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    Image pickup apparatus and camera module
    1.
    发明授权
    Image pickup apparatus and camera module 有权

    公开(公告)号：US11387189B2

    公开(公告)日：2022-07-12

    申请号：US16849861

    申请日：2020-04-15

    Applicant: SONY CORPORATION

    Inventor： Masami Suzuki ,  Yoshihito Higashitsutsumi

    IPC: H04N5/225 ,  H01L23/552 ,  H01L27/146 ,  H04N9/04 ,  H01L31/0232

    Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

    Image pickup apparatus and camera module
    2.
    发明授权
    Image pickup apparatus and camera module 有权

    公开(公告)号：US10658301B2

    公开(公告)日：2020-05-19

    申请号：US15645572

    申请日：2017-07-10

    Applicant: SONY CORPORATION

    Inventor： Masami Suzuki ,  Yoshihito Higashitsutsumi

    IPC: H04N5/225 ,  H01L23/552 ,  H01L27/146 ,  H01L31/0232 ,  H04N5/369

    Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

    Information processing apparatus, information processing method, program, and measuring system
    5.
    发明授权
    Information processing apparatus, information processing method, program, and measuring system 有权

    公开(公告)号：US10026172B2

    公开(公告)日：2018-07-17

    申请号：US15474575

    申请日：2017-03-30

    Applicant: SONY CORPORATION

    Inventor： Yoshihito Higashitsutsumi ,  Jun Iwama ,  Naoki Nishi ,  Yoshiteru Kamatani ,  Akinori Kadota

    IPC: G06K9/00 ,  G06T7/00 ,  G06T1/60 ,  G06K9/62 ,  G06T7/60 ,  G06T7/55 ,  G06K9/52 ,  A61B18/18

    Abstract: There is provided an imaging unit comprising at least one image sensor, a measuring instrument including at least one marker, a position computing unit, a determining unit, and an output controller, wherein the imaging unit is configured to acquire an image comprising a user and the marker, and provide the acquired image to the position computing unit, wherein the position computing unit is configured to compute a position of the marker with respect to the user based on the image provided by the imaging unit, and further provide the computed position to the determining unit, wherein the determining unit is configured to determine whether the computed position of the marker matches a retrieved measurement position, and further output the result of the determination to the output controller, and wherein the output controller is configured to provide an indication when the marker position matches the measurement position.

    INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, PROGRAM, AND MEASURING SYSTEM
    9.
    发明申请
    INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, PROGRAM, AND MEASURING SYSTEM 有权
    信息处理设备，信息处理方法，程序和测量系统

    公开(公告)号：US20150235359A1

    公开(公告)日：2015-08-20

    申请号：US14427757

    申请日：2013-09-13

    Applicant: SONY CORPORATION

    Inventor： Yoshihito Higashitsutsumi ,  Jun Iwama ,  Naoki Nishi ,  Yoshiteru Kamatani ,  Akinori Kadota

    IPC: G06T7/00 ,  G06T1/60 ,  G06K9/52 ,  G06K9/62

    CPC classification number: G06T7/0012 ,  A61B5/0077 ,  A61B5/064 ,  A61B5/441 ,  A61B5/743 ,  G06K9/52 ,  G06K9/6215 ,  G06T1/60 ,  G06T7/55 ,  G06T7/60 ,  G06T7/73 ,  G06T2207/30088 ,  G06T2207/30204

    Abstract: There is provided an imaging unit comprising at least one image sensor, a measuring instrument including at least one marker, a position computing unit, a determining unit, and an output controller, wherein the imaging unit is configured to acquire an image comprising a user and the marker, and provide the acquired image to the position computing unit, wherein the position computing unit is configured to compute a position of the marker with respect to the user based on the image provided by the imaging unit, and further provide the computed position to the determining unit, wherein the determining unit is configured to determine whether the computed position of the marker matches a retrieved measurement position, and further output the result of the determination to the output controller, and wherein the output controller is configured to provide an indication when the marker position matches the measurement position.

    Abstract translation: 提供了一种成像单元，包括至少一个图像传感器，包括至少一个标记的测量仪器，位置计算单元，确定单元和输出控制器，其中所述成像单元被配置为获取包括用户的图像， 并且将所获取的图像提供给所述位置计算单元，其中所述位置计算单元被配置为基于由所述成像单元提供的图像来计算所述标记相对于所述用户的位置，并且还将所计算的位置提供给 所述确定单元，其中所述确定单元被配置为确定所计算的所述标记的位置是否与检索到的测量位置匹配，并且还将所述确定的结果输出到所述输出控制器，并且其中所述输出控制器被配置为提供何时 标记位置与测量位置相匹配。

    Image pickup apparatus and camera module
    10.
    发明授权
    Image pickup apparatus and camera module 有权

    公开(公告)号：US09735115B2

    公开(公告)日：2017-08-15

    申请号：US15138887

    申请日：2016-04-26

    Applicant: SONY CORPORATION

    Inventor： Masami Suzuki ,  Yoshihito Higashitsutsumi

    IPC: H04N5/225 ,  H01L23/552 ,  H01L31/0232 ,  H04N5/369 ,  H01L27/146

    CPC classification number: H01L23/552 ,  H01L27/14618 ,  H01L27/14636 ,  H01L31/02325 ,  H01L2224/13 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/369

    Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

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