公开(公告)号：US06750430B2

公开(公告)日：2004-06-15

申请号：US10280393

申请日：2002-10-25

申请人： Thomas Joseph Kelly

发明人： Thomas Joseph Kelly

IPC分类号： B23K3534

CPC分类号： B23K35/3033 ,  B21C37/042 ,  B23K35/0266 ,  B23K35/406

摘要： An article is made by preparing an elongated preform having a net metallic composition, and including a tubular sheath made of a sheath nickel-base alloy, and a core disposed within the tubular sheath and including consolidated powder particles made of a core nickel-base alloy. The net metallic composition is preferably a nickel-base superalloy, and most preferably a high-gamma-prime nickel-base superalloy. The preform is wire drawn to a final maximum transverse size that is less than the initial maximum transverse size, to produce a drawn article. The drawn article may be used as a weld filler material.

摘要翻译： 通过制备具有净金属组合​​物的细长预制件制成制品，并且包括由护套镍基合金制成的管状护套和设置在管状护套内的芯，并且包括由芯镍基合金制成的固结粉末颗粒 。 净金属组合​​物优选为镍基超级合金，最优选为高γ值镍基超级合金。 预成型件被拉丝至小于初始最大横向尺寸的最终最大横向尺寸，以产生拉制制品。 拉伸制品可用作焊接填料。

公开(公告)号：US06573476B2

公开(公告)日：2003-06-03

申请号：US09960369

申请日：2001-09-24

申请人： Jongwon Kim ,  Chulgyu Park

发明人： Jongwon Kim ,  Chulgyu Park

IPC分类号： B23K3534

CPC分类号： B23K35/368 ,  B23K35/3608

摘要： The flux cored wire comprises, with respect to the total weight of the wire, a Ti and a Ti oxide of 3.0 wt % to 8.0 wt % as calculated in terms of TiO2 content, a Si and a Si oxide of 0.5 wt % to 2.0 wt % as calculated in terms of SiO2 content, a metal Mn and an alloy of Mn of 1.5 wt % to 3.5 wt % as calculated in terms of Mn content, a carbon (C) of 0.02 wt % to 0.10 wt %, an Mg and an Mg oxide of 0.5 wt % to 1.5 wt % as calculated in terms of MgO content, a compound of Na2O and K2O of 0.2 wt % and less, a Zr and a Zr oxide of 0.1 wt % to 0.5 wt % as calculated in terms of ZrO2 content, and an Al and an Al oxide of 0.2 wt % to 0.8 wt % as calculated in terms of Al2O3 content.

摘要翻译： 药芯焊丝相对于导线的总重量包含以TiO 2含量计算的3.0重量％至8.0重量％的Ti和Ti氧化物，0.5重量％至2.0重量％的Si和Si氧化物 以Mn含量计算的Mn含量为1.5重量％〜3.5重量％的Mn的金属Mn和合金，碳量（C）为0.02重量％〜0.10重量％，Mg 和按MgO​​计算的0.5重量％〜1.5重量％的Mg氧化物，Na2O和K2O的化合物为0.2重量％以下，Zr和Zr氧化物为0.1重量％〜0.5重量％，计算公式如下： 以ZrO 2含量计，以Al 2 O 3含量计算的Al和Al氧化物为0.2重量％〜0.8重量％。

公开(公告)号：US06562147B2

公开(公告)日：2003-05-13

申请号：US09820921

申请日：2001-03-30

申请人： Toshihiro Miyake ,  Koii Kondo ,  Takashi Kurahashi ,  Nozomu Okumura ,  Makoto Takagi

发明人： Toshihiro Miyake ,  Koii Kondo ,  Takashi Kurahashi ,  Nozomu Okumura ,  Makoto Takagi

IPC分类号： B23K3534

CPC分类号： B23K35/3612 ,  B23K1/015 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3489 ,  Y10S428/939 ,  Y10T428/12514 ,  Y10T428/12556 ,  Y10T428/1259 ,  H01L2924/00014

摘要： A connecting material, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C14H30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning. An excellent electrical joint which is moisture-resistant as well as highly reliable is attained.

