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公开(公告)号：US20240243035A1
公开(公告)日：2024-07-18
申请号：US18622715
申请日：2024-03-29
申请人： Frore Systems Inc.
发明人： Vikram Mukundan , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Ananth Saran Yalamarthy , Prathima Kapa
IPC分类号： H01L23/473 , B81B3/00 , G06F1/20 , H01L23/40
CPC分类号： H01L23/4735 , B81B3/0021 , G06F1/20 , H01L23/40 , B81B2201/034 , B81B2203/0118 , B81B2203/0307 , B81B2203/0315 , B81B2203/033 , B81B2207/99
摘要： A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The support structure couples the cooling element to the bottom plate. At least one of the support structure is an adhesive support structure or the support structure undergoes rotational motion in response to the vibrational motion. The adhesive support structure has at least one lateral dimension defined by a trench in the cooling element or the bottom plate.
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公开(公告)号：US10081537B2
公开(公告)日：2018-09-25
申请号：US15354682
申请日：2016-11-17
CPC分类号： B81B7/0061 , B81B7/0038 , B81B2201/0257 , B81B2201/0264 , B81B2207/99 , H04R1/04 , H04R1/2876 , H04R1/44 , H04R17/02 , H04R19/005 , H04R19/04 , H04R2201/003
摘要： Aspects of the disclosure provide a packaging technique for making a directional microphone which employs mechanical structures to cancel undesired background noise to realize the directional function instead of an extra sensor required in electronic noise-cancelling techniques, thus reducing footprint and cost of a directional microphone. A directional microphone based on this technique can include an acoustic sensor and a housing enclosing the acoustic sensor. The acoustic sensor can include a sensing diaphragm, a cavity below the sensing diaphragm, and a first substrate. The directional microphone device can further includes a channel with an inlet open at an edge of the first substrate and an outlet connected with the cavity. The housing can include a cover attached to a second substrate supporting the first substrate. The cover can include a first opening over the sensing diaphragm and a second opening at a side of the cover.
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公开(公告)号：US08525277B2
公开(公告)日：2013-09-03
申请号：US13079988
申请日：2011-04-05
申请人： Shogo Inaba
发明人： Shogo Inaba
IPC分类号： H01L29/84
CPC分类号： B81B3/0081 , B81B2207/99 , H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： A MEMS device includes a substrate, an insulating layer section formed above the substrate and having a cavity, a functional element contained in the cavity, and a fuse element contained in the cavity and electrically connected with the functional element. It is preferable that the fuse element is spaced apart from the substrate.
摘要翻译： MEMS器件包括衬底，形成在衬底上方并具有空腔的绝缘层部分，包含在空腔中的功能元件和容纳在腔中并与功能元件电连接的熔丝元件。 优选地，熔丝元件与基板间隔开。
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公开(公告)号：US08237263B2
公开(公告)日：2012-08-07
申请号：US12651002
申请日：2009-12-31
申请人： Ting-Hau Wu , Chun-Ren Cheng , Chun-Wen Cheng , Jiou-Kang Lee , Jung-Huei Peng , Shang-Ying Tsai , Te-Hsi Lee
发明人： Ting-Hau Wu , Chun-Ren Cheng , Chun-Wen Cheng , Jiou-Kang Lee , Jung-Huei Peng , Shang-Ying Tsai , Te-Hsi Lee
IPC分类号： H01L23/34
CPC分类号： H01L23/427 , B81B7/0093 , B81B2207/99 , F28D15/02 , F28F3/048 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit, a method of operating the integrated circuit, and a method of fabricating the integrated circuit are disclosed. According to one of the broader forms of the invention, a method and apparatus involve an integrated circuit that includes a heat transfer structure having a chamber that has a fluid disposed therein and that extends between a heat generating portion and a heat absorbing portion. Heat is absorbed into the fluid from the heat generating portion, and the fluid changes from a first phase to a second phase different from the first phase when the heat is absorbed. Heat is released from the fluid to the heat absorbing portion, and the fluid changes from the second phase to the first phase when the heat is released.
