Integrated heater and method of manufacture

    公开(公告)号:US11751289B2

    公开(公告)日:2023-09-05

    申请号:US17338229

    申请日:2021-06-03

    IPC分类号: H05B3/18 H05B3/28

    摘要: A heater includes a sintered assembly and a functional element disposed on one of opposing surfaces of the sintered assembly. The heater is manufactured by a method that includes hot pressing a ceramic powder and a plurality of first slugs and forming the sintered assembly including a ceramic substrate and the plurality of first slugs embedded therein, forming the functional element on the one opposing surface of the sintered assembly such that the functional element is connected to the plurality of first slugs, and forming a monolithic substrate in which the functional element and the plurality of first slugs are embedded.

    CERAMIC-ALUMINUM ASSEMBLY WITH BONDING TRENCHES

    公开(公告)号:US20200230728A1

    公开(公告)日:2020-07-23

    申请号:US16805952

    申请日:2020-03-02

    摘要: A method of joining is provided. the method includes preparing a first member, preparing a second member, and forming at least one trench in at least one of the first member and the second member. The method further includes placing a strip of solid aluminum material between the first member and the second member across the trench, bringing the first member and the second member together to contact the solid aluminum material and to form an assembly, and applying a force and heat to the assembly above a melting point of the solid aluminum material such that the solid aluminum material flows into the trench. Additionally, the method further includes applying additional heat to the assembly at or above a wetting temperature of the member in which the trench is formed to bond the first member to the second member along adjacent faces and cooling the assembly.

    ALL ALUMINUM HEATER
    9.
    发明申请
    ALL ALUMINUM HEATER 审中-公开

    公开(公告)号:US20190320501A1

    公开(公告)日:2019-10-17

    申请号:US16386870

    申请日:2019-04-17

    IPC分类号: H05B3/26

    摘要: A heater includes a ceramic substrate and a heating layer made of aluminum material disposed in the ceramic substrate. The ceramic substrate includes a first plate member in which the heating layer is disposed and a second plate member through which a plurality of first vias made of the aluminum material extend. A routing layer made of the aluminum material can be disposed in the second plate member. The first plate member and the second plate member are bonded to each other by the aluminum material. The ceramic substrate can include a third plate member through which a plurality of second vias made from the aluminum material extend. The second plate member and the third plate member are bonded to each other by the aluminum material. Also, terminal wires can be bonded to the plurality of second vias.