公开(公告)号：US07339780B2

公开(公告)日：2008-03-04

申请号：US11201278

申请日：2005-08-10

Applicant: Srinivasan Sridharan ,  Umesh Kumar

Inventor： Srinivasan Sridharan ,  Umesh Kumar

IPC: H01G4/228

CPC classification number: H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications is disclosed. The invention includes a capacitor, which includes a conductive copper termination. The copper termination is made by firing an ink including a glass component, which may include ZnO, provided the amount does not exceed about 65 mole %; B2O3, provided the amount does not exceed about 61 mole %; and, SiO2, provided the amount does not exceed about 63 mole %. The molar ratio of B2O3 to SiO2 is from about 0.05 to about 3.

Abstract translation: 公开了一种特别适用于导电油墨应用的耐还原性无铅和无镉玻璃组合物。 本发明包括电容器，其包括导电铜端接件。 铜终端是通过焙烧包括玻璃组分的油墨制成的，该玻璃组分可以包括ZnO，只要该量不超过约65摩尔％; B 2 O 3 3，条件是该量不超过约61摩尔％; 和SiO 2，条件是该量不超过约63摩尔％。 B 2 O 3 O 3与SiO 2的摩尔比为约0.05至约3。

公开(公告)号：US20060028788A1

公开(公告)日：2006-02-09

申请号：US11201278

申请日：2005-08-10

Applicant: Srinivasan Sridharan ,  Umesh Kumar

Inventor： Srinivasan Sridharan ,  Umesh Kumar

IPC: H01G9/00

CPC classification number: H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications. The invention includes a capacitor comprising a conductive copper termination, the copper termination is made by firing an ink including a glass component, the glass component may comprise ZnO, provided the amount does not exceed about 65 mole %; B2O3, provided the amount does not exceed about 61 mole %; and, SiO2, provided the amount does not exceed about 63 mole %. The molar ratio of B2O3 to SiO2 is from about 0.05 to about 3.

Abstract translation: 特别适用于导电油墨应用的抗还原性无铅和无镉玻璃组合物。 本发明包括一种包括导电铜端接件的电容器，铜端接件是通过烧制包括玻璃组分的油墨制成的，该玻璃组分可以包含ZnO，只要该量不超过约65摩尔％; B 2 O 3 3，条件是该量不超过约61摩尔％; 和SiO 2，条件是该量不超过约63摩尔％。 B 2 O 3 O 3与SiO 2的摩尔比为约0.05至约3。

公开(公告)号：US20100163101A1

公开(公告)日：2010-07-01

申请号：US12097823

申请日：2008-04-24

Applicant: Umesh Kumar ,  Virginia L. Whitford ,  Srinivasan Sridharan ,  Aziz S. Shaikh

Inventor： Umesh Kumar ,  Virginia L. Whitford ,  Srinivasan Sridharan ,  Aziz S. Shaikh

IPC: H01L31/0216 ,  H01L31/18 ,  H01B1/02

CPC classification number: H01B1/22 ,  H01L31/022425 ,  H01L31/18 ,  Y02E10/50

Abstract: Formulations and methods of making solar cells and solar cell contacts are disclosed. In general, the invention presents a solar cell contact made from a mixture wherein the mixture comprises a metal portion, which, prior to firing, comprises nickel and silver.

Abstract translation: 公开了制造太阳能电池和太阳能电池触点的制剂和方法。 通常，本发明提供了由混合物制成的太阳能电池触点，其中混合物包括金属部分，其在烧制之前包括镍和银。

公开(公告)号：US06982864B1

公开(公告)日：2006-01-03

申请号：US10864309

申请日：2004-06-09

Applicant: Srinivasan Sridharan ,  Umesh Kumar ,  Chandrashekhar S. Khadilkar

Inventor： Srinivasan Sridharan ,  Umesh Kumar ,  Chandrashekhar S. Khadilkar

IPC: H01G4/06

CPC classification number: H01G4/2325 ,  C03C3/066 ,  C03C8/04 ,  C03C8/14 ,  C03C8/16 ,  C03C8/18

Abstract: Lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications. The invention includes a capacitor comprising a copper termination, the copper termination is made by firing an ink including a glass component, the glass component may comprise up to about 65 mole % ZnO, up to about 51 mole % SrO, about 0.1 to about 61 mole % B2O3, up to about 17 mole % Al2O3, about 0.1 to about 63 mole % Sio2, up to about 40 mole % BaO+CaO, and up to about 20 mole % MgO.

