公开(公告)号：US08410030B2

公开(公告)日：2013-04-02

申请号：US13461105

申请日：2012-05-01

申请人： William C. Ward ,  Richard A. Denis

发明人： William C. Ward ,  Richard A. Denis

IPC分类号： C10M173/02

CPC分类号： C10M169/06 ,  C10M125/26 ,  C10M141/12 ,  C10M2201/087 ,  C10M2201/1036 ,  C10M2201/1056 ,  C10M2207/1206 ,  C10M2207/1285 ,  C10M2207/129 ,  C10M2207/34 ,  C10M2215/1026 ,  C10M2215/28 ,  C10M2217/0456 ,  C10M2219/044 ,  C10M2219/0466 ,  C10N2220/082 ,  C10N2230/00 ,  C10N2230/06 ,  C10N2240/40 ,  C10N2250/10 ,  C10N2250/12 ,  C10N2270/00 ,  C10N2210/01 ,  C10N2210/04 ,  C10N2210/03 ,  C10N2210/02

摘要： The present invention relates to a lubricating composition containing an alkali metal borate. The invention further provides for a method of lubricating a device with grease or a metalworking fluid by employing the lubricating composition containing the alkali metal borate.

摘要翻译： 本发明涉及含有碱金属硼酸盐的润滑组合物。 本发明还提供了通过使用含有碱金属硼酸盐的润滑组合物来润滑具有油脂或金属加工液的装置的方法。

公开(公告)号：US20120214716A1

公开(公告)日：2012-08-23

申请号：US13461105

申请日：2012-05-01

申请人： William C. Ward ,  Richard A. Denis

发明人： William C. Ward ,  Richard A. Denis

IPC分类号： C10M129/70 ,  C10M129/44 ,  C10M129/72 ,  C10M125/26

CPC分类号： C10M169/06 ,  C10M125/26 ,  C10M141/12 ,  C10M2201/087 ,  C10M2201/1036 ,  C10M2201/1056 ,  C10M2207/1206 ,  C10M2207/1285 ,  C10M2207/129 ,  C10M2207/34 ,  C10M2215/1026 ,  C10M2215/28 ,  C10M2217/0456 ,  C10M2219/044 ,  C10M2219/0466 ,  C10N2220/082 ,  C10N2230/00 ,  C10N2230/06 ,  C10N2240/40 ,  C10N2250/10 ,  C10N2250/12 ,  C10N2270/00 ,  C10N2210/01 ,  C10N2210/04 ,  C10N2210/03 ,  C10N2210/02

摘要： The present invention relates to a lubricating composition containing an alkali metal borate. The invention further provides for a method of lubricating a device with grease or a metalworking fluid by employing the lubricating composition containing the alkali metal borate.

摘要翻译： 本发明涉及含有碱金属硼酸盐的润滑组合物。 本发明还提供了通过使用含有碱金属硼酸盐的润滑组合物来润滑具有油脂或金属加工液的装置的方法。

公开(公告)号：US20100113312A1

公开(公告)日：2010-05-06

申请号：US12525702

申请日：2008-02-20

申请人： William C. Ward ,  Richard A. Denis

发明人： William C. Ward ,  Richard A. Denis

IPC分类号： C10M169/02 ,  C10M103/06

CPC分类号： C10M169/06 ,  C10M125/26 ,  C10M141/12 ,  C10M2201/087 ,  C10M2201/1036 ,  C10M2201/1056 ,  C10M2207/1206 ,  C10M2207/1285 ,  C10M2207/129 ,  C10M2207/34 ,  C10M2215/1026 ,  C10M2215/28 ,  C10M2217/0456 ,  C10M2219/044 ,  C10M2219/0466 ,  C10N2220/082 ,  C10N2230/00 ,  C10N2230/06 ,  C10N2240/40 ,  C10N2250/10 ,  C10N2250/12 ,  C10N2270/00 ,  C10N2210/01 ,  C10N2210/04 ,  C10N2210/03 ,  C10N2210/02

摘要： The present invention relates to a lubricating composition containing an alkali metal borate. The invention further provides for a method of lubricating a device with grease or a metalworking fluid by employing the lubricating composition containing the alkali metal borate.

