Length measurement device
    2.
    发明授权

    公开(公告)号:US10760895B2

    公开(公告)日:2020-09-01

    申请号:US16335267

    申请日:2017-09-26

    Inventor: Tatsufumi Kusuda

    Abstract: A length measurement device includes: a placement table; cameras imaging images of imaging ranges including target points; first marks within the imaging ranges; a reference position storage unit storing positions of the first marks on a placement surface as first mark reference positions; an image position acquisition unit acquiring, on the basis of the imaged images of the cameras, the target image positions of the target points in the imaged images and the first mark image positions of the first marks in the imaged images; a target position acquisition unit determining positions of the target points on the placement surface on the basis of the target image positions and first mark image positions in the imaged images and the first mark reference positions on the placement surface; and a length acquisition unit determining, on the basis of positions of the target points, the length of a portion to have the length thereof measured.

    Coiled electronic component
    3.
    发明授权

    公开(公告)号:US11830670B2

    公开(公告)日:2023-11-28

    申请号:US17985134

    申请日:2022-11-10

    Inventor: Tatsufumi Kusuda

    Abstract: A coiled electronic component includes: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions arranged on both ends of the coil portion; and a pair of electrodes for respectively connecting the electrically conductive connection portions to assembly portions arranged on an assembly object. The electrode includes a pair of pinching pieces for pinching the electrically conductive connection portion, and the pair of pinching pieces is opened in a manner that the electrically conductive connection portion is received and fitted therebetween.

    MI sensor and method for manufacturing MI sensor

    公开(公告)号:US11953562B2

    公开(公告)日:2024-04-09

    申请号:US17043768

    申请日:2019-05-21

    Inventor: Tatsufumi Kusuda

    CPC classification number: G01R33/063 H01F27/28 H01F41/04

    Abstract: An MI sensor includes: an amorphous wire; an insulator layer formed on an outer peripheral surface of the amorphous wire; and an X-axis coil, a Y-axis coil, and a Z-axis coil which are formed, in a spiral shape, on an outer peripheral surface of the insulator layer. The X-axis coil, the Y-axis coil, and the Z-axis coil are formed of a conductive layer, and the X-axis coil, the Y-axis coil, and the Z-axis coil are arranged in directions orthogonal to each other.

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