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公开(公告)号：CN101800182B
公开(公告)日：2015-04-29
申请号：CN200910263609.7
申请日：2009-12-23
Applicant: 瑞萨电子株式会社
IPC: H01L21/50 , H01L21/603
CPC classification number: H01L24/85 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/97 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/7825 , H01L2224/78301 , H01L2224/7865 , H01L2224/78703 , H01L2224/85181 , H01L2224/85447 , H01L2224/97 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 本发明涉及用于制造半导体器件和接线键合器的方法。具体地，通过减小引线框或者布线衬底在接线键合之后的颤动，实现了接线键合质量的改进。在接线键合器的接线键合部分的加热块之上，提供冷却风机，用于冷却经过接线键合的矩阵框，从而使其温度可以逐步降低。在接线键合之后，冷空气从冷却风机吹送到矩阵框，并且执行对矩阵框的温度控制，从而使矩阵框的温度在接线键合之后可以逐步降低。或者，利用诸如框保持部件、引导部件、滚轴装置或者弹性装置的保持工具来固定经过接线键合的矩阵框，直到冷却完成。
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Patent Agency Ranking
公开(公告)号：CN102024724A
公开(公告)日：2011-04-20
申请号：CN201010253727.2
申请日：2010-08-12
Applicant: 瑞萨电子株式会社
IPC: H01L21/607 , H01L23/49
CPC classification number: H01L23/4952 , B23K20/007 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/85 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48455 , H01L2224/48465 , H01L2224/48599 , H01L2224/48664 , H01L2224/48864 , H01L2224/73265 , H01L2224/78268 , H01L2224/78302 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85464 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20753 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/92247
Abstract: 本发明提供一种半导体器件的制造方法以及半导体器件。通过在导线接合的针脚式接合(第二接合)中进行焊针(6e)的高度控制，能够在针脚部(5a)进行其厚度控制，能够通过确保其接合强度来提高接合可靠性。进而，在针脚部(5a)具有壁厚部分(5e)，并且在该壁厚部分(5e)的下部形成有导线(5)与内引线(2a)的接合区域(5b)的一部分(α部)，从而能够充分确保针脚部(5a)的厚度和接合区域(5b)。根据本发明，能够通过在导线接合的针脚式接合中确保其接合强度来提高接合可靠性。
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公开(公告)号：CN102779768A
公开(公告)日：2012-11-14
申请号：CN201210153813.5
申请日：2012-05-11
Applicant: 瑞萨电子株式会社
IPC: H01L21/60 , H01L23/488
CPC classification number: H01L24/85 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L2224/0401 , H01L2224/04042 , H01L2224/0508 , H01L2224/05186 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/1134 , H01L2224/13017 , H01L2224/13018 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48451 , H01L2224/48465 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/78304 , H01L2224/78343 , H01L2224/81193 , H01L2224/85181 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01052 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10329 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/05442 , H01L2924/20755 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754 , H01L2924/207
Abstract: 本发明的实施例涉及半导体器件及其制造方法。本发明提供一种能够抑制施加到焊盘的损伤的技术。当内倒角部分的发散角小于90度时，垂直于焊盘表面的方向上的超声转换负载的量值极小。换句话说，垂直于焊盘表面的方向上的超声转换负载在量值上充分小于平行于焊盘表面的方向上的超声转换负载。从而，当内倒角部分的发散角小于90度时，可充分地减小垂直于焊盘表面的方向上的超声转换负载的量值，这可防止焊盘剥落。
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公开(公告)号：CN102024724B
公开(公告)日：2015-07-01
申请号：CN201010253727.2
申请日：2010-08-12
Applicant: 瑞萨电子株式会社
IPC: H01L21/607 , H01L23/49
CPC classification number: H01L23/4952 , B23K20/007 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/85 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48455 , H01L2224/48465 , H01L2224/48599 , H01L2224/48664 , H01L2224/48864 , H01L2224/73265 , H01L2224/78268 , H01L2224/78302 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85464 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20753 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/92247
Abstract: 本发明提供一种半导体器件的制造方法以及半导体器件。通过在导线接合的针脚式接合(第二接合)中进行焊针(6e)的高度控制，能够在针脚部(5a)进行其厚度控制，能够通过确保其接合强度来提高接合可靠性。进而，在针脚部(5a)具有壁厚部分(5e)，并且在该壁厚部分(5e)的下部形成有导线(5)与内引线(2a)的接合区域(5b)的一部分(α部)，从而能够充分确保针脚部(5a)的厚度和接合区域(5b)。根据本发明，能够通过在导线接合的针脚式接合中确保其接合强度来提高接合可靠性。
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公开(公告)号：CN101261973B
公开(公告)日：2011-12-21
申请号：CN200810082599.2
申请日：2008-03-05
Applicant: 瑞萨电子株式会社
IPC: H01L23/488 , H01L23/495
CPC classification number: H01L23/49541 , H01L23/49558 , H01L23/60 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2223/6638 , H01L2224/05553 , H01L2224/05599 , H01L2224/48247 , H01L2224/48253 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2924/00
Abstract: 本发明的目的在于得到可防止内部引线的表面摩擦而出现伤痕的半导体装置。在下垫板(13)的周围设置多个内部引线(14)。在下垫板(13)与多个内部引线(14)之间的区域设置有接地的GND引线(16)。半导体芯片(17)与多个内部引线(14)分别被多个导线(21)连接。半导体芯片(17)与GND引线(16)被GND导线(22)连接。GND导线(22)配置在多个导线(21)之间。邻接的内部引线(14)的前端的间隔为0.2mm以下。
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公开(公告)号：CN102779768B
公开(公告)日：2017-03-01
申请号：CN201210153813.5
申请日：2012-05-11
Applicant: 瑞萨电子株式会社
IPC: H01L21/60 , H01L23/488
CPC classification number: H01L24/85 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L2224/0401 , H01L2224/04042 , H01L2224/0508 , H01L2224/05186 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/1134 , H01L2224/13017 , H01L2224/13018 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48451 , H01L2224/48465 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/78304 , H01L2224/78343 , H01L2224/81193 , H01L2224/85181 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01052 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10329 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/05442 , H01L2924/20755 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754 , H01L2924/207
Abstract: 本发明的实施例涉及半导体器件及其制造方法。本发明提供一种能够抑制施加到焊盘的损伤的技术。当内倒角部分的发散角小于90度时，垂直于焊盘表面的方向上的超声转换负载的量值极小。换句话说，垂直于焊盘表面的方向上的超声转换负载在量值上充分小于平行于焊盘表面的方向上的超声转换负载。从而，当内倒角部分的发散角小于90度时，可充分地减小垂直于焊盘表面的方向上的超声转换负载的量值，这可防止焊盘剥落。
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