摘要翻译： 本发明涉及含有碱金属硼酸盐的润滑组合物。 本发明还提供了通过使用含有碱金属硼酸盐的润滑组合物来润滑具有油脂或金属加工液的装置的方法。

公开(公告)号：US08193130B2

公开(公告)日：2012-06-05

申请号：US12525702

申请日：2008-02-20

申请人： William C. Ward ,  Richard A. Denis

发明人： William C. Ward ,  Richard A. Denis

IPC分类号： C10M173/02

CPC分类号： C10M169/06 ,  C10M125/26 ,  C10M141/12 ,  C10M2201/087 ,  C10M2201/1036 ,  C10M2201/1056 ,  C10M2207/1206 ,  C10M2207/1285 ,  C10M2207/129 ,  C10M2207/34 ,  C10M2215/1026 ,  C10M2215/28 ,  C10M2217/0456 ,  C10M2219/044 ,  C10M2219/0466 ,  C10N2220/082 ,  C10N2230/00 ,  C10N2230/06 ,  C10N2240/40 ,  C10N2250/10 ,  C10N2250/12 ,  C10N2270/00 ,  C10N2210/01 ,  C10N2210/04 ,  C10N2210/03 ,  C10N2210/02

摘要： The present invention relates to a lubricating composition containing an alkali metal borate. The invention further provides for a method of lubricating a device with grease or a metalworking fluid by employing the lubricating composition containing the alkali metal borate.

摘要翻译： 本发明涉及含有碱金属硼酸盐的润滑组合物。 本发明还提供了通过使用含有碱金属硼酸盐的润滑组合物来润滑具有油脂或金属加工液的装置的方法。

公开(公告)号：US4878108A

公开(公告)日：1989-10-31

申请号：US61649

申请日：1987-06-15

申请人： Douglas W. Phelps, Jr. ,  William C. Ward

发明人： Douglas W. Phelps, Jr. ,  William C. Ward

IPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/40

CPC分类号： H01L23/4006 ,  H01L23/4093 ,  H01L2023/405 ,  H01L2924/0002

摘要： A package for heat dissipation of electronic components mounted on a strip of thermally conductive material. A plastic body is molded to encapsulate the component and strip with extended mold ejector pins employed to form a recess such that access to the thermally conductive strip is obtained. An external heat sink is mounted onto the plastic body. A clip or through bolt establishes thermal contact between the external heat sink and the internal thermally conductive strip.

公开(公告)号：US4796078A

公开(公告)日：1989-01-03

申请号：US61361

申请日：1987-06-15

申请人： Douglas W. Phelps, Jr. ,  Robert J. Redmond ,  William C. Ward

发明人： Douglas W. Phelps, Jr. ,  Robert J. Redmond ,  William C. Ward

IPC分类号： H01L23/50 ,  H01L23/495 ,  H01L23/48 ,  H01L23/30

CPC分类号： H01L23/49537 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14

摘要： An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the first and second lead frames.

摘要翻译： 公开了一种电子组件及其制造方法。 半导体器件（10）被背接合到第一引线框架（14）。 粘合绝缘带（24）放置在第一引线框和设备上。 第二引线框架（28）安装在胶带上。 在器件与第一引线框架和第二引线框架之间建立通过引线键合的电触点。

公开(公告)号：US20110190180A1

公开(公告)日：2011-08-04

申请号：US13060492

申请日：2009-09-14

申请人： Patrick E. Mosier ,  Jason R. Brown ,  Matthew D. Gieselman ,  Calvin W. Schroeck ,  Seth Crawley ,  William Barton ,  William C. Ward

发明人： Patrick E. Mosier ,  Jason R. Brown ,  Matthew D. Gieselman ,  Calvin W. Schroeck ,  Seth Crawley ,  William Barton ,  William C. Ward

IPC分类号： C10M133/40 ,  C10M133/44 ,  C10M129/20

CPC分类号： C10M133/40 ,  C10M129/20 ,  C10M133/44 ,  C10M133/46 ,  C10M133/48 ,  C10M133/58 ,  C10M159/12 ,  C10M2205/022 ,  C10M2205/04 ,  C10M2207/028 ,  C10M2207/044 ,  C10M2207/262 ,  C10M2215/064 ,  C10M2215/221 ,  C10M2215/223 ,  C10M2215/224 ,  C10M2215/225 ,  C10M2215/28 ,  C10M2219/046 ,  C10M2223/045 ,  C10N2220/033 ,  C10N2230/06 ,  C10N2230/42 ,  C10N2230/52 ,  C10N2240/101 ,  C10N2240/102 ,  C10N2240/103 ,  C10N2240/104 ,  C10N2240/105 ,  C10M2205/024 ,  C10M2205/06 ,  C10N2260/02 ,  C10N2210/02

摘要： The present Invention relates to the use of a compound in a lubricating composition as an engine oil antiwear and/or extreme pressure agent, wherein the compound is a heterocycle having a hydrocarbyl group containing 6 to 40 carbon atoms, wherein the heterocycle is either (i) a heterocycle compound having a functional group selected from the group consisting of at least one of an ester, an amide, a salt and an acid, or (ii) a pyrimidine.

