摘要:
A dynamic memory cell has a P+ injector region surrounded by an N+ region in an N- layer on an N+ layer. The injector region is placed between N+ source and drain regions. Holes injected into the N-layer are trapped by the high-low junctions at the N+, N- interfaces and are detected by sensing the source-drain current. Current levels are used to establish binary one and zero levels in the cell. Four masks in an aligned procedure simplify fabrication.
摘要:
A semiconductor device having a plurality of semiconductor elements formed in a monolithic manner in a semiconductor wafer of a first conductivity type while being sequentially arranged, in which each of the plurality of semiconductor elements consists of at least a collector region formed in the semiconductor wafer and having the first conductivity type and higher conductivity than the semiconductor wafer, a base region formed in the semiconductor wafer and having the first conductivity type and higher conductivity than the semiconductor wafer, and a relatively small emitter region formed in the semiconductor wafer between the base and collector regions and having a second conductivity type, at least the emitter region of each semiconductor element being adapted for exclusive use therewith and each semiconductor element presenting a current controlled negative resistance characteristic between the emitter and collector regions with a biasing power source being applied between the base and collector regions, and in which the distance between two adjacent ones of the semiconductor elements is selected so that when one of the two adjacent semiconductor elements is in the on state with the biasing power source being applied between the base and collector regions of the two semiconductor elements, the turnover voltage of the other semiconductor element may become low. A shift register, photoelectric conversion apparatus, logic functional circuit or apparatus and so on which employ such a semiconductor device.
摘要:
A semiconductor switching element and a semiconductor switching device involving the same which comprise at least one collector region diffused in a semiconductor substrate from its surface, containing a high concentration of impurities having the same type of conductivity as said substrate and displaying a higher degree of said conductivity than said substrate and formed into a fully narrow area, a base region diffused at a space of approximately 50 microns max. from said collector region, as measured from the same surface of said semiconductor substrate as that on which there is formed said collector region, in a manner to make the edge of said base region facing said collector region sufficiently longer than that of said collector region and containing a high concentration of impurities having the same type of conductivity as said semiconductor substrate and displaying a higher degree of said conductivity than said semiconductor substrate and at least one emitter region diffused from the same surface of said semiconductor substrate as that through which the aforesaid two regions are diffused and having an opposite type of conductivity to said semiconductor substrate.
摘要:
A dynamic memory cell uses a low barrier Schottky contact at a drain region to eliminate the need for an external gating diode. The drain is separated from source and injector regions by a heavily doped N+ reach through region extending to a heavily doped N+ blanket semiconductor. Holes injected into one of the separated regions are trapped by high-low junctions and are detected by sensing the source-drain current.
摘要:
A semiconductor switching element which comprises at least one collector region diffused in a semiconductor substrate from its surface, the collector region containing a high concentration of impurities imparting thereto the same type of conductivity as the substrate and displaying a higher degree of conductivity than the substrate and being formed into a fully narrow area, a base region diffused at a space of approximately 50 microns max. from the collector region, as measured from the same surface of the substrate as that on which there is formed the collector region, such that the edge of the base region facing the collector region is sufficiently longer than that of the collector region, the base region containing a high concentration of impurities imparting thereto the same type of conductivity as the semiconductor substrate and displaying a higher degree of conductivity than the substrate, and at least one emitter region diffused from the same surface of the substrate as that through which the aforesaid two regions are diffused and having an opposite type of conductivity as the substrate.