-
公开(公告)号：CN102024724A
公开(公告)日：2011-04-20
申请号：CN201010253727.2
申请日：2010-08-12
Applicant: 瑞萨电子株式会社
IPC: H01L21/607 , H01L23/49
CPC classification number: H01L23/4952 , B23K20/007 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/85 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48455 , H01L2224/48465 , H01L2224/48599 , H01L2224/48664 , H01L2224/48864 , H01L2224/73265 , H01L2224/78268 , H01L2224/78302 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85464 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20753 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/92247
Abstract: 本发明提供一种半导体器件的制造方法以及半导体器件。通过在导线接合的针脚式接合(第二接合)中进行焊针(6e)的高度控制，能够在针脚部(5a)进行其厚度控制，能够通过确保其接合强度来提高接合可靠性。进而，在针脚部(5a)具有壁厚部分(5e)，并且在该壁厚部分(5e)的下部形成有导线(5)与内引线(2a)的接合区域(5b)的一部分(α部)，从而能够充分确保针脚部(5a)的厚度和接合区域(5b)。根据本发明，能够通过在导线接合的针脚式接合中确保其接合强度来提高接合可靠性。
-
公开(公告)号：CN102779768A
公开(公告)日：2012-11-14
申请号：CN201210153813.5
申请日：2012-05-11
Applicant: 瑞萨电子株式会社
IPC: H01L21/60 , H01L23/488
CPC classification number: H01L24/85 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L2224/0401 , H01L2224/04042 , H01L2224/0508 , H01L2224/05186 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/1134 , H01L2224/13017 , H01L2224/13018 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48451 , H01L2224/48465 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/78304 , H01L2224/78343 , H01L2224/81193 , H01L2224/85181 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01052 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10329 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/05442 , H01L2924/20755 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754 , H01L2924/207
Abstract: 本发明的实施例涉及半导体器件及其制造方法。本发明提供一种能够抑制施加到焊盘的损伤的技术。当内倒角部分的发散角小于90度时，垂直于焊盘表面的方向上的超声转换负载的量值极小。换句话说，垂直于焊盘表面的方向上的超声转换负载在量值上充分小于平行于焊盘表面的方向上的超声转换负载。从而，当内倒角部分的发散角小于90度时，可充分地减小垂直于焊盘表面的方向上的超声转换负载的量值，这可防止焊盘剥落。
-
公开(公告)号：CN102024724B
公开(公告)日：2015-07-01
申请号：CN201010253727.2
申请日：2010-08-12
Applicant: 瑞萨电子株式会社
IPC: H01L21/607 , H01L23/49
CPC classification number: H01L23/4952 , B23K20/007 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/85 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48455 , H01L2224/48465 , H01L2224/48599 , H01L2224/48664 , H01L2224/48864 , H01L2224/73265 , H01L2224/78268 , H01L2224/78302 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85464 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20753 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/92247
Abstract: 本发明提供一种半导体器件的制造方法以及半导体器件。通过在导线接合的针脚式接合(第二接合)中进行焊针(6e)的高度控制，能够在针脚部(5a)进行其厚度控制，能够通过确保其接合强度来提高接合可靠性。进而，在针脚部(5a)具有壁厚部分(5e)，并且在该壁厚部分(5e)的下部形成有导线(5)与内引线(2a)的接合区域(5b)的一部分(α部)，从而能够充分确保针脚部(5a)的厚度和接合区域(5b)。根据本发明，能够通过在导线接合的针脚式接合中确保其接合强度来提高接合可靠性。
-
公开(公告)号：CN102779768B
公开(公告)日：2017-03-01
申请号：CN201210153813.5
申请日：2012-05-11
Applicant: 瑞萨电子株式会社
IPC: H01L21/60 , H01L23/488
CPC classification number: H01L24/85 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L2224/0401 , H01L2224/04042 , H01L2224/0508 , H01L2224/05186 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/1134 , H01L2224/13017 , H01L2224/13018 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48451 , H01L2224/48465 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/78304 , H01L2224/78343 , H01L2224/81193 , H01L2224/85181 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01052 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10329 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/05442 , H01L2924/20755 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754 , H01L2924/207
Abstract: 本发明的实施例涉及半导体器件及其制造方法。本发明提供一种能够抑制施加到焊盘的损伤的技术。当内倒角部分的发散角小于90度时，垂直于焊盘表面的方向上的超声转换负载的量值极小。换句话说，垂直于焊盘表面的方向上的超声转换负载在量值上充分小于平行于焊盘表面的方向上的超声转换负载。从而，当内倒角部分的发散角小于90度时，可充分地减小垂直于焊盘表面的方向上的超声转换负载的量值，这可防止焊盘剥落。
-
-
-
Search Results
4
records
(took 0.03 seconds)
