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1.发明授权公开(公告)号：US11677032B2
公开(公告)日：2023-06-13
申请号：US17806758
申请日：2022-06-14
CPC分类号： H01L29/82 , G01D5/147 , G01R33/0047 , G01R33/0052 , G01R33/06 , G01R15/207 , H01L2224/45147 , H01L2224/48247 , H01L2924/00011 , H01L2224/45147 , H01L2924/00 , H01L2924/00011 , H01L2924/01033
摘要： A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.
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公开(公告)号：US20190049527A1
公开(公告)日：2019-02-14
申请号：US16165464
申请日：2018-10-19
发明人： Ravi Vig , William P. Taylor , Andreas P. Friedrich , Paul A. David , Marie-Adelaide Lo , Eric Burdette , Eric G. Shoemaker , Michael C. Doogue
摘要： A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.
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公开(公告)号：US20180224300A1
公开(公告)日：2018-08-09
申请号：US15945085
申请日：2018-04-04
发明人： Ravi Vig , Paul A. David , Eric G. Shoemaker
IPC分类号： G01D5/14
摘要： Magnetic field sensors can sense speed of movement and direction of movement of a ferromagnetic object. The magnetic field sensors employ both planar Hall effect elements and vertical Hall effect elements to generate two-state signals in two different signal paths with relative phases that are ninety degrees apart, the ninety degrees having sufficient margin to aid in detection of the direction of motion. Other magnetic field sensors use at least four vertical Hall effect elements to identify a speed of rotation and a direction of rotation of a moving ferromagnetic object.
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公开(公告)号：US20170356759A1
公开(公告)日：2017-12-14
申请号：US15176645
申请日：2016-06-08
发明人： Paul A. David , Ravi Vig
摘要： A back-biased magnetic field sensor uses one or more magnetic field sensing elements upon a substrate, each outside of a substrate region in which magnetic field lines are near perpendicular to the substrate and outside of which magnetic field lines are not to the substrate. The back-biased magnetic field sensor can sense an approaching and/or a retreating ferromagnetic object.
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公开(公告)号：US08994369B2
公开(公告)日：2015-03-31
申请号：US14093815
申请日：2013-12-02
发明人： Ravi Vig , P. Karl Scheller , Paul A. David
CPC分类号： G01P3/44 , G01D5/142 , G01P3/488 , G01P3/489 , G01P13/045 , G01R33/0041 , G01R33/07
摘要： An apparatus and a method provide an output signal indicative of a speed of rotation and a direction of rotation of a ferromagnetic object capable of rotating. A variety of signal formats of the output signal are described.
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公开(公告)号：US20140084903A1
公开(公告)日：2014-03-27
申请号：US14093787
申请日：2013-12-02
发明人： Ravi Vig , P. Karl Scheller , Paul A. David
CPC分类号： G01P3/44 , G01D5/142 , G01P3/488 , G01P3/489 , G01P13/045 , G01R33/0041 , G01R33/07
摘要： An apparatus and a method provide an output signal indicative of a speed of rotation and a direction of rotation of a ferromagnetic object capable of rotating. A variety of signal formats of the output signal are described.
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公开(公告)号：US11961920B2
公开(公告)日：2024-04-16
申请号：US18307057
申请日：2023-04-26
CPC分类号： H01L29/82 , G01D5/147 , G01R33/0047 , G01R33/0052 , G01R33/06 , G01R15/207 , H01L2224/45147 , H01L2224/48247 , H01L2924/00011 , H01L2224/45147 , H01L2924/00 , H01L2924/00011 , H01L2924/01033
摘要： An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.
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公开(公告)号：US20230261118A1
公开(公告)日：2023-08-17
申请号：US18307057
申请日：2023-04-26
CPC分类号： H01L29/82 , G01R33/06 , G01R33/0047 , G01R33/0052 , G01D5/147 , H01L2924/00011 , H01L2224/48247 , G01R15/207
摘要： An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.
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公开(公告)号：US20220310853A1
公开(公告)日：2022-09-29
申请号：US17806758
申请日：2022-06-14
摘要： A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.
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公开(公告)号：US20170278981A1
公开(公告)日：2017-09-28
申请号：US15618251
申请日：2017-06-09
CPC分类号： H01L29/82 , G01D5/147 , G01R33/0047 , G01R33/0052 , G01R33/06 , H01L2224/45147 , H01L2224/48247 , H01L2924/00011 , H01L2924/00 , H01L2924/01033
摘要： A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.
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