摘要翻译： 本发明涉及化合物在润滑组合物中作为机油抗磨和/或极压剂的用途，其中所述化合物是具有含有6至40个碳原子的烃基的杂环，其中所述杂环是（i ）具有选自酯，酰胺，盐和酸中的至少一种的官能团的杂环化合物，或（ii）嘧啶。

公开(公告)号：US5086018A

公开(公告)日：1992-02-04

申请号：US694719

申请日：1991-05-02

申请人： H. Ward Conru ,  Gary H. Irish ,  Francis J. Pakulski ,  William J. Slattery ,  Stephen G. Starr ,  William C. Ward

发明人： H. Ward Conru ,  Gary H. Irish ,  Francis J. Pakulski ,  William J. Slattery ,  Stephen G. Starr ,  William C. Ward

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L24/32 ,  H01L21/56 ,  H01L23/4951 ,  H01L24/05 ,  H01L24/06 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/73215 ,  H01L2224/85909 ,  H01L2224/92147 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253

摘要： A method of making a semiconductor chip in which the conductive path between the chip and the lead frame via wires can be easily and reproduceably improved. This is accomplished by improving the bond between the wires and the lead frame members to which the wires are joined and by creating additional contacts between each wire and its respective lead even if the bonded contact breaks or fails at or immediately adjacent to the bonding point. This is accomplished by placing an insulating layer on the active surface of each chip, carrying input and output bonding pads thereon, to which lead frame conductors have been connected by bonding wires. The insulating layer is a thermosetting adhesive and is placed over the lead frame, the bonding wires and the active face of the semiconductor chip so that when a lamination force is applied to the insulating layer the wires will be crushed and held against their respective pads and against the respective leads to which they are connected and the active face of the semiconductor protected by the adhesive bonding thereto. In this way greater contact between the wires and the leads is enhanced and defects or failure in conductivity therebetween reduced or eliminated.

摘要翻译： 一种制造半导体芯片的方法，其中可以容易且可再现地改善芯片和引线框架之间的导线通过导线。 这是通过改善导线与引线框架构件之间的接合而实现的，并且通过在每个导线与其相应引线之间产生附加的接触，即使接合的接触在接合点处或紧邻接合点处断裂或失效。 这通过在每个芯片的有源表面上放置绝缘层来实现，该绝缘层在其上承载有引线框架导体已经通过接合线连接的输入和输出接合焊盘。 绝缘层是热固性粘合剂，并且放置在引线框架，接合线和半导体芯片的有源面之上，使得当层压力施加到绝缘层时，电线将被压碎并保持抵靠它们各自的焊盘，并且 抵靠它们连接的各个引线，并且被粘合剂保护的半导体的有源面与其结合。 以这种方式，电线和引线之间的更大的接触增强，并且导电性的缺陷或故障减少或消除。

公开(公告)号：US4916519A

公开(公告)日：1990-04-10

申请号：US358992

申请日：1989-05-30

申请人： William C. Ward

发明人： William C. Ward

IPC分类号： H01L23/50 ,  H01L23/495

CPC分类号： H01L23/495 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011

摘要： In an encapsulated semiconductor module in which a semiconductor chip, having a major surface with terminals thereon, is deposed within the encapsulating material, a plurality of self-supporting, unitary, discrete, and continuous lead frame conductors formed of metal sheet stock are positioned at various locations around the chip and cantilevered out of the encapsulating material, so that discrete wires can be used to connect respective ones of said conductors to respective ones of said terminals. In the present invention excessively long bonding wires are avoided by connecting a selected one of said lead frame conductors to a parallel conductor by a jumper wire and connecting the parallel conductor to the desired terminal with a short wire.

公开(公告)号：US4907734A

公开(公告)日：1990-03-13

申请号：US263806

申请日：1988-10-28

申请人： H. Ward Conru ,  Stephen E. Gons ,  Gordon C. Osborne, Jr. ,  Douglas W. Phelps, Jr. ,  Stephen G. Starr ,  William C. Ward

发明人： H. Ward Conru ,  Stephen E. Gons ,  Gordon C. Osborne, Jr. ,  Douglas W. Phelps, Jr. ,  Stephen G. Starr ,  William C. Ward

IPC分类号： H01R43/00 ,  B23K20/02 ,  B23K20/10 ,  B23K20/22 ,  B23K35/00 ,  H01L21/00 ,  H01L21/607 ,  H01R43/02 ,  H05K3/32 ,  H05K3/34

CPC分类号： H01L24/85 ,  B23K20/023 ,  B23K20/10 ,  B23K20/22 ,  B23K35/007 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01R43/02 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/78301 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85815 ,  H01L24/45 ,  H01L24/78 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H05K3/328 ,  H05K3/3457

摘要： A compression bond is formed between a gold or gold alloy wire and lead/tin solder by forming a head on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/tin intermetallic compound which in turn forms the bond. The head of the wire is maintained out of contact with any underlying surface, and surrounded by the solder.