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公开(公告)号：US20120107522A1
公开(公告)日：2012-05-03
申请号：US13382085
申请日：2010-07-06
Applicant: Tetsuo Yumoto
Inventor： Tetsuo Yumoto
CPC classification number: H05K3/185 , C23C18/1612 , C23C18/1689 , C23C18/204 , C23C18/208 , H05K3/381 , H05K2203/107 , H05K2203/108 , H05K2203/1476
Abstract: Disclosed is a method for producing a formed circuit component, wherein the surface of a substrate is roughened by being irradiated with laser ray instead of being etched using a chemical agent, thereby assuring sufficient adhesive strength with an electroless plating. Specifically disclosed is a method for producing a formed circuit component, which comprises: a first step of forming a substrate (1); a second step of radiating a first laser ray (2) and thereby roughening either a surface of the substrate (1) or only a circuit forming region (1a) of the substrate surface; a third step of applying a catalyst (3) to the surface of the substrate (1); a fourth step of drying the substrate (1); a fifth step of radiating a second laser ray (4), thereby lowering or eliminating the function of the catalyst (3) on a non-circuit forming region (1b); and a sixth step of electroless-plating the circuit forming region (1a) of the substrate surface.
Abstract translation: 公开了一种形成电路部件的制造方法，其中通过用激光照射而使基板的表面粗糙化，而不是使用化学试剂进行蚀刻，从而通过化学镀确保足够的粘合强度。 具体公开了一种形成电路部件的制造方法，包括：形成基板（1）的第一工序; 第二步骤，辐射第一激光束（2），从而使基板（1）的表面或仅基板表面的电路形成区域（1a）粗糙化; 将催化剂（3）施加到基板（1）的表面的第三步骤; 干燥所述基板（1）的第四步骤; 第五步骤，辐射第二激光（4），从而降低或消除非电路形成区（1b）上的催化剂（3）的功能; 以及对基板表面的电路形成区域（1a）进行无电镀的第六步骤。
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公开(公告)号：US5979048A
公开(公告)日：1999-11-09
申请号：US813893
申请日：1997-03-07
Applicant: Yoshiaki Nishikawa , Tetsuo Yumoto
Inventor： Yoshiaki Nishikawa , Tetsuo Yumoto
CPC classification number: H05K3/403 , H05K2201/09118 , H05K2201/09172 , H05K3/0052 , H05K3/3442 , H05K3/42 , Y10T29/49156 , Y10T29/49158 , Y10T29/49179 , Y10T29/49224
Abstract: A method of simultaneously manufacturing a plurality of connectors involves:molding a resin to form a connector member assembly containing multiple connector members, each member having one or two opposite longitudinally elongated through-holes extending between front and rear faces of the member along opposite sides thereof;forming a first metal coating on the front and rear faces and on an inner surface of each through-hole;providing metal-platable and non-metal-platable regions on each first-metal-coated front and rear face;forming a second metal coating on the metal-platable regions to form conductive patterns and on each first-metal-plated inner surface to form a conductive inner surface;removing the first metal coating from the non-metal-platable regions to form non-conductive patterns;then detaching each connector member from the connector assembly, each detached member having one or two side faces containing the metal-plated inner surface of the one or two through-holes; andremoving the first and second metal coatings from a portion of each side face to form a side-face conductive pattern disposed in electrical communication with the conductive patterns of the front and rear faces.
Abstract translation: 同时制造多个连接器的方法包括：模制树脂以形成包含多个连接器构件的连接器构件组件，每个构件具有一个或两个相对的纵向细长的通孔，其在构件的相对侧的前后面之间延伸 ; 在每个通孔的前表面和后表面以及内表面上形成第一金属涂层; 在每个第一金属涂覆的前后表面上提供金属镀层和非金属镀层区域; 在所述金属镀层区域上形成第二金属涂层以形成导电图案，并在每个第一金属镀覆的内表面上形成导电内表面; 从非金属可镀区域去除第一金属涂层以形成非导电图案; 然后将每个连接器元件从连接器组件分离，每个分离元件具有一个或两个侧面，该侧面包含一个或两个通孔的金属镀覆的内表面; 以及从每个侧面的一部分去除所述第一和第二金属涂层以形成设置成与所述前表面和所述后表面的导电图案电连通的侧面导电图案。
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公开(公告)号：US20070200554A1
公开(公告)日：2007-08-30
申请号：US11513478
申请日：2006-08-31
Applicant: Tetsuo Yumoto
Inventor： Tetsuo Yumoto
IPC: G01R31/28
CPC classification number: G01R31/28 , H05K1/0284 , H05K1/115 , H05K3/42 , H05K2201/09045 , H05K2201/09118 , H05K2201/09236 , H05K2201/0959 , H05K2201/09827 , H05K2201/09854 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T29/49176
Abstract: A molding pin for a metal die is prevented from breaking, solder is surely deposited, and thus, a circuit pitch can be reduced to the limit. On the front plane of a circuit board, prescribed circuit patterns made of a conductive material are formed, and on the rear plane, prescribed circuit patterns are also formed. On the circuit board, a through hole is formed to carry electricity between the circuit patterns on both planes. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns and wide in a circuit extending direction.
