公开(公告)号：US6140225A

公开(公告)日：2000-10-31

申请号：US104714

申请日：1998-06-25

申请人： Tatsuya Usami ,  Hidemitsu Aoki ,  Yasuaki Tsuchiya ,  Shinya Yamasaki

发明人： Tatsuya Usami ,  Hidemitsu Aoki ,  Yasuaki Tsuchiya ,  Shinya Yamasaki

IPC分类号： H01L21/302 ,  H01L21/033 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/312 ,  H01L21/3205 ,  H01L21/3213 ,  H01L21/768 ,  H01L23/522 ,  H01L21/4753 ,  H01L21/461

CPC分类号： H01L21/32139 ,  H01L21/0332 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/3205 ,  H01L21/32136 ,  H01L21/76802 ,  H01L21/76811 ,  H01L21/76813 ,  H01L21/3124

摘要： A first insulating film with a dielectric constant lower than that of a silicon oxide film is formed on a semiconductor substrate. Next, a second insulating film, which has degrees of moisture absorption and deformation in an oxygen plasma process and exposure to a resist releasing solution equal to or less than those of a silicon oxide film, is formed on the first insulating film. Then, a third insulating film, which has degrees of moisture absorption and deformation in an oxygen plasma process and exposure to a resist releasing solution equal to or less than those of a silicon oxide film are formed on the second insulating film. Thereafter, the third insulating film is patterned to a prescribed pattern. An opening is formed in the first and second insulating films using the third insulating film as a mask.

摘要翻译： 在半导体衬底上形成介电常数比氧化硅膜低的第一绝缘膜。 接下来，在第一绝缘膜上形成第二绝缘膜，其在氧等离子体处理中具有吸湿变形程度，并且暴露于等于或小于氧化硅膜的抗蚀剂释放溶液。 然后，在第二绝缘膜上形成第三绝缘膜，其在氧等离子体处理中具有吸湿变形程度，并且暴露于等于或小于氧化硅膜的抗蚀剂释放溶液。 此后，将第三绝缘膜图案化为规定的图案。 使用第三绝缘膜作为掩模在第一绝缘膜和第二绝缘膜中形成开口。