摘要:
A method of manufacturing a semiconductor device includes preparing a semiconductor wafer having a device area, an end face, and a surface peripheral area located outside the device area and between the end face and the device area. Forming a Cu layer on the semiconductor wafer and rotating the wafer in a horizontal plane. Emitting a first liquid from an edge nozzle towards the surface peripheral area which selectively removes a first unnecessary material in the surface peripheral area. Emitting a protecting liquid toward the semiconductor wafer, thereby protecting the device area from the first liquid. An angle of a longitudinal axis of the edge nozzle with respect to a tangent of the semiconductor wafer at a point, where the longitudinal axis of the edge nozzle intersects the end face of the wafer, is set in the range of 0 to 90 degrees in plan view.
摘要:
A remote troubleshooting system comprises a vehicle that transmits vehicle data regarding a stress factor of a specific onboard component at a specified timing, and a troubleshooting server that is connected to the vehicle via a network, receives the vehicle data from the vehicle, and performs the troubleshooting of the onboard component. The server determines a precaution level based on the vehicle data from the vehicle, selects a troubleshooting program that is suitable to the precaution level determined, and transmits this to the vehicle. The vehicle replaces the troubleshooting program currently stored by a memory with the troubleshooting program received. Thereby, the reliability of the troubleshooting can be improved.
摘要:
A first insulating film with a dielectric constant lower than that of a silicon oxide film is formed on a semiconductor substrate. Next, a metal film or a second insulating film, which has degrees of moisture absorption and deformation in an oxygen plasma process and exposure to a resist releasing solution equal to or less than those of a silicon oxide film, is formed on the first insulating film. Then, the metal film or the second insulating film is patterned to a prescribed pattern. An opening is formed in the first insulating film using the metal film or the second insulating film as a mask.
摘要:
An etching/cleaning apparatus is provided, which makes it possible to effectively remove an unnecessary material or materials existing on a semiconductor wafer without damaging the device area with good controllability. The apparatus comprises (a) a rotating means for holding a semiconductor wafer and for rotating the wafer in a horizontal plane; the wafer having a device area and a surface peripheral area on its surface; the surface peripheral area being located outside the device area; and (b) an edge nozzle for emitting an etching/cleaning liquid toward a surface peripheral area of the wafer. The etching/cleaning liquid emitted from the edge nozzle selectively removes an unnecessary material existing in the surface peripheral area. The etching/cleaning liquid emitted from the edge nozzle preferably has an emission direction oriented along a rotation direction of the wafer or outward with respect to a tangent of the wafer formed near a contact point of the liquid with the surface peripheral area of the wafer. A back nozzle may be additionally provided to emit an etching/cleaning liquid toward a back center of the wafer. A surface nozzle may be additionally provided to emit a protecting liquid toward a surface center of the wafer, covering the device area to protect the same against the etching/cleaning liquid.
摘要:
The present invention provides a solid soap composition comprising: a soap component (a); polyoxyalkylene-modified polysiloxane (b) that is expressed by formula (1) below, (where, R1 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, m represents an integer of 1 to 60, n represents an integer of 1 to 60, a represents an integer of 1 to 10, b represents an integer of 1 to 30, and c represents an integer of 0 to 30); and tetrakis (2-hydroxyalkyl) ethylene diamine (c) that is expressed by formula (2) below, (where, R2 to R5 are the same or different and each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms), as essential components. According to the present invention, it is possible to provide a cleaning agent capable of performing makeup removal and ordinary facial cleaning at the same time in single facial cleaning, that has sufficient foaming property, that provides a clean feel after cleaning, and that can sufficiently remove not only cosmetic foundations but also acid pigments.
摘要:
In an apparatus, after completion of a CMP (i.e., chemical mechanical polishing) operation of a semiconductor wafer, the thus polished wafer is temporarily stored in a water tank before it is subjected to a post-CMP cleaning operation. During its storage period in the water tank, the wafer is prevented from being chemically attacked by an oxidizing agent contained in an abrasive used in the CMP operation. The apparatus includes: the water tank for storing the wafer therein; a pure water supply pipe for supplying pure water to the water tank; an anticorrosion agent supply pipe for supplying an anticorrosion agent to the pure water; a drain pipe connected with a lower portion of the water tank to discharge the water from the water tank; a return pipe for returning the discharged water to an upper portion of the water tank through a pump and a filter, the return pipe branching-off from the drain pipe; and, valves mounted on these pipes. The water tank is filled with pure water, to which an anticorrosion agent (i.e., benzotriazole) is added to prepare a solution in which the wafer is immersed after polishing.
摘要:
An etching/cleaning method makes it possible to effectively remove unnecessary materials on a semiconductor wafer, having a surface peripheral area and a surface device area, without damaging the device area. The semiconductor is rotated in a horizontal plane while an etching/cleaning liquid is emitted by an edge nozzle toward the surface peripheral area, thereby selectively etching an unnecessary material in the surface peripheral area. The etching/cleaning liquid emitted from the edge nozzle preferably has an emission direction oriented along a rotation direction of the wafer or outward with respect to a tangent of the wafer formed near a contact point of the liquid with the surface peripheral area of the wafer.
摘要:
A first insulating film with a dielectric constant lower than that of a silicon oxide film is formed on a semiconductor substrate. Next, a second insulating film, which has degrees of moisture absorption and deformation in an oxygen plasma process and exposure to a resist releasing solution equal to or less than those of a silicon oxide film, is formed on the first insulating film. Then, a third insulating film, which has degrees of moisture absorption and deformation in an oxygen plasma process and exposure to a resist releasing solution equal to or less than those of a silicon oxide film are formed on the second insulating film. Thereafter, the third insulating film is patterned to a prescribed pattern. An opening is formed in the first and second insulating films using the third insulating film as a mask.
摘要:
A stereoscopic display device includes: a parallax barrier in which light transmission parts that transmit light and light shielding parts that block light are formed alternately, and a display panel that displays a stereoscopic image. A plurality of pixels for displaying the stereoscopic image are formed on the display panel. Each pixel includes a plurality of color forming subpixels that contribute to the color formation of the stereoscopic image, and a contrasting subpixel that contributes to the contrast of the stereoscopic image. In each pixel, the contrasting subpixel is positioned at both ends of the pixel in a direction in which the light transmission parts and the light shielding parts are arranged alternately. In each pixel that overlaps the light shielding part when the display panel is viewed from front, the contrasting subpixel is positioned at both ends of the light shielding part.