公开(公告)号：US20250155319A1

公开(公告)日：2025-05-15

申请号：US18931867

申请日：2024-10-30

Applicant: CHROMA ATE INC.

Inventor： I-Chang Chiu ,  Hung-Ta Chien ,  Yu-Shuan Lin ,  Shih-Min Hsu ,  Li-Yang Chen ,  Tsung-Hsien Ou

IPC: G01M11/02 ,  H04N13/327

Abstract: A system and a method for calibration of optical measurement devices are described. In one embodiment, the optical measurement device comprises an imaging lens, and the calibration system includes a projection light source, a lens module, and a projection element. The light emitted from the projection light source passes through the projection element and is projected by the lens module, and then captured by the imaging lens of the optical measurement device. The exit pupil of the lens module in the calibration system is coincident with the entrance pupil of the imaging lens of the optical measurement device, providing a compact and highly efficient optical calibration mechanism.

公开(公告)号：US12264854B2

公开(公告)日：2025-04-01

申请号：US17976906

申请日：2022-10-31

Applicant: CHROMA ATE INC.

Inventor： Jian-Hung Lin ,  Shao-En Chung

IPC: F25B13/00 ,  F25B19/00 ,  F25B39/04 ,  F28C3/08

Abstract: A heat exchange device and a cooling system are provided. The heat exchange device includes a low-pressure chamber and a high-pressure chamber disposed in the low-pressure chamber. The low-pressure chamber has a first wall for enabling heat exchange and an output portion in communication with the outside to output the low-pressure fluid. The high-pressure chamber has an input portion in communication with the outside to admit the high-pressure fluid and nozzles in communication with the low-pressure chamber. The fluid discharged from the nozzles undergoes a pressure drop and undergoes heat exchange through the first wall. Cooling capability is developed in the heat exchange device and works in the heat exchange device to thereby dispense with a pipeline which must be otherwise provided to link an expansion process and an evaporation process of the fluid and may otherwise cause cooling capability loss, so as to greatly enhance heat exchange capability and cooling efficiency.

公开(公告)号：US12253541B2

公开(公告)日：2025-03-18

申请号：US18050500

申请日：2022-10-28

Applicant: CHROMA ATE INC.

Inventor： I-Shih Tseng ,  Xin-Yi Wu ,  I-Ching Tsai ,  Chin-Yi Ouyang

IPC: G01R1/04 ,  G01R31/28

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

公开(公告)号：US20250027987A1

公开(公告)日：2025-01-23

申请号：US18662134

申请日：2024-05-13

Applicant: CHROMA ATE INC.

Inventor： I-Shih Tseng ,  Chin-Yi Ou Yang ,  I-Ching Tsai ,  Xin-Yi Wu

IPC: G01R31/28 ,  G01R1/04

Abstract: An inspection system with a thermal interface, and an electronic component inspection device and method are provided. First, a temperature regulator contacts an electronic component to be tested, where there is a thermal interface between the temperature regulator and the electronic component to be tested, and the electronic component to be tested includes a plurality of temperature sensing units. Then, the temperature regulator heats or cools the electronic component to be tested to a specific temperature, and the plurality of temperature sensing units of the electronic component to be tested detect temperatures at locations of the temperature sensing units. In this way, a contact condition between the temperature regulator and the electronic component to be tested, and quality or an aging status of the thermal interface can be determined.

公开(公告)号：US12112964B2

公开(公告)日：2024-10-08

申请号：US17679158

申请日：2022-02-24

Applicant: Sheng-Hung Wang ,  Po-Hsiang Chang ,  Zhe-Min Liao

Inventor： Sheng-Hung Wang ,  Po-Hsiang Chang ,  Zhe-Min Liao

IPC: H01L21/673 ,  B25J15/06 ,  G01R31/28

CPC classification number: H01L21/67333 ,  B25J15/0616 ,  G01R31/2874 ,  G01R31/2893

Abstract: The invention provides a chip carrier, a chip testing module and a chip handling module. The chip carrier for carrying a plurality of chips comprises a main body with an upper surface and a lower surface. The main body has a plurality of air guide holes, and two ends of each air guide hole are respectively exposed on the upper surface and the lower surface. A part of the air guide holes are defined as a first group, and the air guide holes of the first group are connected. The main body is made of conductive material.

公开(公告)号：US12096593B2

公开(公告)日：2024-09-17

申请号：US17969207

申请日：2022-10-19

Applicant: CHROMA ATE INC.

