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公开(公告)号：US20180228060A1
公开(公告)日：2018-08-09
申请号：US15879163
申请日：2018-01-24
发明人： Husam Alissa , Kourosh Nemati , Bahgat Sammakia , Kanad Ghose
CPC分类号： H05K7/20836 , G05B13/041 , H05K7/20745
摘要： A method of controlling a data center having a cold air cooling system, and at least one containment structure, comprising: determining a minimum performance constraint; determining optimum states of the cold air cooling system, a controlled leakage of air across the containment structure between a hot region and a cold air region, and information technology equipment for performing tasks to meet the minimum performance constraint, to minimize operating cost; and generating control signals to the cold air cooling system, a controlled leakage device, and the information technology equipment in accordance with the determined optimum states.
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公开(公告)号：US20240032250A1
公开(公告)日：2024-01-25
申请号：US18376435
申请日：2023-10-03
发明人： Sadegh Khalili , Bahgat Sammakia
CPC分类号： H05K7/20327 , H05K7/20309 , H05K7/20818 , F25B23/006
摘要： A method for cooling an information technology system, comprising: receiving a flow of at least a subcooled liquid phase change refrigerant; cooling the information technology system by sensible heat transfer in an evaporator, to produce at least gaseous refrigerant; and exchanging heat from the at least gaseous refrigerant from the evaporator to the subcooled liquid phase change refrigerant. The phase change refrigerant may be a hydrofluorocarbon ether having a boiling point of 30-65° C. at 1-12 bar.
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公开(公告)号：US20230247795A1
公开(公告)日：2023-08-03
申请号：US17588209
申请日：2022-01-28
发明人： Sadegh Khalili , Bahgat Sammakia
IPC分类号： H05K7/20
CPC分类号： H05K7/20327 , H05K7/20818 , H05K7/20309
摘要： A method for cooling an information technology system, comprising: receiving a flow of at least a subcooled liquid phase change refrigerant; cooling the information technology system by sensible heat transfer in an evaporator, to produce at least gaseous refrigerant; and exchanging heat from the at least gaseous refrigerant from the evaporator to the subcooled liquid phase change refrigerant. The phase change refrigerant may be a hydrofluorocarbon ether having a boiling point of 30-65° C. at 1-12 bar.
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公开(公告)号：US10064283B2
公开(公告)日：2018-08-28
申请号：US14537123
申请日：2014-11-10
CPC分类号： H05K3/0011 , C25D5/48 , C25D9/08 , C25D21/12 , H05K1/0306 , H05K1/09 , H05K1/162 , H05K1/167 , H05K3/184 , H05K2201/0175 , H05K2201/0355 , H05K2203/092 , H05K2203/135 , H05K2203/163
摘要： A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.
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公开(公告)号：US20170013721A9
公开(公告)日：2017-01-12
申请号：US14537123
申请日：2014-11-10
CPC分类号： H05K3/0011 , C25D5/48 , C25D9/08 , C25D21/12 , H05K1/0306 , H05K1/09 , H05K1/162 , H05K1/167 , H05K3/184 , H05K2201/0175 , H05K2201/0355 , H05K2203/092 , H05K2203/135 , H05K2203/163
摘要： A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.
摘要翻译： 一种在导电性基板上形成膜的方法，其特征在于，将具有导电性部分的基板浸渍在包含所述膜的金属离子陶瓷前体和过氧化物的溶液中; 对导电部分相对于溶液中的对电极施加电压电位，足以保护导电部分免受溶液的腐蚀，并且驱动膜在基板上的形成，在限制生产的同时控制溶液的pH 的氢气通过电解接近导电部分的溶液; 并且保持电压电位足够的持续时间以在导电部分上产生膜。 可以在膜上形成电极以产生电气装置。 该膜可以是例如绝缘，电介质，电阻，半导体，磁性或铁磁性的。
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公开(公告)号：US20160135303A1
公开(公告)日：2016-05-12
申请号：US14537123
申请日：2014-11-10
CPC分类号： H05K3/0011 , C25D5/48 , C25D9/08 , C25D21/12 , H05K1/0306 , H05K1/09 , H05K1/162 , H05K1/167 , H05K3/184 , H05K2201/0175 , H05K2201/0355 , H05K2203/092 , H05K2203/135 , H05K2203/163
摘要： A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.
