公开(公告)号：US20090315690A1

公开(公告)日：2009-12-24

申请号：US12483192

申请日：2009-06-11

申请人： Yong-Jin HWANG ,  Won-Seok JOO ,  Young-Min LEE

发明人： Yong-Jin HWANG ,  Won-Seok JOO ,  Young-Min LEE

IPC分类号： G08B6/00

CPC分类号： G06F3/041 ,  G06F1/1626 ,  G06F3/016 ,  G06F3/04886 ,  G06F2203/014

摘要： A portable terminal and method of providing tactile sensation responsive to user touching at the portable terminal is provided. The portable terminal includes a housing disposed beneath a touch screen display, such that the housing is configured to impact the touch screen display in response to a user input impressed by touch on at least a portion of the touch screen display, the housing including at least one magnetic device configured to collide with the housing. The portable terminal further including a magnetic actuator disposed relative to the at least one magnetic device, such that the magnetic actuator controls a first magnetism that displaces the least one magnetic device having a second magnetism thereby creating the impact between the at least one magnetic device and the housing.

摘要翻译： 提供一种响应用户在便携式终端触摸的提供触感的便携式终端和方法。 便携式终端包括设置在触摸屏显示器下方的壳体，使得壳体被配置为响应于在触摸屏显示器的至少一部分上的触摸而被触摸的用户输入而影响触摸屏显示器，该壳体至少包括 一个磁性装置被配置为与壳体碰撞。 便携式终端还包括相对于至少一个磁性装置设置的磁性致动器，使得磁性致动器控制使具有第二磁性的至少一个磁性装置移位的第一磁性，从而在至少一个磁性装置和 住房。

公开(公告)号：US20120306284A1

公开(公告)日：2012-12-06

申请号：US13470756

申请日：2012-05-14

申请人： Kyung-Woo LEE ,  Kang-Ho BYUN ,  Young-Min LEE ,  Se-Ho PARK

发明人： Kyung-Woo LEE ,  Kang-Ho BYUN ,  Young-Min LEE ,  Se-Ho PARK

IPC分类号： H02J17/00

CPC分类号： H02J50/12 ,  H02J5/005 ,  H02J7/0013 ,  H02J7/025 ,  H02J17/00 ,  H02J50/40 ,  H02J50/80 ,  H04B5/0037

摘要： Provided is a transmitter in a wireless power transmission system, the transmitter including a Transmission (Tx) power converter for converting a Direct Current (DC) voltage into a first Alternating Current (AC) voltage, and converting the converted first AC voltage into a second AC voltage by amplifying the converted first AC voltage, a Tx matching circuit for matching an impedance thereof with that of a receiver for receiving the second AC voltage to transmit the second AC voltage, a Tx resonator for resonating the second AC voltage into resonant waves to transmit the second AC voltage to the receiver, and a Tx controller for determining an amplification rate of the first AC voltage and controlling the Tx power converter to convert the first AC voltage into the second AC voltage according to the determined amplification rate.

摘要翻译： 提供了一种无线电力传输系统中的发射机，所述发射机包括用于将直流（DC）电压转换成第一交流电（AC）电压的传输（Tx）功率转换器，并将转换的第一AC电压转换成第二 通过放大转换的第一AC电压的交流电压，将其阻抗匹配的Tx匹配电路与用于接收第二AC电压以接收第二AC电压的接收器的Tx匹配电路，用于将第二AC电压谐振到共振波的Tx谐振器 将第二AC电压发送到接收器，以及Tx控制器，用于确定第一AC电压的放大率，并且根据确定的放大率控制Tx功率转换器将第一AC电压转换为第二AC电压。

公开(公告)号：US20120293010A1

公开(公告)日：2012-11-22

申请号：US13474330

申请日：2012-05-17

申请人： Woo-Ram LEE ,  Joon-II KIM ,  Sung-Bum PARK ,  Young-Min LEE ,  Hong-Kweun KIM ,  Se-Ho PARK ,  Seung-Woo HAN

