-
公开(公告)号：US12189000B2
公开(公告)日：2025-01-07
申请号：US18158826
申请日：2023-01-24
Applicant: Infineon Technologies AG
Inventor： Gernot Binder , Christoph Krall
Abstract: A magnetic field sensor includes a first sensor bridge circuit including a first plurality of magnetic field sensor elements and a second plurality of magnetic field sensor elements, wherein the first plurality of magnetic field sensor elements are positioned symmetrical to the second plurality of magnetic field sensor elements across a center of symmetry, wherein the first and the second pluralities of magnetic field sensor elements are separated by a first sensor pitch; and a second sensor bridge circuit including a third plurality of magnetic field sensor elements and a fourth plurality of magnetic field sensor elements, wherein the third plurality of magnetic field sensor elements are positioned symmetrical to the fourth plurality of magnetic field sensor elements across the center of symmetry, wherein the third and the fourth pluralities of magnetic field sensor elements are separated by a second sensor pitch that is equal to the first sensor pitch.
-
公开(公告)号：US12055615B2
公开(公告)日：2024-08-06
申请号：US17438471
申请日：2020-03-05
Applicant: NIDEC READ CORPORATION
Inventor： Tatsufumi Kusuda
CPC classification number: G01R35/00 , G01F25/10 , G01R33/063 , G01T1/2018
Abstract: A detection value correction system is a detection value correction system that corrects detection values of a plurality of sensors that are arranged in a line and detect a physical quantity, and includes a correction processing unit that corrects a detection value of a target sensor, which is a sensor to be corrected, among the sensors based on at least detection values of sensors adjacent to the target sensor.
-
3.发明公开公开(公告)号：US20240219487A1
公开(公告)日：2024-07-04
申请号：US18392424
申请日：2023-12-21
Applicant: Melexis Technologies SA
Inventor： Guido DUPONT , Daniel ROSENFELD , Lionel TOMBEZ , Bruno BRAJON , Appo VAN DER WIEL,
CPC classification number: G01R33/063 , G01R33/0052 , G01R33/0076 , G01R33/072
Abstract: A sensor device including a semiconductor substrate having an excitation circuit and a sensing circuit for measuring a magneto-impedance effect of a soft-magnetic component arranged on top of the semiconductor substrate. The soft-magnetic component is operatively connected to the excitation circuit and the sensing circuit, and is electrically connected to at least one of the excitation circuit and the sensing circuit by means of back contacts or side contacts. The soft-magnetic component has an elongated shape or an elongated portion extending in a first direction parallel to the semiconductor substrate; a processing circuit connected to the sensing circuit, and configured for providing a signal indicative of the measured impedance or a value derived therefrom. A method is provided for producing such a semiconductor substrate.
-
公开(公告)号：US11961920B2
公开(公告)日：2024-04-16
申请号：US18307057
申请日：2023-04-26
Applicant: Allegro MicroSystems, LLC
Inventor： Ravi Vig , William P. Taylor , Paul A. David , P. Karl Scheller , Andreas P. Friedrich
CPC classification number: H01L29/82 , G01D5/147 , G01R33/0047 , G01R33/0052 , G01R33/06 , G01R15/207 , H01L2224/45147 , H01L2224/48247 , H01L2924/00011 , H01L2224/45147 , H01L2924/00 , H01L2924/00011 , H01L2924/01033
Abstract: An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.
-
公开(公告)号：US11940503B2
公开(公告)日：2024-03-26
申请号：US17375367
申请日：2021-07-14
Applicant: SHOWA DENKO K.K.
Inventor： Tatsunori Shino
IPC: G01R33/06
CPC classification number: G01R33/063
Abstract: A magnetic sensor circuit includes: a first element including series-connected resistor and capacitor, or including only a capacitor; a second element including series-connected resistor and inductor, or including a magnetic sensor sensing a magnetic field by a magnetic impedance effect; a third element including series-connected resistor and capacitor, or including only a capacitor; and a fourth element including a magnetic sensor sensing a magnetic field by a magnetic impedance effect, wherein a first series circuit part including the series-connected first and second elements and a second series circuit part including the series-connected third and fourth elements are connected in parallel, and, when the magnetic field sensed by the magnetic sensor has a predetermined reference value, a product of impedance Z1 of the first element and impedance Z4 of the fourth element and a product of impedance Z2 of the second element and impedance Z3 of the third element are equal.