Abstract translation: 无铅和无镉玻璃组合物，特别适用于导电油墨应用。 本发明包括一个包含铜终端的电容器，铜端接件是通过烧制包括玻璃组分的油墨制成的，该玻璃组分可以包括高达约65％（摩尔）的ZnO，至多约51％的SrO，约0.1-约61 摩尔％B 2 O 3 3，至多约17摩尔％的Al 2 O 3 3，约0.1至约 63摩尔％的SiO 2，至多约40摩尔％的BaO + CaO和至多约20摩尔％的MgO。

公开(公告)号：US20050276002A1

公开(公告)日：2005-12-15

申请号：US10864309

申请日：2004-06-09

Applicant: Srinivasan Sridharan ,  Umesh Kumar ,  Chandrashekhar Khadilkar

Inventor： Srinivasan Sridharan ,  Umesh Kumar ,  Chandrashekhar Khadilkar

IPC: H01G4/06 ,  H01G4/232

CPC classification number: H01G4/2325 ,  C03C3/066 ,  C03C8/04 ,  C03C8/14 ,  C03C8/16 ,  C03C8/18

Abstract: Lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications. The invention includes a capacitor comprising a copper termination, the copper termination is made by firing an ink including a glass component, the glass component may comprise up to about 65 mole % ZnO, up to about 51 mole % SrO, about 0.1 to about 61 mole % B2O3, up to about 17 mole % Al2O3, about 0.1 to about 63 mole % SiO2, up to about 40 mole % BaO+CaO, and up to about 20 mole % MgO.

Abstract translation: 无铅和无镉玻璃组合物，特别适用于导电油墨应用。 本发明包括一个包含铜终端的电容器，铜端接件是通过烧制包括玻璃组分的油墨制成的，该玻璃组分可以包括高达约65％（摩尔）的ZnO，至多约51％的SrO，约0.1-约61 摩尔％B 2 O 3 3，至多约17摩尔％的Al 2 O 3 3，约0.1至约 63摩尔％SiO 2，至多约40摩尔％的BaO + CaO和至多约20摩尔％的MgO。

公开(公告)号：US09824790B2

公开(公告)日：2017-11-21

申请号：US14240788

申请日：2012-08-16

Applicant: Dongshe Zhang ,  Aziz S. Shaikh ,  Srinivasan Sridharan ,  Himal Khatri ,  Hong Jiang ,  George E. Graddy, Jr.

Inventor： Dongshe Zhang ,  Aziz S. Shaikh ,  Srinivasan Sridharan ,  Himal Khatri ,  Hong Jiang ,  George E. Graddy, Jr.

IPC: H01L31/00 ,  H01B1/22 ,  C07F9/11 ,  C03C8/16 ,  C03C8/18 ,  C03C8/22 ,  H01L31/0224 ,  H01L21/22 ,  C03C8/10 ,  C03C8/08

CPC classification number: H01B1/22 ,  C03C8/08 ,  C03C8/10 ,  C03C8/16 ,  C03C8/18 ,  C03C8/22 ,  C07F9/11 ,  H01L21/2225 ,  H01L31/022425 ,  H01L31/022441 ,  Y02E10/50

Abstract: Paste compositions, methods of making a paste composition, photovoltaic cells, and methods of making a photovoltaic cell contact are disclosed. The paste composition can include a conductive metal component such as aluminum, phosphate glass, phosphorus compounds such as alky! phosphate, and a vehicle. The contact can be formed on a passivation layer on a silicon wafer by applying the paste on the passivation layer and firing the paste. During firing, the metal component can fire through the passivation layer, thereby electrically contacting the silicon substrate.

公开(公告)号：US09272497B2

公开(公告)日：2016-03-01

申请号：US13808422

申请日：2011-07-22

Applicant: Chandrashekhar S. Khadilkar ,  Robert P. Blonski ,  Srinivasan Sridharan ,  Jackie D. Davis ,  John J. Maloney ,  James D. Walker ,  Andrew M. Rohn, Jr.

Inventor： Chandrashekhar S. Khadilkar ,  Robert P. Blonski ,  Srinivasan Sridharan ,  Jackie D. Davis ,  John J. Maloney ,  James D. Walker ,  Andrew M. Rohn, Jr.

IPC: B32B37/12 ,  B05D3/00 ,  C09D5/34 ,  C09D7/12 ,  H01L31/048 ,  C08K7/14 ,  H01L51/52

CPC classification number: B32B37/12 ,  B05D3/007 ,  C08K7/14 ,  C09D5/34 ,  C09D7/70 ,  H01L31/048 ,  H01L31/0481 ,  H01L31/0488 ,  H01L51/5246 ,  Y02E10/50 ,  Y10T428/1314

Abstract: A glass-flake loaded organic sealant system is useful for sealing active layers such as those in electronic devices and solar cells.