发明人： Woo-Ram LEE ,  Joon-II KIM ,  Sung-Bum PARK ,  Young-Min LEE ,  Hong-Kweun KIM ,  Se-Ho PARK ,  Seung-Woo HAN

IPC分类号： H02J17/00

CPC分类号： H02J5/005 ,  H02J7/025 ,  H02J17/00 ,  H02J50/12 ,  H02J50/80 ,  H02J50/90

摘要： A wireless power transmission controlling apparatus and method are provided. The apparatus includes a power amplifier that receives a source power, amplifies the received source power, and outputs a wireless power transmission signal from the amplified received source power, a band pass filter that filters the wireless power transmission signal, and passes a harmonic wave corresponding to a communication frequency band, and a communication unit that transmits a wireless power transmission control signal using the harmonic wave corresponding to the communication frequency band.

摘要翻译： 提供一种无线电力传输控制装置和方法。 该装置包括：功率放大器，接收源功率，放大接收的源功率，并从放大的接收源功率输出无线功率传输信号;滤波器，对通过无线功率传输信号进行滤波，并传递相应的谐波; 通信单元，其使用与通信频带对应的谐波发送无线电力传输控制信号。

公开(公告)号：US20120293007A1

公开(公告)日：2012-11-22

申请号：US13473062

申请日：2012-05-16

申请人： Kang-Ho BYUN ,  Kyung-Woo LEE ,  Young-Min LEE ,  Se-Ho PARK ,  Yu-Su KIM ,  Sung-Ku YEO

发明人： Kang-Ho BYUN ,  Kyung-Woo LEE ,  Young-Min LEE ,  Se-Ho PARK ,  Yu-Su KIM ,  Sung-Ku YEO

IPC分类号： H02J17/00

CPC分类号： H02J50/12 ,  B60L11/182 ,  H02J5/005 ,  H02J7/025 ,  H02J17/00 ,  H02J50/40 ,  H02J50/60 ,  H02J50/80 ,  H04B5/0037

摘要： A method and power transmitter for efficiently controlling power transmission to one or more power receivers in a wireless multi-power transmission system are provided. The method includes performing, when a predetermined measurement cycle arrives, a load measurement; comparing a current load measurement value with a previous load measurement value; determining whether the current load measurement value is increased over the previous load measurement value by at least as much as a first predetermined threshold; gradually increasing, when the load measurement value is increased over the previous load measurement value by at least as much as the first threshold, a transmission power value until a request for a subscription to a wireless multi-power transmission network from a power reception target within a predetermined time limit; and stopping, when the request for the subscription is not received before the time limit is exceeded, power transmission to the power reception target.

摘要翻译： 提供一种用于有效地控制到无线多功率传输系统中的一个或多个功率接收器的功率传输的方法和功率发射器。 该方法包括当预定测量周期到达时执行负载测量; 将当前负载测量值与先前的负载测量值进行比较; 确定当前负载测量值是否比先前的负载测量值增加至少多达第一预定阈值; 逐渐增加，当负载测量值比先前的负载测量值增加至少与第一阈值相同时，直到来自受电目标内的对无线多功率传输网络的订阅请求的发送功率值 预定的时间限制; 并且当在超过时间限制之前未接收到订阅请求时停止向电力接收目标的电力传输。

公开(公告)号：US20100025080A1

公开(公告)日：2010-02-04

申请号：US12512588

申请日：2009-07-30

申请人： Se-Ho PARK ,  Ki-Huyn KIM ,  Seok-Myong KANG ,  Young-Min LEE

发明人： Se-Ho PARK ,  Ki-Huyn KIM ,  Seok-Myong KANG ,  Young-Min LEE

IPC分类号： H05K1/00 ,  H05K3/10

CPC分类号： H05K3/246 ,  H05K1/092 ,  H05K1/095 ,  H05K2201/0347 ,  H05K2203/1131 ,  Y10T29/49155

摘要： A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.

