摘要:
Provided is a configuration of a driver integrated circuit that can output a voltage exceeding the withstand voltage of a process, and that satisfies required apparatus performance (high speed and high voltage). A differential input circuit, a level shift circuit, and an output circuit are manufactured by the same process and divided and disposed on three or more chips with different substrate potentials (sub-potentials). By setting different applied voltages to the substrates of the chips, an output voltage greater than the process withstand voltage can be provided (see FIG. 2).
摘要:
Provided is a configuration of a driver integrated circuit that can output a voltage exceeding the withstand voltage of a process, and that satisfies required apparatus performance (high speed and high voltage). A differential input circuit, a level shift circuit, and an output circuit are manufactured by the same process and divided and disposed on three or more chips with different substrate potentials (sub-potentials). By setting different applied voltages to the substrates of the chips, an output voltage greater than the process withstand voltage can be provided (see FIG. 2).
摘要:
The detection part has: a subtraction module for calculating correction data from data of detection systems when a reference-voltage generation module applies a reference voltage to the detection systems; a data-holding module for holding the correction data; an addition module for making a correction of detection data; a comparison module for comparing the detection data with switching data; and a selector for switching data of the detection systems including data subjected to the correction according to the output of the comparison module.
摘要:
The detection part has: a subtraction module for calculating correction data from data of detection systems when a reference-voltage generation module applies a reference voltage to the detection systems; a data-holding module for holding the correction data; an addition module for making a correction of detection data; a comparison module for comparing the detection data with switching data; and a selector for switching data of the detection systems including data subjected to the correction according to the output of the comparison module.
摘要:
One illustrative embodiment includes materials and devices including an integrated hydrogen storage structure including a plurality of continuously connected thermally conductive elongated members, the elongated members including continuously connected openings between the elongated members; and, a metal hydride material contacting the elongated members and disposed within the connected openings and surrounding the elongated members.
摘要:
A hydrogen storage material has been developed that comprises a metal hydride material embedded into a carbon microstructure that generally exhibits a greater bulk thermal conductivity than the surrounding bulk metal hydride material.
摘要:
Both the reaction of hydride-forming compositions with hydrogen to form hydrides, and the decomposition of such hydrides to release hydrogen may be promoted electrochemically. These reactions may be conducted reversibly, and if performed in a suitable cell, the cell will serve as a hydrogen storage and release device.
摘要:
A method, information processing system, and computer program product manage variable operand length instructions. At least one variable operand length instruction is received. The at least one variable operand length instruction is analyzed. A length of at least one operand in the variable operand length instruction is identified based on the analyzing. The at least one variable operand length instruction is organized into a set of unit of operations. The set of unit of operations are executed. The executing increases one or more performance metrics of the at least one variable operand length instruction.
摘要:
Photodiode arrays and methods of fabrication are provided. One photodiode array includes a silicon wafer having a first surface and an opposite second surface. The photodiode array also includes a plurality of refilled conductive vias through the silicon wafer, wherein the refilled conductive vias have a doping type different than the doping type of the substrate, and an interface between the refilled conductive vias and the substrate form diode junctions. The photodiode array further includes a patterned doped layer on the first surface overlapping the refilled conductive vias, wherein the patterned doped layer defines an array of photodiodes.
摘要:
A proton exchange membrane comprises a hybrid inorganic-organic polymer that includes implanted metal cations. Acid groups are bound to the hybrid inorganic-organic polymer through an interaction with the implanted metal cations. An example process for manufacturing a proton exchange membrane includes sol-gel polymerization of silane precursors in a medium containing the metal cations, followed by exposure of the metal-implanted hybrid inorganic-organic polymer to an acid compound.