发明授权
US09585248B2 Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board
有权
树脂组合物,树脂清漆,预浸料,金属包覆层压板和印刷线路板
- 专利标题: Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board
- 专利标题(中): 树脂组合物,树脂清漆,预浸料,金属包覆层压板和印刷线路板
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申请号: US14988085申请日: 2016-01-05
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公开(公告)号: US09585248B2公开(公告)日: 2017-02-28
- 发明人: Hiroharu Inoue , Shingo Yoshioka
- 申请人: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 申请人地址: JP Osaka
- 专利权人: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人地址: JP Osaka
- 代理机构: Greenblum & Bernstein, P.L.C.
- 优先权: JP2013-160215 20130801; JP2013-219022 20131022
- 主分类号: B32B15/08
- IPC分类号: B32B15/08 ; B32B15/09 ; B32B15/092 ; B32B15/098 ; B32B27/04 ; C09J163/00 ; H05K1/03 ; C08L63/00 ; C08J5/24 ; C08L79/08 ; C09D163/00 ; C09D179/08 ; C08G59/24 ; C08G59/62
摘要:
A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.
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