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公开(公告)号:US20240203997A1
公开(公告)日:2024-06-20
申请号:US18595049
申请日:2024-03-04
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Fong-yuan Chang , Chun-Chen Chen , Po-Hsiang Huang , Lee-Chung Lu , Chung-Te Lin , Jerry Chang Jui Kao , Sheng-Hsiung Chen , Chin-Chou Liu
IPC: H01L27/118 , G06F30/398 , H01L27/02
CPC classification number: H01L27/11807 , G06F30/398 , H01L27/0207 , H01L2027/11862 , H01L2027/11866 , H01L2027/11875 , H01L2027/11881 , H01L2027/11885
Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.
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公开(公告)号:US11182533B2
公开(公告)日:2021-11-23
申请号:US16912061
申请日:2020-06-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Sheng-Hsiung Chen , Jerry Chang-Jui Kao , Fong-Yuan Chang , Po-Hsiang Huang , Shao-Huan Wang , XinYong Wang , Yi-Kan Cheng , Chun-Chen Chen
IPC: G06F30/00 , G06F30/398 , H01L27/02 , G06F30/394 , G06F111/04 , G06F111/20 , G06F119/18 , G06F30/18
Abstract: Standard cell libraries include one or more standard cells and one or more corresponding standard cell variations. The one or more standard cell variations are different from their one or more standard cells in terms of geometric shapes, locations of the geometric shapes, and/or interconnections between the geometric shapes. The exemplary systems and methods described herein selectively choose from among the one or more standard cells and/or the one or more standard cell variations to form an electronic architectural design for an electronic device. In some situations, some of the one or more standard cells are unable to satisfy one or more electronic design constraints imposed by a semiconductor foundry and/or semiconductor technology node when placed onto the electronic device design real estate. In these situations, the one or more standard cell variations corresponding to these standard cells are placed onto the electronic device design real estate.
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公开(公告)号:US11037920B2
公开(公告)日:2021-06-15
申请号:US16744975
申请日:2020-01-16
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Fong-Yuan Chang , Sheng-Hsiung Chen , Ting-Wei Chiang , Chung-Te Lin , Jung-Chan Yang , Lee-Chung Lu , Po-Hsiang Huang , Chun-Chen Chen
IPC: H01L27/02 , H01L27/118 , G06F30/394 , G06F30/392
Abstract: The present disclosure describes an example method for routing a standard cell with multiple pins. The method can include modifying a dimension of a pin of the standard cell, where the pin is spaced at an increased distance from a boundary of the standard cell than an original position of the pin. The method also includes routing an interconnect from the pin to a via placed on a pin track located between the pin and the boundary and inserting a keep out area between the interconnect and a pin from an adjacent standard cell. The method further includes verifying that the keep out area separates the interconnect from the pin from the adjacent standard cell by at least a predetermined distance.
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公开(公告)号:US20190155983A1
公开(公告)日:2019-05-23
申请号:US15908353
申请日:2018-02-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Sheng-Hsiung CHEN , Ming-Huei Tsai , Shao-Huan Wang , Shu-Yu Chen , Wen-Hao Chen , Chun-Chen Chen
Abstract: The present disclosure describes a method for detecting unacceptable connection patterns. The method includes, using a processor to perform at least one of: performing an automated place-and-route (APR) process on a circuit layout that includes a first standard cell without a marker layer to generate a circuit graphic database system (GDS) file from the circuit layout, generating a standard-cell GDS file that includes a second standard cell with at least one marker layer applied to the second standard cell, and merging the circuit GDS file with the standard-cell GDS file to generate a merged GDS file that includes the first standard cell with at least one marker layer based on the second standard cell. The method further includes determining whether a connection pattern of the first standard cell in the merged GDS file is an unacceptable connection pattern.
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公开(公告)号:US10289794B2
公开(公告)日:2019-05-14
申请号:US15616907
申请日:2017-06-07
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Shao-Huan Wang , Sheng-Hsiung Chen , Wen-Hao Chen , Chun-Chen Chen , Hung-Chih Ou
IPC: G06F17/50 , H01L23/522
Abstract: A system is includes a processor and a computer readable medium. The computer readable medium connected to the processor. The computer readable medium is configured to store instructions. The processor is configured to execute the instructions for determining, according to at least one parameter of a cell in a semiconductor device indicated by a design file, a layout pattern indicating a via pillar structure that meets an electromigration (EM) rule. The via pillar structure comprises metal layers and at least one via, and the at least one via is coupled to the metal layers. The processor is further configured to execute the instructions for including, in the design file, the layout pattern indicating the via pillar structure. The processor is further configured to execute the instructions for generating data which indicate the design file, for fabrication of the semiconductor device.
