发明授权
- 专利标题： Method of lower profile MEMS package with stress isolations
- 专利标题（中）： 具有应力分离的低剖面MEMS封装的方法
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申请号： US14568845申请日： 2014-12-12
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公开(公告)号： US09446941B2公开(公告)日： 2016-09-20
- 发明人: Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
- 申请人： Apple Inc.
- 申请人地址： US CA Cupertino
- 专利权人： Apple Inc.
- 当前专利权人： Apple Inc.
- 当前专利权人地址： US CA Cupertino
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; B81B7/00
摘要：
MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
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