发明授权
US09585248B2 Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board 有权
树脂组合物,树脂清漆,预浸料,金属包覆层压板和印刷线路板

Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board
摘要:
A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.
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