- 专利标题： STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL SYSTEM STACKED ONTO ELECTRONIC CIRCUIT CHIP
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申请号： US15867563申请日： 2018-01-10
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公开(公告)号： US20180127266A1公开(公告)日： 2018-05-10
- 发明人: Kurt Peter Wachtler , Makoto Yoshino , Ayumu Kuroda , Brian E. Goodlin , Karen Kirmse , Benjamin Cook , Genki Yano , Stuart Jacobsen
- 申请人： Texas Instruments Incorporated
- 主分类号： B81B7/00
- IPC分类号： B81B7/00
摘要：
A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.
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