Invention Grant
- Patent Title: Element substrate, liquid ejection head, liquid ejection apparatus, and manufacturing method
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Application No.: US17537795Application Date: 2021-11-30
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Publication No.: US11820141B2Publication Date: 2023-11-21
- Inventor: Yohei Osuki
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: VENABLE LLP
- Priority: JP 20206567 2020.12.14
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/175 ; B41J2/16

Abstract:
An element substrate of a liquid ejection head includes an ejection element for ejecting a liquid, a plurality of electrode pads for receiving power for causing the ejection element to eject the liquid, and a sensor for detecting that the liquid has invaded the vicinity of the plurality of electrode pads. The sensor has first wiring connected with one electrode pad of the plurality of electrode pads and second wiring connected with one electrode pad different from the electrode pad connected with the first wiring.
Public/Granted literature
- US20220184950A1 ELEMENT SUBSTRATE, LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD Public/Granted day:2022-06-16
Information query
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