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公开(公告)号：US20240082920A1
公开(公告)日：2024-03-14
申请号：US18318670
申请日：2023-05-16
发明人： Scott N. Schiffres , Arad Azizi , Changhong Ke , Bahgat Sammakia , Feilin Gou
IPC分类号： B22F10/362 , B22F10/85 , B33Y40/10
CPC分类号： B22F10/362 , B22F10/85 , B33Y40/10 , B33Y50/02
摘要： A technique for additively manufacturing with a segmentation exposure strategy is disclosed herein, which enables lower thermal stress and substrate temperatures, compared to conventional raster strategies. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates where coefficient of thermal expansion mismatch can be considerable. It also enables novel composites through additive manufacturing. This process can also be selectively applied to parts or material systems that have large thermal stresses with conventional raster and process parameters to reduce chances of thermal stress induced failure. The process enables reduction of heat concentration in selective laser melting or electron beam melting which results in lower residual stresses in the fabricated object.
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公开(公告)号：US11876036B2
公开(公告)日：2024-01-16
申请号：US17351498
申请日：2021-06-18
发明人： Leila Choobineh , Bahgat Sammakia
IPC分类号： H01L23/473 , H05K7/20 , H01L23/427 , F28F3/04 , F28D15/02
CPC分类号： H01L23/473 , F28D15/0266 , F28D15/0275 , F28F3/04 , H01L23/427 , H05K7/20254 , H05K7/20318
摘要： Fluid cooling systems are discussed herein. The system may include a top portion including a first surface receiving package(s) generating heat during operation, a second surface positioned opposite the first surface, and a plurality of embedded channels formed on the second surface. The system may also include a bottom portion positioned adjacent the top portion. The bottom portion may include inlet section(s) receiving a coolant and a plurality of inlet fluid conduits formed adjacent to and in fluid communication with the inlet section(s). The bottom portion may also include a plurality of outlet fluid conduits formed adjacent to the plurality of inlet fluid conduits. Each outlet fluid conduit may be in fluid communication with at least one of the inlet fluid conduits. The bottom portion may further include an outlet section(s) in fluid communication with the plurality of outlet fluid conduits and the inlet section(s).
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公开(公告)号：US20210398878A1
公开(公告)日：2021-12-23
申请号：US17351498
申请日：2021-06-18
发明人： Leila Choobineh , Bahgat Sammakia
IPC分类号： H01L23/473 , F28D15/02 , F28F3/04 , H01L23/427 , H05K7/20
摘要： Fluid cooling systems are discussed herein. The system may include a top portion including a first surface receiving package(s) generating heat during operation, a second surface positioned opposite the first surface, and a plurality of embedded channels formed on the second surface. The system may also include a bottom portion positioned adjacent the top portion. The bottom portion may include inlet section(s) receiving a coolant and a plurality of inlet fluid conduits formed adjacent to and in fluid communication with the inlet section(s). The bottom portion may also include a plurality of outlet fluid conduits formed adjacent to the plurality of inlet fluid conduits. Each outlet fluid conduit may be in fluid communication with at least one of the inlet fluid conduits. The bottom portion may further include an outlet section(s) in fluid communication with the plurality of outlet fluid conduits and the inlet section(s).
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公开(公告)号：US11076509B2
公开(公告)日：2021-07-27
申请号：US15879163
申请日：2018-01-24
发明人： Husam Alissa , Kourosh Nemati , Bahgat Sammakia , Kanad Ghose
摘要： A method of controlling a data center having a cold air cooling system, and at least one containment structure, comprising: determining a minimum performance constraint; determining optimum states of the cold air cooling system, a controlled leakage of air across the containment structure between a hot region and a cold air region, and information technology equipment for performing tasks to meet the minimum performance constraint, to minimize operating cost; and generating control signals to the cold air cooling system, a controlled leakage device, and the information technology equipment in accordance with the determined optimum states.
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