-
Patent Agency Ranking
公开(公告)号：US11940303B2
公开(公告)日：2024-03-26
申请号：US16489029
申请日：2018-03-01
Applicant: SONY CORPORATION
Inventor： Tetsuya Narita , Masahiro Fujita
CPC classification number: G01D5/24419 , G01B7/30 , G01D5/2455 , G01R33/06 , G01D5/34794
Abstract: There is provided a position detection device to suppress an influence of a signal distortion due to a processing error or the like, the position detection device including: a reference position calculation unit that calculates a reference position of a moving body on the basis of a first signal and a second signal, the first signal being detected from a first track provided on the moving body and having a scale of predetermined cycles, and the second signal being detected from a second track provided on the moving body and having a scale of cycles less than the predetermined cycles; a slit specifying unit that specifies a slit corresponding to a position of the moving body; an in-slit position calculation unit that calculates an in-slit position of the moving body in the specified slit; and a correction unit that corrects an absolute position of the moving body.
-
公开(公告)号：US20240061053A1
公开(公告)日：2024-02-22
申请号：US18386351
申请日：2023-11-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yasuhide TAKASE
CPC classification number: G01R33/0082 , G01R33/06
Abstract: A sensor device includes a bridge circuit, a bias circuit, and a detection signal receiving circuit. The bridge circuit includes four sensor elements connected in a bridge. The bias circuit includes an oscillation circuit and an averaging circuit. The oscillation circuit outputs an oscillation signal, in which an output voltage in a first output state and an output voltage in a second output state with temperature dependency repeat alternately at a predetermined ratio. The averaging circuit averages the output voltage of the oscillation circuit and applies the averaged output voltage as a bias voltage to a bias end of the bridge circuit. By applying this voltage, the bias circuit excites the bridge circuit and compensates for a temperature characteristic of the sensitivity by offsetting a temperature fluctuation due to a temperature change in its sensitivity.
-
8.发明授权公开(公告)号：US11894475B2
公开(公告)日：2024-02-06
申请号：US17167318
申请日：2021-02-04
Applicant: Pierre Gandolfo
Inventor： Pierre Gandolfo
IPC: G01R33/06 , H01L31/0352 , G01S13/02 , G06N10/00 , G01S7/03
CPC classification number: H01L31/035218 , G01R33/066 , G01S7/032 , G01S13/02 , G06N10/00
Abstract: Embodiments of the present disclosure provide a spin-qubit quantum magnetometer and radar apparatus, entirely implemented in silicon and with full electrical control. By default, each detection element of the silicon-based spin-qubit quantum magnetometer and radar apparatus with full electrical control of the invention is built around a Field Effect Transistor (FET) on silicon over insulator with a back-gate as well as two front gates, which can be adjacent to one another along the Drain-Source FET channel or alternatively placed across that same channel and facing each other as corner gates.
-
公开(公告)号：US11733317B2
公开(公告)日：2023-08-22
申请号：US17735185
申请日：2022-05-03
Applicant: EVERSPIN TECHNOLOGIES, INC.
Inventor： Bradley Neal Engel , Phillip G. Mather
CPC classification number: G01R33/0029 , G01R33/06 , G01R33/09 , G01R33/098
Abstract: A chopping technique, and associated structure, is implemented to cancel the magnetic 1/f noise contribution in a Tunneling Magnetoresistance (TMR) field sensor. The TMR field sensor includes a first bridge circuit including multiple TMR elements to sense a magnetic field and a second circuit to apply a bipolar current pulse adjacent to each TMR element. The current lines are serially or sequentially connected to a current source to receive the bipolar current pulse. The field sensor has an output including a high output and a low output in response to the bipolar pulse. This asymmetric response allows a chopping technique for 1/f noise reduction in the field sensor.
-
公开(公告)号：US20230261118A1
公开(公告)日：2023-08-17
申请号：US18307057
申请日：2023-04-26
Applicant: Allegro MicroSystems, LLC
Inventor： Ravi Vig , William P. Taylor , Paul A. David , P. Karl Scheller , Andreas P. Friedrich
CPC classification number: H01L29/82 , G01R33/06 , G01R33/0047 , G01R33/0052 , G01D5/147 , H01L2924/00011 , H01L2224/48247 , G01R15/207
Abstract: An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.
-
-
-
-
-
-
-
-
-
Search Results
1025
records
(took 0.049 seconds)