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公开(公告)号:US20190064770A1
公开(公告)日:2019-02-28
申请号:US15800693
申请日:2017-11-01
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Sheng-Hsiung CHEN , Jerry Chang-Jui Kao , Fong-Yuan Chang , Po-Hsiang Huang , Shao-Huan Wang , XinYong Wang , Yi-Kan Cheng , Chun-Chen Chen
IPC: G05B19/4097 , G06F17/50 , H01L27/02
Abstract: Exemplary embodiments for multiple standard cell libraries are disclosed that include one or more standard cells and one or more corresponding standard cell variations. The one or more standard cell variations have similar functionality as their one or more standard cells but are different from their one or more standard cells in terms of geometric shapes, locations of the geometric shapes, and/or interconnections between the geometric shapes. The exemplary systems and methods described herein selectively choose from among the one or more standard cells and/or the one or more standard cell variations to form an electronic architectural design for analog circuitry and/or digital circuitry of an electronic device. In an exemplary embodiment, a semiconductor foundry and/or semiconductor technology node can impose one or more electronic design constraints on the placement of the one or more standard cells onto an electronic device design real estate. In some situations, some of the one or more standard cells are unable to satisfy the one or more electronic design constraints when placed onto the electronic device design real estate. In these situations, the one or more standard cell variations corresponding to these standard cells are placed onto the electronic device design real estate.
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公开(公告)号:US12056432B2
公开(公告)日:2024-08-06
申请号:US18300142
申请日:2023-04-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Fong-yuan Chang , Chun-Chen Chen , Sheng-Hsiung Chen , Ting-Wei Chiang , Chung-Te Lin , Jung-Chan Yang , Lee-Chung Lu , Po-Hsiang Huang
IPC: G06F30/30 , G06F30/392 , G06F30/394 , G06F30/398 , H01L27/02 , H01L27/118
CPC classification number: G06F30/398 , G06F30/392 , G06F30/394 , H01L27/0207 , H01L27/11807 , H01L2027/11875
Abstract: The present disclosure describes an example method for routing a standard cell with multiple pins. The method can include modifying a dimension of a pin of the standard cell, where the pin is spaced at an increased distance from a boundary of the standard cell than an original position of the pin. The method also includes routing an interconnect from the pin to a via placed on a pin track located between the pin and the boundary and inserting a keep out area between the interconnect and a pin from an adjacent standard cell. The method further includes verifying that the keep out area separates the interconnect from the pin from the adjacent standard cell by at least a predetermined distance.
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公开(公告)号:US20180137230A1
公开(公告)日:2018-05-17
申请号:US15353872
申请日:2016-11-17
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Hung-Chih Ou , Chun-Chen Chen , Sheng-Hsiung Chen
IPC: G06F17/50
CPC classification number: G06F17/5072 , G06F17/5068 , G06F2217/12 , Y02P90/265
Abstract: A method includes following operations. First circuit cells are partitioned into a first frame of a first tier and the first frame of a second tier. The first frame is divided into second frames according to a step size. The first circuit cells between the second frames of the first tier and the second tier are adjusted. The first tier and the second tier, to which the adjusted first circuit cells are assigned, are merged to generate data indicating a layout design, for fabrication of the circuit cells.
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公开(公告)号:US11704472B2
公开(公告)日:2023-07-18
申请号:US17523600
申请日:2021-11-10
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Sheng-Hsiung Chen , Jerry Chang-Jui Kao , Fong-Yuan Chang , Po-Hsiang Huang , Shao-Huan Wang , XinYong Wang , Yi-Kan Cheng , Chun-Chen Chen
IPC: G06F30/00 , G06F30/398 , G06F30/394 , H01L27/02 , G06F111/04 , G06F30/18 , G06F119/18 , G06F111/20
CPC classification number: G06F30/398 , G06F30/394 , H01L27/0207 , G06F30/18 , G06F2111/04 , G06F2111/20 , G06F2119/18
Abstract: Standard cell libraries include one or more standard cells and one or more corresponding standard cell variations. The one or more standard cell variations are different from their one or more standard cells in terms of geometric shapes, locations of the geometric shapes, and/or interconnections between the geometric shapes. The exemplary systems and methods described herein selectively choose from among the one or more standard cells and/or the one or more standard cell variations to form an electronic architectural design for an electronic device. In some situations, some of the one or more standard cells are unable to satisfy one or more electronic design constraints imposed by a semiconductor foundry and/or semiconductor technology node when placed onto the electronic device design real estate. In these situations, the one or more standard cell variations corresponding to these standard cells are placed onto the electronic device design real estate.
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公开(公告)号:US11637098B2
公开(公告)日:2023-04-25
申请号:US17315900
申请日:2021-05-10
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Fong-yuan Chang , Lee-Chung Lu , Po-Hsiang Huang , Chun-Chen Chen , Chung-Te Lin , Ting-Wei Chiang , Sheng-Hsiung Chen , Jung-Chan Yang
IPC: H01L27/00 , H01L27/02 , H01L27/118 , G06F30/394 , G06F30/392
Abstract: The present disclosure describes an example method for routing a standard cell with multiple pins. The method can include modifying a dimension of a pin of the standard cell, where the pin is spaced at an increased distance from a boundary of the standard cell than an original position of the pin. The method also includes routing an interconnect from the pin to a via placed on a pin track located between the pin and the boundary and inserting a keep out area between the interconnect and a pin from an adjacent standard cell. The method further includes verifying that the keep out area separates the interconnect from the pin from the adjacent standard cell by at least a predetermined distance.
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