公开(公告)号：US11383515B2

公开(公告)日：2022-07-12

申请号：US16848983

申请日：2020-04-15

Applicant: CANON KABUSHIKI KAISHA

Inventor： Sadayoshi Sakuma ,  Yohei Osuki

IPC: B41J2/14 ,  B41J2/045

Abstract: An element substrate comprises: a first insulation layer between a heater layer where plural heaters are formed, and a first wiring layer; and a second wiring layer formed within the first insulation layer, where an individual wiring connected to each heater is formed; a first metal plug that fills an interior of a first through-hole penetrating from the heater layer to the second wiring layer; and a second metal plug, provided in a place different from a place where the first through-hole is formed, that fills an interior of a second through-hole penetrating from the second wiring layer to the first wiring layer. Each heater is connected to the second wiring layer via the first metal plug, and the second wiring layer is connected to the first wiring layer via the second metal plug.

公开(公告)号：US11338581B2

公开(公告)日：2022-05-24

申请号：US16848975

申请日：2020-04-15

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yohei Osuki ,  Sadayoshi Sakuma

IPC: B41J2/14

Abstract: To suppress the progress of metal dissolution by ink when wire break of a wiring to a heater occurs, in an element substrate, according to the present invention, for example, which is used in an inkjet printhead, each of heaters integrated in the element substrate is connected to an individual wiring via a first through-hole penetrating an insulation layer, and further connected to a common wiring from the individual wiring via a wiring formed in another wiring layer via a second through-hole penetrating an insulation layer. The individual wiring and the common wiring are formed in the same wiring layer, and an aspect ratio of the second through-hole is lower than an aspect ratio of the first through-hole.

公开(公告)号：US09950525B2

公开(公告)日：2018-04-24

申请号：US15287379

申请日：2016-10-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ryoji Oohashi ,  Koichi Omata ,  Hideo Tamura ,  Takaaki Yamaguchi ,  Kousuke Kubo ,  Suguru Taniguchi ,  Yuji Tamaru ,  Toshio Negishi ,  Yohei Osuki

IPC: B41J2/14

CPC classification number: B41J2/1433 ,  B41J2/14072 ,  B41J2/14088 ,  B41J2/14129 ,  B41J2/14201 ,  B41J2/1603 ,  B41J2/1631 ,  B41J2/1635 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2002/14217

Abstract: An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded.

公开(公告)号：US11820141B2

公开(公告)日：2023-11-21

申请号：US17537795

申请日：2021-11-30

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yohei Osuki

IPC: B41J2/14 ,  B41J2/175 ,  B41J2/16

CPC classification number: B41J2/14072 ,  B41J2/14153 ,  B41J2/1753 ,  B41J2/1601 ,  B41J2/164 ,  B41J2/1626

Abstract: An element substrate of a liquid ejection head includes an ejection element for ejecting a liquid, a plurality of electrode pads for receiving power for causing the ejection element to eject the liquid, and a sensor for detecting that the liquid has invaded the vicinity of the plurality of electrode pads. The sensor has first wiring connected with one electrode pad of the plurality of electrode pads and second wiring connected with one electrode pad different from the electrode pad connected with the first wiring.

公开(公告)号：US20200338887A1

公开(公告)日：2020-10-29

申请号：US16848975

申请日：2020-04-15

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yohei Osuki ,  Sadayoshi Sakuma

IPC: B41J2/14

Abstract: To suppress the progress of metal dissolution by ink when wire break of a wiring to a heater occurs, in an element substrate, according to the present invention, for example, which is used in an inkjet printhead, each of heaters integrated in the element substrate is connected to an individual wiring via a first through-hole penetrating an insulation layer, and further connected to a common wiring from the individual wiring via a wiring formed in another wiring layer via a second through-hole penetrating an insulation layer. The individual wiring and the common wiring are formed in the same wiring layer, and an aspect ratio of the second through-hole is lower than an aspect ratio of the first through-hole.

