公开(公告)号：US11760876B2

公开(公告)日：2023-09-19

申请号：US17513979

申请日：2021-10-29

申请人： Elite Material Co., Ltd.

发明人： Chen-Yu Hsieh ,  Chih-Wei Lin ,  Ching Lo

IPC分类号： C08L85/02 ,  C08L79/08 ,  C08L71/12 ,  C08L25/10 ,  C08J5/24 ,  B32B27/18 ,  B32B5/08 ,  C08L71/00 ,  C09J7/30 ,  C09J171/00 ,  B32B5/02 ,  B32B15/14 ,  B32B5/26 ,  B32B15/20

CPC分类号： C08L71/00 ,  B32B5/024 ,  B32B5/263 ,  B32B15/14 ,  B32B15/20 ,  C08J5/244 ,  C09J7/30 ,  C09J171/00 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/3065 ,  B32B2307/7265 ,  B32B2457/08 ,  C08J2371/12 ,  C08J2409/00 ,  C08J2409/06 ,  C08J2479/08 ,  C09J2400/14 ,  C09J2400/163 ,  C09J2423/00 ,  C09J2471/00 ,  C09J2479/08

摘要： A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

公开(公告)号：US20230257633A1

公开(公告)日：2023-08-17

申请号：US18140948

申请日：2023-04-28

申请人： Zephyros, Inc.

发明人： Michael Czaplicki

IPC分类号： C09J5/06 ,  C09J163/00 ,  C08G59/18 ,  C09J171/00

CPC分类号： C09J5/06 ,  C09J163/00 ,  C08G59/186 ,  C09J171/00 ,  C08L71/00

摘要： An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.

公开(公告)号：US11574835B2

公开(公告)日：2023-02-07

申请号：US16670023

申请日：2019-10-31

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC分类号： H01L21/683 ,  C08G59/06 ,  C09J163/00 ,  C09J171/00 ,  C08L63/00 ,  C08L71/00 ,  H01L21/02 ,  C08K3/04 ,  C09J9/00

摘要： A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

公开(公告)号：US20220411672A1

公开(公告)日：2022-12-29

申请号：US17894724

申请日：2022-08-24

申请人： Seal Bond, Inc.

发明人： Patrick H. Young ,  Nathaniel P. Stoller

IPC分类号： C09J9/00 ,  C09J167/00 ,  E04D5/14 ,  C09J175/04 ,  C09J171/00 ,  C08G65/336 ,  C08G63/695 ,  C08G18/83

摘要： A moisture curable, non-bitumen based and non-asphaltic based adhesive includes an extender, a compatibilizer, and a polymer, wherein the polymer includes reactive silyl groups.

公开(公告)号：US20220139864A1

公开(公告)日：2022-05-05

申请号：US17647903

申请日：2022-01-13

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Norzafriza NITTA ,  Hidemichi FUJIWARA ,  Yoshihiro SATO

IPC分类号： H01L23/00 ,  C09J9/02 ,  C09J11/04 ,  C09J101/02 ,  C09J171/00 ,  C09J7/38 ,  H01L21/683

摘要： A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.

公开(公告)号：US10966317B2

公开(公告)日：2021-03-30

申请号：US16209518

申请日：2018-12-04

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Takatoshi Abe ,  Tomoaki Sawada ,  Shingo Yoshioka

IPC分类号： H05K1/03 ,  H05K1/02 ,  C09J171/00 ,  H05K1/18 ,  H05K3/00

摘要： A sheet-shaped stretchable structure including stretchable resin sheets laminated together is provided. A conductive layer may be disposed at least at one of several positions. For example, the conductive layer may be disposed between any two adjacent ones of the laminated stretchable resin sheets. The conductive layer may be disposed on a top surface of an uppermost one of the laminated stretchable resin sheets. Further, the conductive layer may be disposed on a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole.

公开(公告)号：US20210087442A1

公开(公告)日：2021-03-25

申请号：US16956393

申请日：2019-02-05

申请人： THREEBOND CO., LTD.

发明人： Kentaro WATANABE

IPC分类号： C09J171/00 ,  C09J5/00 ,  C09J11/04 ,  C09K5/14 ,  H05K7/20

摘要： The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing.
The thermally conductive moisture-curable resin composition contains the following components (A) to (C): component (A): an organic polymer containing two or more hydrolyzable silyl groups; component (B): a thermally conductive filler; and component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.

公开(公告)号：US10577522B2

公开(公告)日：2020-03-03

申请号：US14907160

申请日：2014-07-25

申请人： Zephyros, Inc.

发明人： Michel Awkal ,  Morgan Chene

IPC分类号： C09J7/00 ,  C09J163/00 ,  C09J171/00 ,  C09J5/00 ,  C08J5/12

摘要： Flexible films comprise an adhesive layer and a fibrous supporting layer and the thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates where they can reduce the formation of galvanic corrosion.

公开(公告)号：US20190264080A1

公开(公告)日：2019-08-29

申请号：US16411192

申请日：2019-05-14

申请人： Hilti Aktiengesellschaft

发明人： Frank Thiemann ,  Juliane Marauska

IPC分类号： C09J183/04 ,  C09D201/10 ,  C09D175/08 ,  C08G18/83 ,  C08G65/336 ,  C09D183/04 ,  C09D5/18 ,  C09D171/00 ,  C09J9/00 ,  C09J11/04 ,  C09J133/08 ,  C09J171/00 ,  C09D133/08

摘要： A composition forming an insulating layer is described, whereby a binder based on an alkoxysilane-functionalized polymer carries the alkoxy-functionalized silane group, containing water and an insulation layer-forming additive. The composition according to the invention results in a relatively high expansion rate, enabling coatings to be applied to achieve the layer thickness required for the respective fire resistance duration in a simple and rapid manner, whereby the layer thickness is reduced to a minimum but offers significant insulating effect. The composition according to the invention is particularly suitable for fire protection, especially for the coating of steel components, such as columns, beams, frame members, in order to increase the fire resistance duration.

公开(公告)号：US10364349B1

公开(公告)日：2019-07-30

申请号：US15599597

申请日：2017-05-19

申请人： Arkema Inc.

发明人： Christopher A. Bertelo ,  Gregory S. O'Brien

IPC分类号： B32B7/14 ,  B32B17/06 ,  B32B27/06 ,  C08L71/00 ,  C09J171/00 ,  B32B27/28 ,  B32B27/36 ,  B32B5/02 ,  B32B9/00 ,  B32B9/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/34

CPC分类号： C08L71/00 ,  B32B5/02 ,  B32B7/14 ,  B32B9/005 ,  B32B9/045 ,  B32B15/08 ,  B32B15/20 ,  B32B17/06 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/26 ,  B32B2262/101 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/702 ,  B32B2307/704 ,  B32B2405/00 ,  B32B2419/00 ,  B32B2439/00 ,  B32B2535/00 ,  B32B2597/00 ,  B32B2605/00 ,  C08G2650/40 ,  C09J171/00 ,  Y10T428/26 ,  Y10T428/31645 ,  Y10T428/31692 ,  Y10T428/31855

摘要： Tie layers comprised of amorphous polyetherketoneketone are used to join substrates to form laminates and other assemblies.