Element substrate and liquid ejection head

    公开(公告)号:US10814623B2

    公开(公告)日:2020-10-27

    申请号:US16019714

    申请日:2018-06-27

    Abstract: An element substrate of a liquid ejection head includes: a base material; an insulating film positioned on the base material; a heating resistance element for generating heat energy for ejecting a liquid; a protective film for covering the heating resistance element; a first electrical wiring layer arranged in the insulating film, for supplying a current to the heating resistance element; a second electrical wiring layer arranged on a layer different from the first electrical wiring layer in the insulating film, for supplying a current to the heating resistance element; and at least one connecting member extending into the insulating film to connect the first electrical wiring layer and the heating resistance element, for causing the current to flow in a first direction, the heating resistance element including a connecting region, extending in a second direction intersecting the first direction, to which the at least one connecting member is connected.

    Element substrate
    2.
    发明授权

    公开(公告)号:US10766255B2

    公开(公告)日:2020-09-08

    申请号:US16369263

    申请日:2019-03-29

    Abstract: Provided is an element substrate with suppressed variations in resistance though having a high resistance. In an element substrate equipped with a heat generating resistor that generates thermal energy for ejecting a liquid, the heat generating resistor is a stacked structure having stacked a plurality of resistor layers including a first resistor layer and a second resistor layer containing a metal silicon nitride and the first resistor layer and the second resistor layer are different from each other in at least one of a silicon content in the metal silicon oxide and a metal element contained in the metal silicon nitride.

    Manufacturing method of substrate for liquid ejection head
    3.
    发明授权
    Manufacturing method of substrate for liquid ejection head 有权
    液体喷射头基板的制造方法

    公开(公告)号:US09266331B2

    公开(公告)日:2016-02-23

    申请号:US13926651

    申请日:2013-06-25

    Abstract: Provided is a method for manufacturing a substrate for liquid ejection head including an ejection energy generating element and a nozzle layer including an ejection port and a liquid channel. The method includes the steps of: forming, on the substrate including the element, a metal mold member made of metal and having a flat surface, the metal mold member making up at least a part of a mold for the liquid channel, and a planarization layer made of the metal and having a flat surface to planarize a surface of the nozzle layer; coating the mold for the liquid channel and the planarization layer with negative-type photosensitive resin, thus forming a negative-type photosensitive resin layer to be the nozzle layer; exposing the resin layer to ultraviolet rays, thus forming the ejection port; and selectively removing the mold for the liquid channel, thus forming the liquid channel.

    Abstract translation: 本发明提供一种液体喷射头用基板的制造方法,其特征在于,具有喷射能量产生元件和喷出口以及液体通道的喷嘴层。 该方法包括以下步骤:在包括元件的基板上形成由金属制成并具有平坦表面的金属模具构件,所述金属模具构件构成用于液体通道的模具的至少一部分,以及平坦化 由金属制成并具有平坦表面以使喷嘴层的表面平坦化的层; 用负型感光树脂涂布液体通道的模具和平坦化层,从而形成作为喷嘴层的负型感光性树脂层; 将树脂层暴露于紫外线,从而形成喷出口; 并选择性地去除用于液体通道的模具,从而形成液体通道。

    LIQUID EJECTING HEAD, SUBSTRATE FOR LIQUID EJECTING HEAD, AND PRINTING APPARATUS
    4.
    发明申请
    LIQUID EJECTING HEAD, SUBSTRATE FOR LIQUID EJECTING HEAD, AND PRINTING APPARATUS 有权
    液体喷射头,液体喷头基板和印刷装置

    公开(公告)号:US20150029267A1

    公开(公告)日:2015-01-29

    申请号:US14339843

    申请日:2014-07-24

    CPC classification number: B41J2/14072 B41J2/14096 B41J2/14129

    Abstract: A print head includes upper protective members located at positions corresponding to heat generating resistor elements to protect the heat generating resistor elements, and further, a part of the protective member being eluted to ink when a current flows inside in a state in which the ink is reserved in the pressure chambers. The print head includes a drive element and a logic circuit capable of allowing a current to independently flow in each of the upper protective layers so as to elute a part of the upper protective layer, in which the current flows, to the ink.

    Abstract translation: 打印头包括位于对应于发热电阻元件的位置的上部保护构件,以保护发热电阻元件,此外,当电流在油墨为油墨的状态下流入内部时,保护构件的一部分被洗脱成油墨 保留在压力室中。 打印头包括驱动元件和逻辑电路,其能够使电流独立地流过每个上保护层,从而将电流流过的上保护层的一部分洗掉到墨上。

    Element substrate, liquid discharge head, and printing apparatus

    公开(公告)号:US11338581B2

    公开(公告)日:2022-05-24

    申请号:US16848975

    申请日:2020-04-15

    Abstract: To suppress the progress of metal dissolution by ink when wire break of a wiring to a heater occurs, in an element substrate, according to the present invention, for example, which is used in an inkjet printhead, each of heaters integrated in the element substrate is connected to an individual wiring via a first through-hole penetrating an insulation layer, and further connected to a common wiring from the individual wiring via a wiring formed in another wiring layer via a second through-hole penetrating an insulation layer. The individual wiring and the common wiring are formed in the same wiring layer, and an aspect ratio of the second through-hole is lower than an aspect ratio of the first through-hole.

