor for receiving corresponding reflected light. The sensed data is used by the controller to determine the transparent material thickness.
Abstract translation: 胶水厚度检查系统自动化厚度测量功能，用于确定不透明和透明材料的厚度，包括但不限于胶，凝胶，焊料和环氧树脂。 胶水厚度检查系统包括激光检测器，用于定位被测单元的可移动平台，以及用于控制平台运动的控制器，激光检测器的角度以及透明材料厚度的计算。 激光检测器包括用于将激光发射到被测单元上的激光器和用于接收相应的反射光的传感器。 感测数据由控制器用于确定透明材料厚度。
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公开(公告)号：US09521738B1
公开(公告)日：2016-12-13
申请号：US14560898
申请日：2014-12-04
Applicant: Flextronics AP, LLC
Inventor： Dennis Willie , Richard Loi , David Geiger , Anwar Mohammed , Murad Kurwa , Hector Rene Marin Hernandez
IPC: H05K7/20 , H05K1/02 , H01L23/473
CPC classification number: H05K1/0201 , H01L23/373 , H05K1/0203 , H05K1/0204 , H05K1/115 , H05K1/181 , H05K3/3494 , H05K7/20209 , H05K7/2039 , H05K2201/0323 , H05K2201/06 , H05K2201/062 , H05K2201/10371 , H05K2203/304
Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology.
Abstract translation: 形成的石墨片的形状和尺寸被设计为位于耦合到PCB的电子部件上方的保护屏蔽。 形成的石墨片用于保护电子部件的主体免受在电子部件组装到PCB期间所施加的热，例如在SMT和通孔技术中使用的加热步骤。
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Patent Agency Ranking
公开(公告)号：US09801277B1
公开(公告)日：2017-10-24
申请号：US14455772
申请日：2014-08-08
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed , David Geiger , Murad Kurwa
CPC classification number: H05K1/14 , H01R12/52 , H05K1/0271 , H05K3/0085 , H05K3/241 , H05K3/303 , H05K3/3426 , H05K3/3436 , H05K3/4015 , H05K2201/04 , H05K2201/068 , H05K2201/10734 , H05K2201/10946 , H05K2201/10984 , H05K2201/2045 , H05K2203/0338 , H05K2203/0723
Abstract: A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.
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公开(公告)号：US09661756B1
公开(公告)日：2017-05-23
申请号：US14455642
申请日：2014-08-08
Applicant: Flextronics AP, LLC
Inventor： Jennifer Nguyen , David Geiger , Anwar Mohammed , Murad Kurwa
CPC classification number: H05K3/244 , G06K19/07754 , H01L23/5386 , H01L24/65 , H01L25/00 , H01L2924/38 , H01M6/40 , H04B1/3816 , H05K1/097 , H05K1/111 , H05K3/30 , H05K3/40
Abstract: Embodiments of the present invention relate to nano-copper pillar interconnects. Nano-copper material is a mixture of nano-copper particles and one or more organic fluxes. In some embodiments, the one or more organic fluxes include organic solvents that help bind the nano-copper particles together and allow the nano-copper material to be printable. The nano-copper material is applied onto bond pads on a printed circuit board (PCB) via a printing process, a dipping process or the like, to form nano-copper covered PCB bond pads. A component can thereafter be coupled with the PCB at the nano-copper covered PCB bond pads. What is left when the solvents evaporate are nano-copper pillar interconnects that form, coupling the component with the PCB bond pads. The nano-copper pillar interconnects are of pure copper.
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公开(公告)号：US09609738B1
公开(公告)日：2017-03-28
申请号：US14560807
申请日：2014-12-04
Applicant: Flextronics AP, LLC
Inventor： Dennis Willie , Richard Loi , David Geiger , Anwar Mohammed , Murad Kurwa , Hector Rene Marin Hernandez
CPC classification number: H05K1/0201 , H01L23/373 , H05K1/0203 , H05K1/0204 , H05K1/115 , H05K1/181 , H05K3/3494 , H05K7/20209 , H05K7/2039 , H05K2201/0323 , H05K2201/06 , H05K2201/062 , H05K2201/10371 , H05K2203/304
Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology. The formed graphite sheet is shaped to selective direct impinging heat. The heat can be directly away from the entire electronic component. Alternatively, the heat can be selectively directed away from some portions of the electronic component and toward other portions of the electronic component.