Abstract translation: 玻璃片装载的有机密封剂系统可用于密封诸如电子设备和太阳能电池中的活性层的活性层。

公开(公告)号：US09156735B2

公开(公告)日：2015-10-13

申请号：US13642553

申请日：2011-04-27

Applicant: John J. Maloney ,  Robert P. Blonski ,  Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan

Inventor： John J. Maloney ,  Robert P. Blonski ,  Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan

IPC: H01L31/048 ,  C03C27/04 ,  H01L21/02 ,  H01L21/50 ,  H01L23/10 ,  C03C3/066 ,  C03C3/12 ,  C03C3/14 ,  C03C8/04 ,  C03C8/14 ,  H01L51/52

CPC classification number: C03C27/044 ,  C03C3/066 ,  C03C3/122 ,  C03C3/14 ,  C03C8/04 ,  C03C8/14 ,  H01L21/02345 ,  H01L21/50 ,  H01L23/10 ,  H01L31/0481 ,  H01L31/0488 ,  H01L51/5246 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  Y02E10/50 ,  H01L2924/00

Abstract: Durable hermetic seals between two inorganic substrates are produced using a high-intensity electromagnetic energy source, such as laser, to heat and seal enamel layers with controlled absorption of high-intensity energy source. Durable hermetic seals incorporating electrical feedthroughs are also produced.

Abstract translation: 使用高强度电磁能源（例如激光）产生两个无机基底之间的耐久气密密封，以加热和密封具有受控吸收的高强度能量源的搪瓷层。 还生产结合电馈通的耐用气密密封件。

公开(公告)号：US09023010B2

公开(公告)日：2015-05-05

申请号：US11923068

申请日：2007-10-24

Applicant: Jessica G. Chiu ,  Gregory Waimong Chan ,  Gabriel Asongwe ,  Robert C. Esselstein ,  Douglas Gesswein ,  Srinivasan Sridharan ,  Nianjiong Joan Bei ,  William E. Webler ,  Stephen G. Schaible ,  Mina Chow ,  Yan Shen ,  Hongzhi Bai ,  Mark J. Bly ,  Thomas R. Hatten

Inventor： Jessica G. Chiu ,  Gregory Waimong Chan ,  Gabriel Asongwe ,  Robert C. Esselstein ,  Douglas Gesswein ,  Srinivasan Sridharan ,  Nianjiong Joan Bei ,  William E. Webler ,  Stephen G. Schaible ,  Mina Chow ,  Yan Shen ,  Hongzhi Bai ,  Mark J. Bly ,  Thomas R. Hatten

IPC: A61M31/00 ,  A61M25/10

CPC classification number: A61M25/10 ,  A61M25/1002 ,  A61M2025/1052

Abstract: Embodiments include an infusion-occlusion system having a delivery catheter, a guide catheter adapted to receive the delivery catheter, and a guidewire with an occlusion device adapted to be received within the guide catheter. The guide catheter of the catheter kit may be provided with an occlusion device at the distal end of the guide catheter. The delivery catheter may have an accessory lumen, coaxial or co-linear lumen, a supporting mandrel, or an occlusion device at its distal end. Moreover, according to some embodiments, occlusion devices may be a single material or a composite balloon having an inner liner and an outer layer of different materials, a high compliance low pressure balloon, or a filter device that restricts particles from passing through but does not restrict fluid, such as blood. An inflation device with a large volume and low volume syringe can be used to inflate the balloon.

Abstract translation: 实施例包括具有输送导管的输液阻塞系统，适于接收输送导管的引导导管，以及具有适于容纳在引导导管内的闭塞装置的导丝。 导管套件的引导导管可以在引导导管的远端处设置有闭塞装置。 输送导管可以具有附件腔，同轴或共线腔，支撑心轴或其远端处的闭塞装置。 此外，根据一些实施例，闭塞装置可以是具有内衬和不同材料外层的单一材料或复合球囊，高顺应性低压气球或限制颗粒通过但不限制的过滤装置 限制流体，如血液。 可以使用具有大体积和低体积注射器的充气装置来使气囊膨胀。

公开(公告)号：US08786034B2

公开(公告)日：2014-07-22

申请号：US13608022

申请日：2012-09-10

Applicant: Robert D. Gardner ,  Keith M. Mason ,  Srinivasan Sridharan ,  Aziz S. Shaikh

Inventor： Robert D. Gardner ,  Keith M. Mason ,  Srinivasan Sridharan ,  Aziz S. Shaikh

IPC: H01L29/84

CPC classification number: C03C8/24 ,  C03C3/066 ,  C03C3/072 ,  C03C3/16 ,  C03C8/245 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.

Abstract translation: 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。