Inventor： Po-Kai Cheng

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/20172 ,  H05K7/20436

Abstract: An inlet module is adapted to be disposed on a housing of an electronic device, and includes an insert board and at least one adjusting plate. The insert board has a plurality of first air passages, at least one second air passage, and at least one positioning unit. The second air passage is located between two of the first air passages, and has an area larger than that of each first air passage. The adjusting plate has an opening having an area smaller than that of the second air passage. The adjusting plate is operable to be positioned at a position where the opening and the second air passage are overlapped with each other, thereby reducing an area of the airflow passing through the second air passage.

公开(公告)号：US20240219435A1

公开(公告)日：2024-07-04

申请号：US18395276

申请日：2023-12-22

Applicant: CHROMA ATE INC.

Inventor： Jyun-Yi SU ,  Sheng-Shiuan JIAN ,  Ting-Ting CHANG ,  Wen-Yue CHUANG

IPC: G01R19/165

CPC classification number: G01R19/16566

Abstract: A source measure device includes a current sampling circuit, a voltage sampling circuit, an overvoltage detecting circuit, and a comparing circuit. The current sampling circuit is configured to sample a current of a device under test. The voltage sampling circuit is configured to sample a voltage of the device under test. The overvoltage detecting circuit is coupled to the current sampling circuit and the voltage sampling circuit, and receives a first operation voltage of the current sampling circuit and a second operation voltage of the voltage sampling circuit so as to generate a detection voltage. The comparing circuit is coupled to the overvoltage detecting circuit, and determines whether the detection voltage is within a voltage range. If the detection voltage is not within the voltage range, the comparing circuit generates an abnormal signal.

公开(公告)号：US12015239B2

公开(公告)日：2024-06-18

申请号：US17536153

申请日：2021-11-29

Applicant: CHROMA ATE INC.

Inventor： Sheng-Hung Wang ,  Po-Hsiang Chang

IPC: H01S5/00 ,  G01R31/26

CPC classification number: H01S5/0014 ,  G01R31/2635

Abstract: The present invention relates to a laser diode testing system and a laser diode testing method. The method comprises the steps of moving a laser bar or a plurality of laser diodes to a first test station by means of a first transfer device; then, electrically contacting each laser diode by a first probe module in sequence; measuring electrical and optical characteristics of the laser diodes electrically contacted by the first probe module sequentially by means of a first measuring device; moving the laser bar or the plurality of laser diodes out of the first test station by means of the first transfer device, wherein a magnetic field generated by an electromagnetic generating unit of an electromagnetic slide interacts with a magnetic field of a permanent magnet of the first transfer device, so that the first transfer device is driven and moved.

公开(公告)号：US20240097216A1

公开(公告)日：2024-03-21

申请号：US18207171

申请日：2023-06-08

Applicant: CHROMA ATE INC.

Inventor： CHUAN-TSE LIN ,  CHEN-CHOU WEN ,  SHIH-CHIN TAN ,  WEN-CHUAN CHANG ,  YING-CHENG CHEN

IPC: H01M10/42 ,  H01M10/48

CPC classification number: H01M10/4285 ,  H01M10/48

Abstract: The present invention discloses a detection device and a probe module thereof, wherein an electrical connection path between a battery detection frame and a battery under test is provided via the probe module. The probe module includes a base, a first polarity plate, a second polarity plate, a first upper connection group, a second upper connection group, a first lower connection member and a second lower connection member. Via the first polarity plate, the first upper connection group is correspondingly coupled to the battery detection frame, and the first lower connection member is correspondingly coupled to the battery under test. Via the second polarity plate, the second upper connection group is correspondingly coupled to the battery detection frame, and the second lower connection member is correspondingly coupled to the battery under test. Thus, it is not necessary to process a cable having been fixed on the battery detection frame when the probe module is replaced. Moreover, since each polarity has dedicated coupling elements respectively corresponding to the battery detection frame and the battery under test, reliability is enhanced.

公开(公告)号：US11901833B2

公开(公告)日：2024-02-13

申请号：US17938055

申请日：2022-10-05

Applicant: CHROMA ATE INC.

Inventor： Cheng Chung Lee ,  Szu Chieh Su ,  Wen Chih Chen ,  Chih Hsing Lin ,  Jhen Wei Gong

IPC: H02M5/44 ,  H02M1/00

CPC classification number: H02M5/44 ,  H02M1/0009

Abstract: Systems and methods for switching between a power supply mode and an electronic load mode are disclosed. For switching from the power supply mode to the electronic load mode, the method comprises the steps of: deactivating a power element; activating a current control module and a phase-locked loop to obtain a voltage phase of a device under test; calculating a turn-on amount of the power element according to a current setting value and the voltage phase; and causing the power element to generate a load current for the device under test. For switching from the electronic load mode to the power supply mode, the method comprises the steps of: deactivating the power element; activating a voltage control module; calculating the turn-on amount of the power element according to a voltage setting value; and causing the power element to input a corresponding voltage to the device under test.