公开(公告)号：US20250027987A1

公开(公告)日：2025-01-23

申请号：US18662134

申请日：2024-05-13

Applicant: CHROMA ATE INC.

Inventor： I-Shih Tseng ,  Chin-Yi Ou Yang ,  I-Ching Tsai ,  Xin-Yi Wu

IPC: G01R31/28 ,  G01R1/04

Abstract: An inspection system with a thermal interface, and an electronic component inspection device and method are provided. First, a temperature regulator contacts an electronic component to be tested, where there is a thermal interface between the temperature regulator and the electronic component to be tested, and the electronic component to be tested includes a plurality of temperature sensing units. Then, the temperature regulator heats or cools the electronic component to be tested to a specific temperature, and the plurality of temperature sensing units of the electronic component to be tested detect temperatures at locations of the temperature sensing units. In this way, a contact condition between the temperature regulator and the electronic component to be tested, and quality or an aging status of the thermal interface can be determined.

公开(公告)号：US09658283B2

公开(公告)日：2017-05-23

申请号：US14669783

申请日：2015-03-26

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Jui-Che Chou ,  Meng-Kung Lu ,  Chin-Yi Ou Yang

IPC: G01R31/28 ,  H05K7/20

CPC classification number: G01R31/2877 ,  G01R31/2874 ,  H05K7/20136 ,  H05K7/20254

Abstract: A radiator module system for automatic test equipment, including a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head, and an internal channel is formed within and passing through the test head. The closed-loop circulating cooling device includes an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel in which a working fluid flows; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The working fluid is driven by the driving source to flow within the closed-loop circulating channel to perform heat dissipation.

公开(公告)号：US09470749B2

公开(公告)日：2016-10-18

申请号：US14108176

申请日：2013-12-16

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Hsuan-Jen Shen ,  Chien-Ming Chen ,  Chin-Yi Ou Yang

IPC: G01R31/28 ,  G01N1/42

CPC classification number: G01R31/2877 ,  G01N1/42 ,  G01R31/2865

Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

Abstract translation: 试验装置包括试验部位，缓冲载体装置，输送装置，搬运机构以及干燥空气引导机构。 测试站点对对象执行测试程序。 缓冲载体装置靠近试验部位的一侧设置，保持物体并进行温度调节处理。 运送装置靠近试验场的另一侧，沿运送方向前后移动，运送物体进出试验场地，并加热物体。 处理机构携带缓冲运送装置，试验部位和运送装置中的物体。 干燥空气流动引导机构引导干燥空气围绕测试场所，缓冲装置，输送装置和处理机构，并产生干燥环境以防止结露。

公开(公告)号：US09638740B2

公开(公告)日：2017-05-02

申请号：US14048785

申请日：2013-10-08

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming Chen ,  Herbert Tsai ,  Chin-Yi Ou Yang

IPC: G01R31/26 ,  G01R31/28

CPC classification number: G01R31/2601 ,  G01R31/2887 ,  G01R31/2893

Abstract: A test system with rotational test arms for testing semiconductor components includes a transport device, a first test socket, a second test socket, a first test arm, and a second test arm. The first test socket and the second test socket are electrically connected to different test signals respectively and correspond to the first test arm and the second test arm. The first test arm and the second test arm test arms operate rotationally to carry and place the semiconductor components to the transport device, the first test socket and the second test socket, so the test time is improved.