公开(公告)号：US20170173953A1

公开(公告)日：2017-06-22

申请号：US15382079

申请日：2016-12-16

Applicant: CANON KABUSHIKI KAISHA

Inventor： Suguru Taniguchi ,  Koichi Omata ,  Hideo Tamura ,  Takaaki Yamaguchi ,  Kousuke Kubo ,  Ryoji Oohashi ,  Yuji Tamaru ,  Toshio Negishi ,  Yohei Osuki

IPC: B41J2/14

CPC classification number: B41J2/14145 ,  B41J2/1404 ,  B41J2/14072 ,  B41J2/14112 ,  B41J2/14129

Abstract: A recording-element substrate includes a substrate including a base member, a pair of electrodes, a heating element formed of a thermal resistor layer between the electrodes, a surface on which an electroconductive film coating the heating element has been formed, and an insulating film between the heating element and the electroconductive film and a flow-path-forming member including walls forming a liquid flow path toward the heating element while being disposed on the substrate's surface side. The substrate includes an electric connecting portion in contact with the electroconductive film to connect the electroconductive film with the base member. The shortest distance between the electric connecting portion and a portion where an angle formed by the walls is 120 degrees or smaller when viewed from a direction orthogonal to the surface is smaller than that between a boundary between the electrodes and the heating element and the portion.

公开(公告)号：US20200338888A1

公开(公告)日：2020-10-29

申请号：US16848983

申请日：2020-04-15

Applicant: CANON KABUSHIKI KAISHA

Inventor： Sadayoshi Sakuma ,  Yohei Osuki

IPC: B41J2/14 ,  B41J2/045

Abstract: An element substrate comprises: a first insulation layer between a heater layer where plural heaters are formed, and a first wiring layer; and a second wiring layer formed within the first insulation layer, where an individual wiring connected to each heater is formed; a first metal plug that fills an interior of a first through-hole penetrating from the heater layer to the second wiring layer; and a second metal plug, provided in a place different from a place where the first through-hole is formed, that fills an interior of a second through-hole penetrating from the second wiring layer to the first wiring layer. Each heater is connected to the second wiring layer via the first metal plug, and the second wiring layer is connected to the first wiring layer via the second metal plug.

公开(公告)号：US20190001663A1

公开(公告)日：2019-01-03

申请号：US16009808

申请日：2018-06-15

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hideo Tamura ,  Takaaki Yamaguchi ,  Yohei Osuki

IPC: B41J2/045 ,  B41J2/16

Abstract: A print element substrate comprises: a plurality of heaters configured to cause discharge of droplets; a pad array in which a plurality of pads configured to do electrical connection from an outside are arranged; and a plurality of resistance monitor elements configured to measure resistance values of the plurality of heaters, wherein the plurality of resistance monitor elements are arranged along a direction of the pad array.

公开(公告)号：US20180104954A1

公开(公告)日：2018-04-19

申请号：US15692105

申请日：2017-08-31

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yohei Osuki ,  Koichi Omata ,  Hideo Tamura ,  Takaaki Yamaguchi ,  Kousuke Kubo ,  Ryoji Oohashi ,  Yuji Tamaru ,  Toshio Negishi ,  Suguru Taniguchi

IPC: B41J2/14

CPC classification number: B41J2/14072 ,  B41J2/14088 ,  B41J2/14129 ,  B41J2202/13

Abstract: A print element substrate, comprises: a heater layer; a wiring layer that is connected to the heater layer and is for causing the heater layer to generate heat; an insulating layer arranged on the wiring layer; an anti-cavitation layer arranged on the insulating layer that is for protecting the insulating layer; and a switch that has a control terminal that is pulled-down to a ground, and causes the anti-cavitation layer and the ground to have an electrical connection when the control terminal is in a high-level state.

公开(公告)号：US20170100930A1

公开(公告)日：2017-04-13

申请号：US15287379

申请日：2016-10-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ryoji Oohashi ,  Koichi Omata ,  Hideo Tamura ,  Takaaki Yamaguchi ,  Kousuke Kubo ,  Suguru Taniguchi ,  Yuji Tamaru ,  Toshio Negishi ,  Yohei Osuki

IPC: B41J2/14

CPC classification number: B41J2/1433 ,  B41J2/14072 ,  B41J2/14088 ,  B41J2/14129 ,  B41J2/14201 ,  B41J2/1603 ,  B41J2/1631 ,  B41J2/1635 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2002/14217

Abstract: An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded.