公开(公告)号：US20240082920A1

公开(公告)日：2024-03-14

申请号：US18318670

申请日：2023-05-16

Applicant: The Research Foundation for The State University of New York

Inventor： Scott N. Schiffres ,  Arad Azizi ,  Changhong Ke ,  Bahgat Sammakia ,  Feilin Gou

IPC: B22F10/362 ,  B22F10/85 ,  B33Y40/10

CPC classification number: B22F10/362 ,  B22F10/85 ,  B33Y40/10 ,  B33Y50/02

Abstract: A technique for additively manufacturing with a segmentation exposure strategy is disclosed herein, which enables lower thermal stress and substrate temperatures, compared to conventional raster strategies. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates where coefficient of thermal expansion mismatch can be considerable. It also enables novel composites through additive manufacturing. This process can also be selectively applied to parts or material systems that have large thermal stresses with conventional raster and process parameters to reduce chances of thermal stress induced failure. The process enables reduction of heat concentration in selective laser melting or electron beam melting which results in lower residual stresses in the fabricated object.