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9.发明授权Fast cure conductive epoxy attach methodology for high speed automated processes 有权快速固化导电环氧树脂附着方法用于高速自动化工艺公开(公告)号：US09566764B1
公开(公告)日：2017-02-14
申请号：US14579631
申请日：2014-12-22
Applicant: Flextronics AP, LLC
Inventor： Anwar Mohammed , Weifeng Liu , David Geiger , Dennis Willie , Gervasio Mutarelli , Murad Kurwa
CPC classification number: B32B7/14 , B32B7/12 , B32B9/005 , B32B9/04 , B32B9/045 , B32B27/08 , B32B37/06 , B32B37/1207 , B32B37/18 , B32B2255/26 , B32B2307/202 , B32B2309/02 , B32B2363/00 , B32B2457/00 , B32B2457/08 , F16B11/006 , H05K3/305 , H05K3/321 , H05K3/36
Abstract: Two substrates are mechanically and electrically coupled together using a combination of a fast cure electrically non-conductive epoxy for mechanical attachment and a slow cure electrically conductive epoxy for electrical interconnects. The two epoxies are selectively applied between the two substrates as a stack, and the stack is subjected to a temperature that is sufficient to cure the fast cure electrically non-conductive epoxy in a short period of time but does not damage the substrates or components coupled thereto. In some applications, the temperature is less than 100 degrees Celsius and the time period is less than 5 seconds. The stack is removed from the heat and the slow cure electrically conductive epoxy continues to cure over a longer second period of time, such as a few hours to a day.
Abstract translation: 使用用于机械附接的快速固化非导电环氧树脂和用于电互连的缓慢固化导电环氧树脂的组合将两个基底机械和电耦合在一起。 两个环氧树脂作为叠层选择性地施加在两个基板之间，并且堆叠体经历足够的温度以在短时间段内固化快速固化的非导电环氧树脂，但不会损坏耦合的基板或部件 到此。 在一些应用中，温度低于100摄氏度，时间段小于5秒。 堆叠从热量中除去，慢固化导电环氧树脂在更长的第二时间段内继续固化，例如几小时至一天。
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公开(公告)号：US09397065B1
公开(公告)日：2016-07-19
申请号：US14468216
申请日：2014-08-25
Applicant: Flextronics AP, LLC
Inventor： Jennifer Nguyen , David Geiger , Ranilo Aranda , Jonas Sjoberg , Anwar Mohammed , Murad Kurwa
IPC: H01L23/544 , H01L23/00 , H01L25/00 , H01L23/538
CPC classification number: H05K3/244 , G06K19/07754 , H01L23/5386 , H01L24/65 , H01L25/00 , H01L2924/38 , H01M6/40 , H04B1/3816 , H05K1/097 , H05K1/111 , H05K3/30 , H05K3/40
Abstract: Embodiments of the present invention relate to a fixture design for pre-attachment package on package component assembly. The fixture design includes a plurality of pockets arranged in a N×M array. The plurality of pockets is sized to receive bottom packages. The fixture design includes global fiducials that are used to locate positions of the pockets on the fixture, and sets of local fiducials, with each set being specific to one of the pockets and used to refine the position of the location of a corresponding pocket. Each of the pockets can include one or more ear cuts for easy component placement and component removal. The fixture design can include a vacuum port for coupling with a vacuum source for drawing a vacuum to hold the bottom packages down. The fixture design can also include a cover that is used with the fixture to keep the components from being disturbed.
Abstract translation: 本发明的实施例涉及一种用于包装部件组件上的预附接包装的夹具设计。 夹具设计包括以N×M阵列排列的多个口袋。 多个口袋的尺寸适于接纳底部包装。 夹具设计包括用于定位夹具上的凹穴的位置的全局基准和局部基准的集合，其中每一组特定于其中一个凹穴并且用于细化相应凹穴的位置的位置。 每个口袋可以包括一个或多个耳朵切口，便于元件放置和元件移除。 夹具设计可以包括用于与真空源耦合的真空端口，用于抽真空以将底部包装件向下保持。 夹具设计还可以包括与夹具一起使用以防止部件受到干扰的盖子。
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