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公开(公告)号：US10966317B2
公开(公告)日：2021-03-30
申请号：US16209518
申请日：2018-12-04
发明人： Takatoshi Abe , Tomoaki Sawada , Shingo Yoshioka
IPC分类号： H05K1/03 , H05K1/02 , C09J171/00 , H05K1/18 , H05K3/00
摘要： A sheet-shaped stretchable structure including stretchable resin sheets laminated together is provided. A conductive layer may be disposed at least at one of several positions. For example, the conductive layer may be disposed between any two adjacent ones of the laminated stretchable resin sheets. The conductive layer may be disposed on a top surface of an uppermost one of the laminated stretchable resin sheets. Further, the conductive layer may be disposed on a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole.
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公开(公告)号：US09839119B2
公开(公告)日：2017-12-05
申请号：US14405533
申请日：2014-10-08
发明人： Tomoaki Sawada , Shingo Yoshioka , Takatoshi Abe
IPC分类号： G06F3/041 , H01B1/24 , H01L31/0224 , H05K1/02 , H05K1/03 , C08J5/18 , C08K7/02 , C08L101/00 , H01B1/02 , C08J7/04 , C09D105/16 , B32B5/02 , C09D163/00 , B32B15/092 , B32B15/08 , B32B3/12 , B32B3/26
CPC分类号： H05K1/0271 , B32B3/12 , B32B3/266 , B32B5/02 , B32B15/08 , B32B15/092 , B32B2260/021 , B32B2260/046 , B32B2262/103 , B32B2262/106 , B32B2262/14 , B32B2307/202 , B32B2307/412 , B32B2307/50 , B32B2363/00 , C08J5/18 , C08J7/047 , C08J2300/21 , C08J2367/02 , C08J2400/21 , C08J2463/00 , C08K7/02 , C08L101/00 , C09D105/16 , C09D163/00 , G06F3/041 , H01B1/02 , H01B1/24 , H01L31/022466 , H01L31/022491 , H05K1/0213 , H05K1/0274 , H05K1/028 , H05K1/0296 , H05K1/0326 , H05K1/0333 , H05K1/0366 , H05K2201/0108 , H05K2201/012 , H05K2201/0323 , H05K2201/0326 , Y10T428/24331 , Y10T428/24917 , C08L63/00
摘要： The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate (alpha), as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
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公开(公告)号：US09802397B2
公开(公告)日：2017-10-31
申请号：US14925048
申请日：2015-10-28
发明人： Takatoshi Abe , Tomoaki Sawada , Shingo Yoshioka
IPC分类号： B32B27/36 , C08L71/02 , B32B3/08 , C08G59/24 , C08G59/56 , B32B27/38 , C08L3/02 , C08L63/00 , B32B7/04 , B32B27/08 , B32B27/20 , B32B3/30
CPC分类号： B32B27/36 , B32B3/08 , B32B3/30 , B32B7/045 , B32B27/08 , B32B27/20 , B32B27/38 , B32B2305/77 , B32B2307/202 , B32B2307/21 , B32B2307/50 , B32B2307/51 , B32B2307/546 , B32B2307/552 , B32B2307/734 , B32B2457/00 , B32B2457/20 , B32B2571/00 , C08G59/245 , C08G59/56 , C08L63/00 , C08L71/02 , C08L87/00
摘要： Provided is a structural member for electronic devices which uses a material that is flexible and has excellent restoration properties after extension and stress relaxation properties. The structural member for electronic devices has the following properties A and B: (Property A) In a case where predetermined deformation is applied, stress that applies the deformation is relaxed (reduced) with time: and (Property B) In a case where the stress that applies deformation is 0, the deformation rarely remains while a resin composition is recovered. That is, when stress is 0, residual strain substantially becomes 0 (specifically 3% or lower).
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4.发明授权Dry film for optical waveguides, optical waveguide using same, photoelectric composite wiring board using same, and method for producing photoelectric composite wiring board 有权用于光波导的干膜，使用其的光波导，使用该光波导的光电复合布线板以及用于制造光电复合布线板的方法公开(公告)号：US09568673B2
公开(公告)日：2017-02-14
申请号：US14764721
申请日：2013-12-03
CPC分类号： G02B6/122 , G02B1/12 , G02B6/1221 , G02B6/132 , G02B6/138
摘要： The present invention relates to a dry film for optical waveguides, obtained through sequential stacking of a carrier film, a plating adhesion layer, an uncured cladding layer and a cover film. Solid microparticles are dispersed in a resin composition that constitutes the plating adhesion layer.