摘要翻译： 提供印刷电路板（PCB）及其制造方法。 通过在基板上印刷导电油墨/糊料，并且通过加热来烧结导电油墨层或固化导电浆料层而形成电路图案。 通过电路图案上的高熔点金属的化学镀或电解电镀形成初级镀层。 通过在主镀层上的贵金属的化学镀或电解电镀形成二次镀层，以改善用焊料的润湿。

公开(公告)号：US20170196963A1

公开(公告)日：2017-07-13

申请号：US15303375

申请日：2015-04-10

申请人： Young-Min LEE

发明人： Young-Min LEE

IPC分类号： A61K39/12 ,  G01N33/50 ,  C07K14/005

CPC分类号： A61K39/12 ,  A61K2039/525 ,  C07K14/005 ,  C12N7/00 ,  C12N2770/24111 ,  C12N2770/24122 ,  C12N2770/24134 ,  C12N2770/24143 ,  C12N2770/24152 ,  C12Q1/18 ,  G01N33/502 ,  G01N2333/18 ,  G01N2333/185 ,  G01N2800/26

摘要： A group of mosquito-borne flaviviruses that cause fatal encephalitis in humans is among the most important of all emerging human pathogens of global significance. This group includes Japanese encephalitis virus (JEV), West Nile virus, St. Louis encephalitis virus, and Murray Valley encephalitis virus. In the present disclosure, the first reverse genetics system has been developed for SA14-14-2, a live JE vaccine that is most commonly used in most JE-endemic areas, by constructing an infectious bacterial artificial chromosome that contains the full-length SA14-14-2 cDNA. Using this infectious SA 14-14-2 cDNA, combined with a mouse model for JEV infection, a key viral neurovirulence factor has been discovered that is a conserved single amino acid in the ij hairpin adjacent to the fusion loop of the viral E glycoprotein, which regulates viral infectivity into neurons within the central nervous system.

公开(公告)号：US20110228490A1

公开(公告)日：2011-09-22

申请号：US13050378

申请日：2011-03-17

申请人： Yu-Su KIM ,  Kyu-Sub Kwak ,  Young-Min LEE ,  Shi-Yun Cho ,  Jea-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

发明人： Yu-Su KIM ,  Kyu-Sub Kwak ,  Young-Min LEE ,  Shi-Yun Cho ,  Jea-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

IPC分类号： H05K1/18

CPC分类号： H05K3/323 ,  H05K1/189 ,  H05K2201/10159

摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.

摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。

公开(公告)号：US20080012112A1

公开(公告)日：2008-01-17

申请号：US11752790

申请日：2007-05-23

申请人： Young-Min LEE

发明人： Young-Min LEE

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided are a semiconductor package having an advantage for stacking and a stack-type semiconductor package using the semiconductor package. In one embodiment, the semiconductor package includes a wing-type substrate comprising a first surface, a second surface opposite the first surface, a chip pad area, an external terminal area on the first surface and a stack-type terminal pad on the second surface, wherein the chip pad area is lower than the external terminal area; a semiconductor chip mounted on the wing-type substrate within the chip pad area, wherein the semiconductor chip is electrically connected to the wing-type substrate; a sealing part on the wing-type substrate, the sealing part sealing the semiconductor chip and the wing-type substrate; and a conductive connecting member on the external terminal area, wherein a height of the conductive connecting member is greater than a height of the wing-type substrate.