    Method of manufacturing liquid ejection head
    6.
    发明授权
    Method of manufacturing liquid ejection head 有权
    液体喷射头的制造方法

    公开(公告)号:US09427953B2

    公开(公告)日:2016-08-30

    申请号:US13945283

    申请日:2013-07-18

    Abstract: A method of manufacturing a liquid ejection head includes forming, on the substrate, a metal layer formed of a first metal, forming a liquid flow path pattern formed of a second metal that is a metal of a different kind from that of the first metal and that is dissolvable in a solution that does not dissolve the first metal, the liquid flow path pattern being formed on at least a part of a surface of the metal layer, covering the metal layer and the pattern with an inorganic material layer to be formed as the nozzle layer, forming the ejection orifices in the inorganic material layer, and removing the pattern by the solution. A standard electrode potential E1 of the first metal and a standard electrode potential E2 of the second metal have a relationship of E1>E2.

    Abstract translation: 一种液体喷射头的制造方法,包括在基板上形成由第一金属形成的金属层,形成由与第一金属不同种类的金属的第二金属形成的液体流路图案,以及 可溶解在不溶解第一金属的溶液中,液体流动通道图案形成在金属层的表面的至少一部分上,用形成为无机材料层的金属层和图案形成为 喷嘴层,在无机材料层中形成喷射孔,并通过溶液去除图案。 第一金属的标准电极电位E1和第二金属的标准电极电位E2具有E1> E2的关系。

    Recording-element substrate and liquid ejection apparatus
    7.
    发明授权
    Recording-element substrate and liquid ejection apparatus 有权
    记录元件基板和液体喷射装置

    公开(公告)号:US09216575B2

    公开(公告)日:2015-12-22

    申请号:US14683470

    申请日:2015-04-10

    Abstract: A recording-element substrate includes an ejection port configured to eject liquid; a heating resistance element configured to generate thermal energy for ejecting the liquid from the ejection port; and a drive circuit configured to drive the heating resistance element. The heating resistance element includes a heating resistor layer and three pairs of electrodes provided for the heating resistor layer. The drive circuit forms a heating area that generates thermal energy in the heating resistor layer by selectively using two or more of the electrodes.

    Abstract translation: 记录元件基板包括被配置为喷射液体的喷射口; 加热电阻元件,其被配置为产生用于从所述喷射口喷射所述液体的热能; 以及驱动电路,被配置为驱动所述加热电阻元件。 加热电阻元件包括加热电阻层和为加热电阻层设置的三对电极。 驱动电路通过选择性地使用两个或更多个电极形成在发热电阻层中产生热能的加热区域。

    Liquid discharge device and cleaning method for liquid discharge head
    8.
    发明授权
    Liquid discharge device and cleaning method for liquid discharge head 有权
    液体排放装置及排液头清洗方法

    公开(公告)号:US09090112B2

    公开(公告)日:2015-07-28

    申请号:US14169576

    申请日:2014-01-31

    CPC classification number: B41J29/17 B41J2/14129 B41J2/16511 B41J2/16532

    Abstract: A liquid discharge device includes a liquid discharge head including a discharge port surface on which discharge ports for discharging liquid are formed, an electrothermal conversion element configured to generate energy for discharging liquid from the discharge ports, and a protection film configured to cover at least the electrothermal conversion element, and a cap configured to cover the discharge port surface, wherein the cap is arranged along the discharge port surface at a position opposite to the protection film via the discharge ports in a state where the cap covers the discharge port surface, and wherein the cap includes an electrode configured to be used to apply voltage between the protection film and the electrode.

    Abstract translation: 液体排出装置包括:排液头,包括排出口表面,排出口用于排出液体,电热转换元件,其被配置为产生用于从排出口排出液体的能量;以及保护膜,其被构造成至少覆盖 电热转换元件和盖构成以覆盖排出口表面的盖,其中在盖覆盖排出口表面的状态下,盖经由排出口在与保护膜相对的位置处沿着排出口表面布置;以及 其中所述盖包括被配置为用于在所述保护膜和所述电极之间施加电压的电极。

    SEMICONDUCTOR DEVICE, LIQUID DISCHARGE HEAD, AND LIQUID DISCHARGE APPARATUS

    公开(公告)号:US20220293201A1

    公开(公告)日:2022-09-15

    申请号:US17687482

    申请日:2022-03-04

    Abstract: A device, comprising a plurality of units arrayed in a predetermined direction, a first terminal configured to supply a voltage to the plurality of units, and a second terminal configured to supply a voltage to the plurality of units, wherein the plurality of units include a first unit including a memory element arranged between the first terminal and the second terminal, and a first transistor configured to perform write to the memory element, and a second unit including a second transistor arranged between the first terminal and the second terminal in correspondence with the first transistor of the first unit.

    ELEMENT SUBSTRATE, LIQUID DISCHARGE HEAD, AND PRINTING APPARATUS

    公开(公告)号:US20200338887A1

    公开(公告)日:2020-10-29

    申请号:US16848975

    申请日:2020-04-15

    Abstract: To suppress the progress of metal dissolution by ink when wire break of a wiring to a heater occurs, in an element substrate, according to the present invention, for example, which is used in an inkjet printhead, each of heaters integrated in the element substrate is connected to an individual wiring via a first through-hole penetrating an insulation layer, and further connected to a common wiring from the individual wiring via a wiring formed in another wiring layer via a second through-hole penetrating an insulation layer. The individual wiring and the common wiring are formed in the same wiring layer, and an aspect ratio of the second through-hole is lower than an aspect ratio of the first through-hole.

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