公开(公告)号：US09470749B2

公开(公告)日：2016-10-18

申请号：US14108176

申请日：2013-12-16

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Hsuan-Jen Shen ,  Chien-Ming Chen ,  Chin-Yi Ou Yang

IPC: G01R31/28 ,  G01N1/42

CPC classification number: G01R31/2877 ,  G01N1/42 ,  G01R31/2865

Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

Abstract translation: 试验装置包括试验部位，缓冲载体装置，输送装置，搬运机构以及干燥空气引导机构。 测试站点对对象执行测试程序。 缓冲载体装置靠近试验部位的一侧设置，保持物体并进行温度调节处理。 运送装置靠近试验场的另一侧，沿运送方向前后移动，运送物体进出试验场地，并加热物体。 处理机构携带缓冲运送装置，试验部位和运送装置中的物体。 干燥空气流动引导机构引导干燥空气围绕测试场所，缓冲装置，输送装置和处理机构，并产生干燥环境以防止结露。

公开(公告)号：US09353995B2

公开(公告)日：2016-05-31

申请号：US14291573

申请日：2014-05-30

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Jui-Chih Chou ,  Hsuan-Jen Shen

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  F28D15/00 ,  H01L23/473

CPC classification number: F28D15/00 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.

Abstract translation: 用于插座的温度控制模块设置有上对接板和下对接板。 上对接板具有用于容纳插座的凹部和两个温度控制流体通道。 通路的一端与凹部连通，另一端与温度调节型流体源连接。 下对接板设置在上对接板下方并覆盖凹部。 流体室由对接板，下部对接板和插座的凹部形成。 温度控制流体源通过温度控制流体通道将温度控制流体输出到流体室，用于将插座保持在特定温度。