摘要翻译： 公开了一种在不使用助焊剂的情况下固定可靠接头的连接材料。 使用能够物理破坏和分散氧化膜的辅助连接材料来进行焊接，该氧化膜自然生长在诸如焊料的主要连接材料的表面上，或者在两个端子之间钎焊，以实现可靠的焊料润湿 主要连接材料融合和混合）。 对于辅助连接材料，可以使用例如正十四烷（C 14 H 30）的烃。 连接表面之间的十四烷沸腾并立即膨胀; 由此产生的能量物理地分散氧化膜并引起新鲜的表面暴露; 两端的焊料混合; 并牢固地实现了电气和机械接头。 辅助连接材料的残留物是绝缘材料，因此不需要清洁。 获得耐湿性好，可靠性高的优良电接头。

公开(公告)号：US06787736B1

公开(公告)日：2004-09-07

申请号：US09683523

申请日：2002-01-13

申请人： Fuhu Chen ,  Sundaram Nagarajan

发明人： Fuhu Chen ,  Sundaram Nagarajan

IPC分类号： B23K3534

CPC分类号： B23K35/3053 ,  B23K35/0266 ,  B23K35/406

摘要： The present invention is a weld wire comprising a sheath encapsulating a metal core made of powdered metal, wherein a fill percentage of the metal core is no less than approximately 12%. The metal core comprises a core composition alloyed with an alloying element or an combination of elements comprising Cr, Mo, V, W, Hf and Nb or combinations thereof, wherein a total weight percentage of the alloying element or the combination of elements in the core composition does not exceed approximately 1%. In a particular embodiment, the alloying element is Mo in the amounts selected from the range of about 0 to about 0.5 percent by weight and the fill percentage of the metal core is selected from the range of about 12% to about 30%. In a particular embodiment of the invention, the total percentage of the combination of elements is selected from the range of about 0.4% to about 0.8%.

摘要翻译： 本发明是一种焊丝，其包括包覆由粉末状金属制成的金属芯的护套，其中金属芯的填充率不小于约12％。 金属芯包括与合金元素合金的芯组合物或由Cr，Mo，V，W，Hf和Nb组成的组合或其组合，其中合金元素或芯中元素组合的总重量百分数 组成不超过约1％。 在一个具体实施方案中，合金元素为选自约0至约0.5重量％范围内的Mo，并且金属芯的填充百分比选自约12％至约30％的范围。 在本发明的一个具体实施方案中，元素组合的总百分比选自约0.4％至约0.8％的范围。

公开(公告)号：US06524398B2

公开(公告)日：2003-02-25

申请号：US09834196

申请日：2001-04-12

申请人： Sanyogita Arora ,  Bin Mo

发明人： Sanyogita Arora ,  Bin Mo

IPC分类号： B23K3534

CPC分类号： B23K35/3612 ,  B23K35/3618

摘要： A soldering flux includes a solvent, an activator in the solvent, and cationic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.

摘要翻译： 助焊剂包括溶剂，溶剂中的活化剂，以及阳离子和非离子表面活性剂。 在施加焊料之前，可以将焊剂施加到诸如印刷电路板的基板上。

公开(公告)号：US06383305B1

公开(公告)日：2002-05-07

申请号：US09581224

申请日：2000-06-23

申请人： Jean Chazelas ,  Olivier Prevotat ,  Jean-François Silvain ,  Sandrine Trombert

发明人： Jean Chazelas ,  Olivier Prevotat ,  Jean-François Silvain ,  Sandrine Trombert

IPC分类号： B23K3534

CPC分类号： B23K35/025 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0308

摘要： To improve the resistance of a solder to strains, especial thermal strains, superelastic particles are incorporated into the solder in a proportion by volume of 10 to 30% approximately. So that this incorporation can be done, the particles are coated with a metal, for example copper, that is wettable by the solder.

摘要翻译： 为了提高焊料对应变的阻力，特别的热应变，超弹性颗粒以大约10到30％的体积比例掺入焊料中。 为了可以实现这种结合，颗粒被可被焊料润湿的金属（例如铜）涂覆。

公开(公告)号：US06339209B1

公开(公告)日：2002-01-15

申请号：US09438803

申请日：1999-11-12

申请人： Damian J. Kotecki

发明人： Damian J. Kotecki

IPC分类号： B23K3534

CPC分类号： B23K35/368 ,  B23K35/308 ,  B23K35/3601

摘要： A flux for use in arc welding of a stainless steel workpiece with a consumable metal electrode, which welding flux comprises a zirconia containing system for forming a slag on the surface of the deposited weld metal. The flux system contains zirconia, silica and titania. The zirconia and titania are contained the flux system in a ratio of at least 1:1.5. The flux system can also include a melting control agent, a fluoride, an arc stabilizer, a slag removal agent and/or a bead wetting agent. Also, there is provided an electrode employing this flux.