Abstract translation: 防止金属模具的成型销断裂，确实沉积焊料，因此可以将电路间距减小到极限。 在电路板的正面上，形成由导电材料制成的规定的电路图案，在背面也形成规定的电路图形。 在电路板上，形成通孔，以在两个平面上的电路图案之间承载电力。 通孔的内部形状在相邻电路图案之间的方向上窄，并且在电路延伸方向上宽。
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公开(公告)号：US6036901A
公开(公告)日：2000-03-14
申请号：US992540
申请日：1997-12-17
Applicant: Tetsuo Yumoto
Inventor： Tetsuo Yumoto
CPC classification number: B29C45/4457 , B29C45/16 , H05K3/182 , B29C2045/169 , B29C2045/4464 , B29K2105/0079 , Y10S264/44
Abstract: An electronic part having a complicated internal configuration is integrally molded without dividing the configuration into a plurality of sections, thereby reducing the cost and improving the quality of the electronic part. The manufacturing process comprises producing a core to be used in the subsequent injection molding, which corresponds to the complicated internal configuration of the electronic part, by the injection molding of a polyvinyl alcohol-based resin containing an oxyalkylene group, producing a second stage product which has the core inserted therein and which has a ridgy projection as a circuit pattern forming area on the surface thereof by the injection molding of a metallization-grade aromatic polyester liquid crystalline polymer, immersing the second stage product in hot water under heating so as to dissolve the core away in hot water, roughening the surface of the second stage product and then providing a catalyst thereto so as to produce a third stage product, inserting the third stage product into a mold cavity and then injecting a nonmetallization-grade liquid crystalline polymer into the mold cavity encircling the third stage product by injection molding so that the surface excluding the ridgy projection as a circuit pattern forming area is coated with the liquid crystalline polymer so as to obtain a fourth stage product, and finally metallizing the surface of the circuit pattern forming area exposed on the external peripheral surface of the fourth stage product so as to form an electrically conductive circuit.
Abstract translation: 具有复杂内部构造的电子部件被一体地模制而不将结构分成多个部分，从而降低成本并提高电子部件的质量。 该制造方法包括通过注射成型含有氧化烯基的聚乙烯醇系树脂来制造在随后的注射成型中使用的芯，其对应于电子部件的复杂内部结构，制造第二级产品， 其芯插入其中，并且通过金属化级芳族聚酯液晶聚合物的注射成型在其表面上具有作为电路图案形成区域的突出部，将第二阶段产物在加热下浸入热水中以溶解 将核心置于热水中，使第二阶段产物的表面粗糙化，然后向其中提供催化剂，以便产生第三阶段产品，将第三阶段产品插入模腔中，然后将非金属化液晶聚合物注入 模腔通过注射成型包围第三阶段产品，使得表面排除 g作为电路图案形成区域的轮廓突起被液晶聚合物涂覆，以获得第四级产品，最后金属化暴露在第四级产品的外周面上的电路图案形成区域的表面，以便 以形成导电电路。
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公开(公告)号：US5045641A
公开(公告)日：1991-09-03
申请号：US468936
申请日：1990-01-23
Applicant: Kenichi Urushibata , Keiichi Kojima , Kiyoto Sugawara , Tatsuo Matsuda , Haruo Saen , Tetsuo Yumoto , Norio Yoshizawa , Tooru Kanno
Inventor： Kenichi Urushibata , Keiichi Kojima , Kiyoto Sugawara , Tatsuo Matsuda , Haruo Saen , Tetsuo Yumoto , Norio Yoshizawa , Tooru Kanno
CPC classification number: H01R12/61 , H01R13/405 , H01R13/025 , H01R4/029 , H01R43/24 , H05K3/328 , H05K3/361 , Y10T29/49179
Abstract: A molded electrical connector for connecting electrical conductors comprises a molding section in which a plurality of metallic circuits are arranged in parallel with one another at predetermined intervals and are fixedly molded with resin such that first end portions of the metallic circiuts are exposed as connecting terminals. The molded electrical connector further comprises a connecting section which comprises the connecting terminals. The connecting section is molded with resin simultaneously when the molding section is formed. Electrical conductors are placed on the connecting terminals of the metallic circuits and welded together.