摘要翻译： 公开了集成电路，操作集成电路的方法以及制造集成电路的方法。 根据本发明的一个更广泛的形式，一种方法和装置包括集成电路，该集成电路包括一个传热结构，该传热结构具有一个具有设置在其中的流体并且在发热部分和吸热部分之间延伸的腔室。 热量从发热部分吸收到流体中，并且当热被吸收时，流体从第一相位变化到与第一相位不同的第二相位。 热量从流体释放到吸热部分，并且当释放热量时，流体从第二相变为第一相。
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公开(公告)号：US20240262678A1
公开(公告)日：2024-08-08
申请号：US18021582
申请日：2022-05-27
发明人： Jingwen GUO , Jianxing LIU , Jianyun ZHAO , Biqi LI
CPC分类号： B81B3/0008 , B81C1/00984 , B81B2201/01 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/0323 , B81B2203/04 , B81B2207/99 , B81C2201/0109 , B81C2201/0132
摘要： The present disclosure provides an MEMS device, a method for manufacturing an MEMS device and an electronic device, and belongs to the field of Micro-Electro-Mechanical System technology. The MEMS device includes: a first dielectric substrate and a first component on the first dielectric substrate; the first component and the first dielectric substrate enclose a movable space; the first component has a first portion corresponding to the movable space; the first portion has at least one first opening, and at least one protruding structure is on a side of the first portion close to the first dielectric substrate; orthographic projections of the at least one protruding structure and the at least one first opening on the first dielectric substrate do not overlap with each other, and a thickness of each protruding structure is smaller than a height of the movable space.
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公开(公告)号：US11760625B2
公开(公告)日：2023-09-19
申请号：US16613269
申请日：2018-05-23
CPC分类号： B81B5/00 , F16K99/0001 , G01N35/1072 , G05D7/0694 , B81B2201/051 , B81B2207/99
摘要： A microfluidic device (100) for mixing a liquid L is provided. The microfluidic device (100) comprises a microfluidic chamber (20), having an inlet (30), and arranged to receive the liquid L therein. In use, the microfluidic device (100) is arranged to control translation through the liquid L of a body B introduced therein, wherein the translation of the body B is due to a potential field acting on the body. In this way, the controlled translation of the body B mixes the liquid L in the microfluidic chamber (20).
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7.发明申请公开(公告)号：US20180127266A1
公开(公告)日：2018-05-10
申请号：US15867563
申请日：2018-01-10
发明人： Kurt Peter Wachtler , Makoto Yoshino , Ayumu Kuroda , Brian E. Goodlin , Karen Kirmse , Benjamin Cook , Genki Yano , Stuart Jacobsen
IPC分类号： B81B7/00
CPC分类号： B81B7/0048 , B81B7/0054 , B81B2207/012 , B81B2207/097 , B81B2207/99 , B81C1/00325 , B81C2203/0136 , B81C2203/0154 , H01L23/3107 , H01L23/3135 , H01L23/49541 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.
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公开(公告)号：US09446941B2
公开(公告)日：2016-09-20
申请号：US14568845
申请日：2014-12-12
申请人： Apple Inc.
发明人： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
CPC分类号： B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
摘要： MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
摘要翻译： 描述了MEMS封装，模块和制造方法。 在一个实施例中，MEMS封装包括安装在表面安装基板的正面上的MEMS管芯和IC管芯，以及在表面安装基板的前侧封装IC管芯和MEMS管芯的模塑料。 在一个实施例中，在表面安装基板的背侧上的着陆焊盘布置形成并固定平面区域，用于将表面安装基板粘合到不直接在MEMS管芯下方的模块基板。
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公开(公告)号：US20110241136A1
公开(公告)日：2011-10-06
申请号：US13079988
申请日：2011-04-05
申请人： Shogo INABA
发明人： Shogo INABA
IPC分类号： H01L29/84
CPC分类号： B81B3/0081 , B81B2207/99 , H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： A MEMS device includes a substrate, an insulating layer section formed above the substrate and having a cavity, a functional element contained in the cavity, and a fuse element contained in the cavity and electrically connected with the functional element. It is preferable that the fuse element is spaced apart from the substrate.
摘要翻译： MEMS器件包括衬底，形成在衬底上方并具有空腔的绝缘层部分，包含在空腔中的功能元件和容纳在腔中并与功能元件电连接的熔丝元件。 优选地，熔丝元件与基板间隔开。
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公开(公告)号：US20190055119A1
公开(公告)日：2019-02-21
申请号：US16109133
申请日：2018-08-22
CPC分类号： B81B7/0061 , B81B7/0038 , B81B2201/0257 , B81B2201/0264 , B81B2207/99 , H04R1/04 , H04R1/2876 , H04R1/44 , H04R17/02 , H04R19/005 , H04R19/04 , H04R2201/003
摘要： Aspects of the disclosure provide a packaging technique for making a directional microphone which employs mechanical structures to cancel undesired background noise to realize the directional function instead of an extra sensor required in electronic noise-cancelling techniques, thus reducing the footprint and cost of a directional microphone. A directional microphone based on this technique can include an acoustic sensor and a housing enclosing the acoustic sensor. The acoustic sensor can include a sensing diaphragm, a cavity below the sensing diaphragm, and a first substrate. The directional microphone device can further includes a channel with an inlet open at an edge of the first substrate and an outlet connected with the cavity. The housing can include a cover attached to a second substrate supporting the first substrate. The cover can include a first opening over the sensing diaphragm and a second opening at a side of the cover.
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