摘要翻译： 提供了具有堆叠优点的半导体封装和使用半导体封装的堆叠型半导体封装。 在一个实施例中，半导体封装包括翼型衬底，其包括第一表面，与第一表面相对的第二表面，芯片焊盘区域，第一表面上的外部端子区域和第二表面上的堆叠型端子焊盘 ，其中所述芯片焊盘区域低于所述外部端子区域; 安装在所述芯片焊盘区域内的所述翼型基板上的半导体芯片，其中所述半导体芯片电连接到所述翼型基板; 翼型基板上的密封部，密封半导体芯片和翼型基板的密封部; 以及在所述外部端子区域上的导电连接构件，其中所述导电连接构件的高度大于所述机翼型衬底的高度。

公开(公告)号：US20160043045A1

公开(公告)日：2016-02-11

申请号：US14920927

申请日：2015-10-23

申请人： Nam-Gyu BAEK ,  Young-Min LEE ,  Yun-Rae CHO ,  Sun-Dae KIM

发明人： Nam-Gyu BAEK ,  Young-Min LEE ,  Yun-Rae CHO ,  Sun-Dae KIM

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/768

CPC分类号： H01L24/03 ,  H01L21/563 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05025 ,  H01L2224/05085 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/08113 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： A pad structure usable with a semiconductor device may include an insulating layer pattern structure, a plug, and a pad. The insulating layer pattern structure has a plug hole and at least one via hole. The plug is formed in the plug hole. The pad is formed on the insulating layer pattern structure. The pad is electrically connected with the plug and has a lower surface and an uneven upper surface. The lower surface includes a protruded portion inserted into the via hole. The uneven upper surface includes a recessed portion and an elevated portion—to provide high roughness and firm connection.

摘要翻译： 可用于半导体器件的焊盘结构可以包括绝缘层图案结构，插头和焊盘。 绝缘层图案结构具有插塞孔和至少一个通孔。 插头形成在插头孔中。 衬垫形成在绝缘层图案结构上。 垫与插头电连接，具有下表面和不平的上表面。 下表面包括插入通孔的突出部分。 不平坦的上表面包括凹部和升高部分，以提供高粗糙度和牢固的连接。

公开(公告)号：US20120293011A1

公开(公告)日：2012-11-22

申请号：US13474338

申请日：2012-05-17

申请人： Kang-Ho BYUN ,  Kyung-Woo LEE ,  Young-Min LEE ,  Se-Ho PARK ,  Yu-Su KIM ,  Sung-Ku YEO

发明人： Kang-Ho BYUN ,  Kyung-Woo LEE ,  Young-Min LEE ,  Se-Ho PARK ,  Yu-Su KIM ,  Sung-Ku YEO

IPC分类号： H02J17/00

CPC分类号： H02J7/025 ,  H02J7/0004 ,  H02J7/0027 ,  H02J50/12 ,  H02J50/40 ,  H02J50/80

摘要： An apparatus and method are provided for transmitting and receiving power for wireless power transmission. A power transmitting apparatus includes a power supplier for generating power; a resonator for transmitting the power generated by the power supplier to a plurality of power receiving apparatuses; and a controller for determining whether a power transmission to a new power receiving apparatus is possible using a power receiving apparatus management table, when the new power receiving apparatus is detected while the power transmissions of the plurality of power receiving apparatuses are being performed, and controlling the resonator to transmit power to the new power receiving apparatus, when the power transmission to the new receiving apparatus is possible. The power transmitting apparatus stably supplies power to a plurality of power receiving apparatuses by determining power transmission states of the plurality of power receiving apparatuses.

摘要翻译： 提供了用于无线电力传输的发送和接收电力的装置和方法。 电力传输装置包括用于发电的电源; 谐振器，用于将由电力供应器产生的电力发送到多个电力接收装置; 以及控制器，用于使用电力接收设备管理表来确定是否可以使用电力接收设备管理表，当在正在执行多个电力接收设备的电力传输的同时检测到新的电力接收设备时， 当向新的接收设备的电力传输是可能的时，谐振器向新的电力接收设备发送电力。 电力传输装置通过确定多个电力接收装置的电力传输状态，稳定地向多个电力接收装置供电。