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Patent Agency Ranking6.发明授权Molded article with partial metal plating and a process for producing such article 失效具有部分金属电镀的模制品和用于制造这种制品的方法
公开(公告)号：US5015519A
公开(公告)日：1991-05-14
申请号：US422174
申请日：1989-10-16
Applicant: Tetsuo Yumoto
Inventor： Tetsuo Yumoto
CPC classification number: H05K3/182 , B29C70/72 , C23C18/1608 , C23C18/1639 , C23C18/1641 , C23C18/1879 , C23C18/1893 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , H05K3/184 , B29C2791/001 , H05K2201/0187 , H05K2201/09118 , H05K2203/1407 , H05K2203/1476 , H05K3/0014 , H05K3/0023 , Y10S428/901 , Y10T428/24917 , Y10T428/31 , Y10T428/31533 , Y10T428/31678 , Y10T428/31681 , Y10T428/31725 , Y10T428/31728
Abstract: This invention relates to a partially plated molded article and to a process for the production of a molded article which is partially plated with metal such as circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gold, etc. is added after roughening of the surface of a primary molded article, and then, the molded article is inserted into the mold and a secondary article molded thereabout so that the portions to be plated with metal are exposed, and after such molding, the exposed portions are plated with metal. Alternatively, the catalyst may be applied after molding of the secondary article around the roughened primary molded article.
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公开(公告)号：US20090000951A1
公开(公告)日：2009-01-01
申请号：US12087441
申请日：2007-01-23
Applicant: Tetsuo Yumoto
Inventor： Tetsuo Yumoto
CPC classification number: H05K3/184 , H05K1/0373 , H05K3/182 , H05K3/381 , H05K2201/0158 , H05K2201/0212 , H05K2201/09118 , H05K2201/09909 , H05K2203/0773
Abstract: An electroconductive circuit, in which a masking material and a substrate both have low dielectric loss tangent to high-frequency signal and have excellent adhesion to each other, can be formed in a simple and low-cost manner. A cycloolefin resin with a flexible polymer mixed and dispersed therein is injection molded to form a primary substrate 1, and a cycloolefin resin having compatibility in which a flexible polymer has not been mixed, is injection molded on the surface of the primary substrate 1 to form a masking layer 2. Since the cycloolefin resin itself has etching resistance, for only the surface of the primary substrate 1 not covered with the masking layer 2, that is, only a part 1a on which an electroconductive circuit is to be formed, the flexible polymer can be dissolved for roughening and only the part 1a can be rendered hydrophilic. Accordingly, an electroconductive layer 4 can be selectively formed by electroless plating only onto the part 1a not covered with the masking layer 2.
