Abstract:
A liquid ejection head comprises a semiconductor substrate having an energy generating element arranged thereon to generate energy to be utilized to eject liquid and a laminate including a plurality of insulating layers laid sequentially in the depth direction of the semiconductor substrate. Wiring is formed in the laminate and electrically connected to the energy generating element. The wiring includes a via formed in the insulating layers in the thickness direction of the insulating layers. The energy generating element is arranged between the semiconductor substrate and the laminate in the laminating direction of the insulating layers.
Abstract:
A liquid ejection head comprises a semiconductor substrate having an energy generating element arranged thereon to generate energy to be utilized to eject liquid and a laminate including a plurality of insulating layers laid sequentially in the depth direction of the semiconductor substrate. Wiring is formed in the laminate and electrically connected to the energy generating element. The wiring includes a via formed in the insulating layers in the thickness direction of the insulating layers. The energy generating element is arranged between the semiconductor substrate and the laminate in the laminating direction of the insulating layers.
Abstract:
A method of manufacturing a liquid ejection head includes forming, on the substrate, a metal layer formed of a first metal, forming a liquid flow path pattern formed of a second metal that is a metal of a different kind from that of the first metal and that is dissolvable in a solution that does not dissolve the first metal, the liquid flow path pattern being formed on at least a part of a surface of the metal layer, covering the metal layer and the pattern with an inorganic material layer to be formed as the nozzle layer, forming the ejection orifices in the inorganic material layer, and removing the pattern by the solution. A standard electrode potential E1 of the first metal and a standard electrode potential E2 of the second metal have a relationship of E1>E2.
Abstract:
A recording-element substrate includes an ejection port configured to eject liquid; a heating resistance element configured to generate thermal energy for ejecting the liquid from the ejection port; and a drive circuit configured to drive the heating resistance element. The heating resistance element includes a heating resistor layer and three pairs of electrodes provided for the heating resistor layer. The drive circuit forms a heating area that generates thermal energy in the heating resistor layer by selectively using two or more of the electrodes.
Abstract:
There are provided a substrate for an inkjet head and an inkjet head wherein in a case where a protection layer of heating resistors is energized, an electrical connection with portions around the protection layer is more reliably cut. A first protection layer provided for the substrate for an inkjet head includes individual sections provided at positions corresponding to the plurality of heating resistors and a common section which commonly connects the plurality of individual sections. The individual sections and the common section are connected via connect sections which are eluted and connect in a case where an electrochemical reaction occurs between the connect sections and ink when electricity flow therethrough, so that an electrical connection between the individual sections and the common section is cut.
Abstract:
A liquid ejection head, including: a flow path forming member including a resin layer having an ejection orifice and a flow path formed therein; a substrate including a heat-generating resistance element for ejecting liquid and a protective layer having a portion for covering the heat-generating resistance element, a surface of the portion being exposed to the flow path; and an intermediate layer formed between the resin layer and the protective layer, the intermediate layer including a silicon carbonitride material.
Abstract:
An ink jet recording head substrate is provided which includes a base substrate, a heat accumulation layer overlying the base substrate, a heating resistor layer including an electrothermal conversion portion and overlying the heat accumulation layer, a wiring layer electrically connected to the heating resistor layer, and an insulating protective layer covering the heating resistor layer and the wiring layer. The heat accumulation layer includes a porous cyclic siloxane film.
Abstract:
A substrate for an inkjet print head comprises: a base; a plurality of heating resistors for heating ink, the heating resistors being disposed on the base and producing heat in a case where the heating resistors are energized; a first protection layer disposed on the heating resistors and having insulation properties; and a second protection layer disposed on the first protection layer and having conductivity. The second protection layer includes individual sections disposed to individually cover the plurality of heating resistors, a common section connecting the individual sections, and connection sections interposed between the individual sections and the common section and connecting the individual sections and the common section. The connection sections are disposed at positions to be in contact with ink, and include a material which changes to an insulating film by an electrochemical reaction with the ink.
Abstract:
The reduction in reliably of a liquid discharge head due to the dissolution of a protective layer is suppressed. A substrate for a liquid discharge head includes a base substrate, a heat-generating resistive layer placed on the base substrate, a pair of lines placed on the base substrate, and a protective layer covering the heat-generating resistive layer and the lines. The protective layer contains a material represented by the formula SixCyNx, where x+y+z=100, 30≦x≦59, y≧5, and z≧15 on an atomic percent basis.
Abstract translation:抑制由于保护层的溶解导致的液体排出头的可靠性的降低。 用于液体排出头的基板包括基底基板,放置在基底基板上的发热电阻层,放置在基底基板上的一对线以及覆盖发热电阻层和线的保护层。 保护层含有由式SixCyNx表示的材料,其中x + y + z = 100,30和nlE; x< lE; 59,y≥5,z≥15。
Abstract:
A liquid ejection head, including: a flow path forming member including a resin layer having an ejection orifice and a flow path formed therein; a substrate including a heat-generating resistance element for ejecting liquid and a protective layer having a portion for covering the heat-generating resistance element, a surface of the portion being exposed to the flow path; and an intermediate layer formed between the resin layer and the protective layer, the intermediate layer including a silicon carbonitride material.