Abstract:
A method for manufacturing liquid ejection heads includes the steps of forming ejection port members on a substrate, the ejection port members each having a liquid channel and an ejection port for ejecting liquid through the channel, the liquid channel communicating with the substrate; forming supply ports passing through the substrate to supply liquid to the channels; and forming a separation groove in the substrate to separate the substrate for each liquid ejection head. The step of forming the ejection port members includes the step of hardening a material constituting the ejection port member by heat treatment. The step of forming the separation groove is performed before the step of hardening.
Abstract:
The invention provides a process for producing a liquid ejection head having an ejection orifice forming member in which an ejection orifice for ejecting a liquid has been formed, and a substrate having an energy-generating element for generating energy for ejecting a liquid from the ejection orifice on the side of a front surface thereof, the process includes the steps of providing a film having a support, a first layer and a second layer in this order, arranging the film on the substrate in such a manner that the second layer faces the front surface, detaching the support from the film arranged, forming the ejection orifice in the second layer, and removing at least a part of the first layer from the second layer.
Abstract:
A method of manufacturing a print head includes forming a jet stack having an array of jets, arranging an array of transducers on the jet stack such that each transducer in the array of transducers corresponds to each jet in the array of jets, embossing a flexible circuit substrate having contact pads such that the contact pads extend out of a plane of the flexible circuit substrate, and arranging the flexible circuit substrate such that the contact pads electrically connect to at least some of the transducers in the array of transducers.
Abstract:
Provided is a method for manufacturing a substrate for liquid ejection head including an ejection energy generating element and a nozzle layer including an ejection port and a liquid channel. The method includes the steps of: forming, on the substrate including the element, a metal mold member made of metal and having a flat surface, the metal mold member making up at least a part of a mold for the liquid channel, and a planarization layer made of the metal and having a flat surface to planarize a surface of the nozzle layer; coating the mold for the liquid channel and the planarization layer with negative-type photosensitive resin, thus forming a negative-type photosensitive resin layer to be the nozzle layer; exposing the resin layer to ultraviolet rays, thus forming the ejection port; and selectively removing the mold for the liquid channel, thus forming the liquid channel.
Abstract:
A method of manufacturing a liquid ejection head having a plurality of passage modules that have individual passages, actuator modules that include a plurality of actuators and a drive unit and the liquid ejection head produced by the method. The method comprising ranking the actuator modules according to a magnitude of a capacitance of the actuators, classifying the passage modules into a terminal region group and a central region group, fixing the actuator modules to the passage modules so that the actuator modules that having a capacitance not less than a predetermined capacitance correspond to the passage modules in the terminal group and so that the actuator modules having a capacitance less than the predetermined capacitance in the actuator module ranking correspond to the passage modules in the central region group.
Abstract:
An object of the invention is to provide a method of manufacturing a liquid droplet ejection head that is capable of realizing cost reduction by a simple process and obtaining ejection reliability over a long period of time. The method includes: forming a water repellent film on a nozzle forming substrate having a nozzle hole and inside the nozzle hole; adhering a protective film on the water repellent film that is formed on the surface of the nozzle forming substrate; removing the water repellent film formed inside the nozzle by a plasma treatment; and peeling the protective film, wherein polysiloxane is not contained in an adhesion component and a base material of the protective film.
Abstract:
A method of manufacturing a device that has a semiconductor element includes: forming a first wiring on a first surface of a first member; forming a second wiring on a second surface of a second member with a gap from a connection terminal and a third wiring on an inclined plane of the second member, the second member being disposed on the first member so that the first and second surfaces face in the same direction, the third wiring being aligned with, and connecting, the first and second wirings; disposing the semiconductor element on the first or second surface; and providing plating that electrically connects the first, second and third wiring with the connection terminal, wherein the connection terminal faces the second wiring, and the plating is provided in the gap between the connection terminal and the second wiring.
Abstract:
A method for producing a liquid-ejecting head including a passage-forming substrate and a protective substrate. The passage-forming substrate has pressure-generating chambers communicating with nozzle orifices, piezoelectric devices that change the inner pressures of the pressure-generating chambers, and liquid supply channels for supplying the pressure-generating chambers. The protective substrate has a piezoelectric-device accommodating portion and a through-hole, through which wirings to lead electrodes extended from the piezoelectric devices pass thorough. The method includes forming the piezoelectric-device accommodating portion and a portion of the through-hole in the protective substrate while leaving a lid, a portion of the protective substrate, closing off an opening of the through-hole, bonding the protective substrate to the passage-forming substrate, forming the pressure-generating chambers and the liquid supply channels in the passage-forming substrate, forming a protective film on surfaces of the passage-forming substrate and the protective substrate, and removing the lid to complete the formation of the through-hole.
Abstract:
A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.
Abstract:
A method of manufacturing a printhead includes providing a substrate and a filter membrane structure. A first portion of the substrate defines a plurality of nozzles and a second portion of the substrate defines a plurality of liquid chambers. Each liquid chamber of the plurality of liquid chambers is in fluid communication with a respective one of the plurality of nozzles. The filter membrane structure is adhered, for example, laminated, to the second portion of the substrate. Each liquid chamber of the plurality of liquid chambers is in fluid communication with a distinct portion of the filter membrane structure. Pores are formed in the filter membrane structure using a photo-lithography process.