Abstract translation: 可以以简单且低成本的方式形成导电电路，其中掩模材料和基板都具有与高频信号相切的低介电损耗并且彼此具有优异的粘合性。 将其中混合并分散有柔性聚合物的环烯烃树脂注射成型以形成初级基底1，并将具有柔性聚合物未混合的相容性的环烯烃树脂注射到初级基底1的表面上以形成 掩模层2.由于环烯树脂本身具有耐腐蚀性，因此仅对未被掩模层2覆盖的一次基板1的表面即仅形成有导电电路的部分1a，柔性 聚合物可以溶解以进行粗糙化，并且只有部分1a可以变成亲水性。 因此，可以通过无电镀仅将选择性地形成导电层4到未被掩模层2覆盖的部分1a上。
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公开(公告)号：US5057650A
公开(公告)日：1991-10-15
申请号：US561567
申请日：1990-08-02
Applicant: Kenichi Urushibata , Kiyoto Sugawara , Tatsuo Matsuda , Haruo Saen , Keiichi Kojima , Syusaku Kawasaki , Hiroshi Hatase , Katsuya Saito , Tetsuo Yumoto , Norio Yoshizawa , Tooru Kanno
Inventor： Kenichi Urushibata , Kiyoto Sugawara , Tatsuo Matsuda , Haruo Saen , Keiichi Kojima , Syusaku Kawasaki , Hiroshi Hatase , Katsuya Saito , Tetsuo Yumoto , Norio Yoshizawa , Tooru Kanno
IPC: H01R4/02 , H01R12/61 , H01R13/504 , H01R13/514 , H01R43/02 , H02G15/08 , H02G15/113
CPC classification number: H01R12/613 , H01R13/504 , H01R4/02 , H01R43/24
Abstract: A molded circuit component for connecting to lead wires includes body and a protective cover. The body includes a partition wall area having a plurality of housing grooves, partition walls, body notches, positioning projections and fastening pin reception apertures. The protective cover includes a plurality of cover notches, recesses and fastening pins to correspond respectively with the body notches, positioning projections and fastening pin reception apertures. Metal lines having connection terminals on their ends are embedded in the housing grooves. Lead wires are positioned in the grooves so that the conductors of the lead wires are placed on, and attached to, the connection terminals. The protective cover is then attached to the body.
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9.发明授权Molded article with partial metal plating and a process for producing such article 失效具有部分金属电镀的模制品和用于制造这种制品的方法
公开(公告)号：US4908259A
公开(公告)日：1990-03-13
申请号：US180923
申请日：1988-04-13
Applicant: Tetsuo Yumoto
Inventor： Tetsuo Yumoto
CPC classification number: H05K3/184 , B29C70/72 , C23C18/1605 , C23C18/1641 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , H05K3/182 , B29C2791/001 , H05K2201/0187 , H05K2201/09118 , H05K2203/1407 , H05K2203/1476 , H05K3/0014 , H05K3/0023 , Y10S428/901 , Y10T428/24273 , Y10T428/24355 , Y10T428/24917 , Y10T428/31 , Y10T428/31533 , Y10T428/31678 , Y10T428/31681 , Y10T428/31725 , Y10T428/31728
Abstract: This invention relates to a partially plated molded article and to a process for the production of a molded article which is partially plated with metal such as circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gold, etc. is added after the roughing of the surface of the primary molded article, and then, the molded article is inserted into the mold and molded so that the portions to be plated with metal are exposed, and after such molding, the exposed portions are plated with metal.
Abstract translation: 本发明涉及一种部分镀覆的模制品，以及一种用于制造模制品的方法，该模制品部分地镀有金属，例如电路板，连接器，装饰品等，其中催化剂如钯，金等 在一次成型品的表面粗加工之后加入，然后将成型品插入模具中并模塑，使被镀金属的部分露出，并且在这种模制之后，将暴露部分镀上 金属。
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公开(公告)号：US08528202B2
公开(公告)日：2013-09-10
申请号：US11513478
申请日：2005-02-17
Applicant: Tetsuo Yumoto
Inventor： Tetsuo Yumoto
IPC: H05K3/42
CPC classification number: G01R31/28 , H05K1/0284 , H05K1/115 , H05K3/42 , H05K2201/09045 , H05K2201/09118 , H05K2201/09236 , H05K2201/0959 , H05K2201/09827 , H05K2201/09854 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T29/49176
Abstract: A molding pin for a metal die is prevented from breaking, solder is surely deposited, and thus, a circuit pitch can be reduced to the limit. On the front plane of a circuit board, prescribed circuit patterns made of a conductive material are formed, and on the rear plane, prescribed circuit patterns are also formed. On the circuit board, a through hole is formed to carry electricity between the circuit patterns on both planes. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns and wide in a circuit extending direction.
Abstract translation: 防止金属模具的成型销断裂，确实沉积焊料，因此可以将电路间距减小到极限。 在电路板的正面上，形成由导电材料制成的规定的电路图案，在背面也形成规定的电路图形。 在电路板上，形成通孔，以在两个平面上的电路图案之间承载电力。 通孔的内部形状在相邻电路图案之间的方向上窄，并且在电路延伸方向上宽。
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