摘要翻译： 一种用于不锈钢工件与消耗性金属电极的电弧焊接的焊剂，该焊剂包括用于在沉积的焊接金属的表面上形成炉渣的含氧化锆的系统。 助熔剂系统含有氧化锆，二氧化硅和二氧化钛。 氧化锆和二氧化钛以至少1:1.5的比例含有助熔剂体系。 助熔剂系统还可以包括熔融控制剂，氟化物，电弧稳定剂，除渣剂和/或珠粒润湿剂。 此外，提供了使用该焊剂的电极。

公开(公告)号：US06656290B1

公开(公告)日：2003-12-02

申请号：US09115553

申请日：1998-07-15

申请人： Jürgen Koch ,  Leander Staab ,  Wolfgang Kohlweiler ,  Karl-Anton Starz

发明人： Jürgen Koch ,  Leander Staab ,  Wolfgang Kohlweiler ,  Karl-Anton Starz

IPC分类号： B23K3534

CPC分类号： B23K35/36 ,  B23K35/025 ,  B23K35/286 ,  B23K35/3605 ,  B23K35/3618 ,  Y10T428/12764

摘要： A soldering paste for hard-soldering and coating working parts made of aluminum or aluminum alloys, which contains 25 to 35 percent in weight of a water-miscible organic binding agent on the basis of aliphatic glycols, 25 to 45 percent in weight of an aluminum hard-soldering powder, 25 to 45 percent in weight of an aluminum fluxing agent and, as an additive to influence the rheological properties, 0.01 to 0.2 percent by weight with respect to the total amount of one or several fatty acids with 10 to 20 C atoms and/or their ammonium salts.

摘要翻译： 用于硬焊接和涂覆由铝或铝合金制成的工作部件的焊膏，其包含基于脂族二醇的25至35重量％的水混溶性有机粘合剂，25至45重量％的铝 硬钎焊粉末，25〜45重量％的铝助熔剂，作为影响流变性能的添加剂，相对于10〜20℃的一种或几种脂肪酸的总量，为0.01〜0.2重量％ 原子和/或其铵盐。

公开(公告)号：US06630036B2

公开(公告)日：2003-10-07

申请号：US09956549

申请日：2001-09-19

申请人： Keiko Saita ,  Masao Watanabe

发明人： Keiko Saita ,  Masao Watanabe

IPC分类号： B23K3534

CPC分类号： B23K35/3618 ,  B23K35/3613

摘要： An object of the present invention is to provide a novel flux, which has sufficient cleaning performance and tolerates to be used under a high flex temperature when used for so-called Pb-free solder, such as Sn—Ag or Sn—Ag—Bi based solder, and which causes no deterioration of material or no disorder in durability and; the soldering flux of the present invention is a soldering flux, in which abietic acid, the main component of rosin, is used as a main base material component, and a solid acid compound, in which a halide ion is not a constituent element, is used as the inorganic component having a function to enhance the flux activity which is added and dispersed in said rosin-based base material.

公开(公告)号：US06440228B1

公开(公告)日：2002-08-27

申请号：US09774011

申请日：2001-01-31

申请人： Toshihiko Taguchi ,  Kunihito Takaura ,  Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima

发明人： Toshihiko Taguchi ,  Kunihito Takaura ,  Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima

IPC分类号： B23K3534

CPC分类号： B23K35/3612 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3613

摘要： A solder paste having a powder of a Zn-containing solder alloy such as an Sn—Zn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or aryl glycidyl ether. The improved solder paste has increased resistance to aging and to concomitant deterioration in solderability caused by reaction of Zn in the solder alloy with ingredients in the flux and has a substantially extended shelf life.

摘要翻译： 通过将0.1重量％〜5.0重量％的缩水甘油醚化合物，例如添加0.1〜5.0重量％的缩水甘油醚化合物，可以提高含有Sn-Zn系合金等Zn系合金粉末与助熔剂如松香助熔剂的混合物的焊膏， 作为烷基，烯基或芳基缩水甘油醚。 改进的焊膏具有增加的老化耐受性，并且伴随着焊料合金中的Zn与焊剂中的成分的反应引起的可焊性的劣化，并且具有大大延长的保质期。