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公开(公告)号：CN102569215B
公开(公告)日：2016-03-23
申请号：CN201110348230.3
申请日：2011-09-21
Applicant: 英飞凌科技股份有限公司
CPC classification number: H01L24/83 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/73201 , H01L2224/73204 , H01L2224/83191 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/10329 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/00 , H01L2924/01014 , H01L2924/01032 , H01L2924/01031 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/0401
Abstract: 本发明涉及器件以及制造器件的方法。一种器件包括具有第一表面的半导体材料。第一材料被涂敷到所述第一表面，并且纤维材料被嵌入到所述第一材料中。
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公开(公告)号：CN102403293B
公开(公告)日：2017-07-21
申请号：CN201110324979.4
申请日：2011-09-14
Applicant: 英飞凌科技股份有限公司
IPC: H01L23/488 , H01L23/49 , H01L21/48 , H01L21/60
CPC classification number: H01L24/48 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05647 , H01L2224/45147 , H01L2224/48453 , H01L2224/48458 , H01L2224/48463 , H01L2224/4847 , H01L2224/48847 , H01L2224/85 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00
Abstract: 本发明涉及管芯结构、管芯布置以及处理管芯的方法。管芯结构包括管芯和设置在管芯的前侧上的金属化层。金属化层包括铜。金属化层的至少一个部分具有粗糙表面轮廓。具有粗糙表面轮廓的部分包括引线接合结构待接合到的引线接合区域。
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公开(公告)号：CN102569215A
公开(公告)日：2012-07-11
申请号：CN201110348230.3
申请日：2011-09-21
Applicant: 英飞凌科技股份有限公司
CPC classification number: H01L24/83 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/73201 , H01L2224/73204 , H01L2224/83191 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/10329 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/00 , H01L2924/01014 , H01L2924/01032 , H01L2924/01031 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/0401
Abstract: 本发明涉及器件以及制造器件的方法。一种器件包括具有第一表面的半导体材料。第一材料被涂敷到所述第一表面，并且纤维材料被嵌入到所述第一材料中。
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公开(公告)号：CN102403293A
公开(公告)日：2012-04-04
申请号：CN201110324979.4
申请日：2011-09-14
Applicant: 英飞凌科技股份有限公司
IPC: H01L23/488 , H01L23/49 , H01L21/48 , H01L21/60
CPC classification number: H01L24/48 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05647 , H01L2224/45147 , H01L2224/48453 , H01L2224/48458 , H01L2224/48463 , H01L2224/4847 , H01L2224/48847 , H01L2224/85 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00
Abstract: 本发明涉及管芯结构、管芯布置以及处理管芯的方法。管芯结构包括管芯和设置在管芯的前侧上的金属化层。金属化层包括铜。金属化层的至少一个部分具有粗糙表面轮廓。具有粗糙表面轮廓的部分包括引线接合结构待接合到的引线接合区域。
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