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Patent Agency Ranking
公开(公告)号：US09658283B2
公开(公告)日：2017-05-23
申请号：US14669783
申请日：2015-03-26
Applicant: CHROMA ATE INC.
Inventor： Xin-Yi Wu , Jui-Che Chou , Meng-Kung Lu , Chin-Yi Ou Yang
CPC classification number: G01R31/2877 , G01R31/2874 , H05K7/20136 , H05K7/20254
Abstract: A radiator module system for automatic test equipment, including a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head, and an internal channel is formed within and passing through the test head. The closed-loop circulating cooling device includes an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel in which a working fluid flows; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The working fluid is driven by the driving source to flow within the closed-loop circulating channel to perform heat dissipation.
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公开(公告)号：US11333704B2
公开(公告)日：2022-05-17
申请号：US16559701
申请日：2019-09-04
Applicant: Chroma Ate Inc.
Inventor： Chin-Yi Ouyang , Chien-Ming Chen , Meng-Kung Lu
Abstract: The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.
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公开(公告)号：US20200081060A1
公开(公告)日：2020-03-12
申请号：US16559701
申请日：2019-09-04
Applicant: Chroma Ate Inc.
Inventor： Chin-Yi Ouyang , Chien-Ming Chen , Meng-Kung Lu
Abstract: The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.
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公开(公告)号：US10948518B2
公开(公告)日：2021-03-16
申请号：US16417833
申请日：2019-05-21
Applicant: Chroma Ate Inc.
Inventor： Chien-Ming Chen , Meng-Kung Lu , Yung-Chih Chen
IPC: G01R1/04
Abstract: A test apparatus for testing electronic device comprises a lower base, an upper base and a pressing force generating module disposed between the upper and lower bases. The lower base having a chip socket for receiving a plurality of probes, and a test socket plate having a first guiding device, each of the probes has a spring force stored therein. The upper base having a second guiding device coupled to the first guiding device. When an electronic device is placed in the chip socket, and the upper base is slidably moved with respect to the lower base by the cooperative actions between the first and second guiding devices, so that the pressing force generating module is in alignment with the electronic device for applying a pressing force on the electronic device, and the pressing force being greater than the sum of the spring forces generated by the plurality of probes.
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公开(公告)号：US09347989B2
公开(公告)日：2016-05-24
申请号：US13875660
申请日：2013-05-02
Applicant: CHROMA ATE INC.
Inventor： Chien-Ming Chen , Meng-Kung Lu
CPC classification number: G01R31/2887 , G01R31/2896
Abstract: A test device is provided for testing a bottom chip of a package-on-package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts is installed on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.
Abstract translation: 提供了一种用于测试封装封装（PoP）堆叠芯片的底部芯片的测试设备。 底部芯片的上表面具有用于电连接PoP堆叠芯片的顶部芯片的多个对应焊接点的多个焊接点。 测试装置包括测试头和多个测试触点。 测试头内部安装了顶部芯片。 多个测试触点安装在测试头的下表面上并电连接到测试头内的顶部芯片的多个对应焊接点。 当测试头的下表面接触底部芯片的上表面时，多个测试触点电连接到多个焊接点以测试底部芯片。
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