摘要翻译： 本发明涉及通过载体膜，电镀粘附层，未固化覆层和覆盖膜的顺序层叠获得的用于光波导的干膜。 固体微粒分散在构成电镀粘附层的树脂组合物中。
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公开(公告)号：US09468092B2
公开(公告)日：2016-10-11
申请号：US14405572
申请日：2014-10-08
发明人： Tomoaki Sawada , Shingo Yoshioka , Takatoshi Abe
IPC分类号： B32B3/12 , B32B3/24 , B32B15/08 , B32B15/092 , G06F3/041 , H01B1/02 , H01L31/0224 , H05K1/03 , H05K1/02 , C08J5/18 , C08K7/02 , C08L101/00 , C08J7/04 , C09D105/16 , B32B3/26
CPC分类号： H05K1/0271 , B32B3/12 , B32B3/266 , B32B5/02 , B32B15/08 , B32B15/092 , B32B2260/021 , B32B2260/046 , B32B2262/103 , B32B2262/106 , B32B2262/14 , B32B2307/202 , B32B2307/412 , B32B2307/50 , B32B2363/00 , C08J5/18 , C08J7/047 , C08J2300/21 , C08J2367/02 , C08J2400/21 , C08J2463/00 , C08K7/02 , C08L101/00 , C09D105/16 , C09D163/00 , G06F3/041 , H01B1/02 , H01B1/24 , H01L31/022466 , H01L31/022491 , H05K1/0213 , H05K1/0274 , H05K1/028 , H05K1/0296 , H05K1/0326 , H05K1/0333 , H05K1/0366 , H05K2201/0108 , H05K2201/012 , H05K2201/0323 , H05K2201/0326 , Y10T428/24331 , Y10T428/24917 , C08L63/00
摘要： The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate α, as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
摘要翻译： 本发明涉及一种导电膜，其特征在于能够进行弹性变形，几乎没有残余应变率和显示应力松弛性能。 更具体地说，本发明涉及一种导电膜，其中在规定的延伸恢复试验中测量的应力松弛率（R）和残余应变速率α如下：20％≤R≤95％和0 ％≤α≤3％。
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公开(公告)号：US10791624B2
公开(公告)日：2020-09-29
申请号：US15980245
申请日：2018-05-15
发明人： Tomoaki Sawada , Takatoshi Abe , Shingo Yoshioka
IPC分类号： H05K1/02 , C08J5/18 , C08K7/02 , C08L101/00 , C09D105/16 , C08J7/04 , G06F3/041 , H01B1/02 , H01L31/0224 , H05K1/03 , B32B5/02 , H01B1/24 , C09D163/00 , B32B15/092 , B32B15/08 , B32B3/12 , B32B3/26
摘要： The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate (α), as measured in a prescribed extension-restoration test, are as follows: 20%≤R≤95% and 0%≤α≤3%.
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公开(公告)号：US10371612B2
公开(公告)日：2019-08-06
申请号：US15757002
申请日：2016-09-09
IPC分类号： B32B5/28 , C08J5/24 , G01N3/18 , H05K1/02 , H05K1/03 , H05K3/06 , B32B15/08 , B32B37/10 , B32B38/00
摘要： A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.
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公开(公告)号：US10299379B2
公开(公告)日：2019-05-21
申请号：US14944338
申请日：2015-11-18
发明人： Takatoshi Abe , Tomoaki Sawada , Shingo Yoshioka
IPC分类号： H05K1/02 , H05K1/03 , H05K1/18 , H05K3/00 , C09J171/00
摘要： A sheet-shaped stretchable structure used as an electronics element has a stretch of not less than 10% and includes a plurality of laminated stretchable resin sheet, and at least one hollow is provided between at least one of pairs of two adjacent ones of the laminated stretchable resin sheets.
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公开(公告)号：US10109390B2
公开(公告)日：2018-10-23
申请号：US15447039
申请日：2017-03-01
发明人： Tomoaki Sawada , Takatoshi Abe , Shingo Yoshioka
IPC分类号： H01B5/14 , H01B1/24 , B32B27/12 , B32B27/36 , B32B27/06 , H01L31/0392 , H01L31/0224 , H03K17/96
摘要： A conductive film includes a film substrate and a conductive layer formed on at least one surface of the film substrate. The film substrate and the conductive film have elongation of 10% or more. Ten-point average roughness Rz of the surface of the film substrate on at least a conductive layer side is 0.05 to 0.5 μm, and an average interval Sm of unevenness is 0.1 to 1 μm.
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10.发明授权Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board 有权树脂组合物，树脂清漆，预浸料，金属包覆层压板和印刷线路板公开(公告)号：US09585248B2
公开(公告)日：2017-02-28
申请号：US14988085
申请日：2016-01-05
发明人： Hiroharu Inoue , Shingo Yoshioka
IPC分类号： B32B15/08 , B32B15/09 , B32B15/092 , B32B15/098 , B32B27/04 , C09J163/00 , H05K1/03 , C08L63/00 , C08J5/24 , C08L79/08 , C09D163/00 , C09D179/08 , C08G59/24 , C08G59/62
CPC分类号： H05K1/0373 , B32B2311/00 , B32B2457/08 , C08G59/245 , C08G59/621 , C08J5/24 , C08J2363/00 , C08J2379/08 , C08J2433/00 , C08L63/00 , C08L79/08 , C08L2203/20 , C08L2205/03 , C09D163/00 , C09D179/08 , H05K1/0346 , H05K1/0353 , H05K1/0366 , H05K2201/0162 , H05K2201/09136 , Y10T156/10 , Y10T428/31529 , C08L33/08
摘要： A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.
摘要翻译： 通过以999μm/分钟拉伸，当应变量从0％增加到0.3％时，成为表现出力响应性能使得由拉伸应力 - 应变曲线f1（x）包围的面积的固化产物的树脂组合物 而当x轴上的应变量和y轴上的拉伸应力也被x轴包围时，大于应变应变曲线f2（x）所包围的面积，当应变量减小时 0.3％，并且在施加拉伸应力之前和之后，由x轴包围，拉伸应力为0时的应变量的变化量为0.05％以下。
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