公开(公告)号：US06428389B1

公开(公告)日：2002-08-06

申请号：US09859641

申请日：2001-05-18

Applicant: Shuzo Sato ,  Hiizu Ootorii ,  Takaaki Kozuki

Inventor： Shuzo Sato ,  Hiizu Ootorii ,  Takaaki Kozuki

IPC: B24B960

Abstract: A polishing wheel is pushed up and down in the Z-axis direction owing to a wafer surface shape. And the polishing amount depends on the height of protrusions on a wafer surface. Where a spindle is a rigid body in the Z-axis direction, the pressing force of the polishing wheel caused by vertical movement of a tool varies depending on the position on a wafer and hence polishing is not performed uniformly To solve this problem, the spindle is provided with a Z-axis parallel leaf spring mechanism. Push-up and push-down actions of the polishing wheel are absorbed by displacement of the parallel leaf spring mechanism. This enables uniform polishing. Since the tool can be hardened, the flatness can also be improved.

公开(公告)号：US06280292B1

公开(公告)日：2001-08-28

申请号：US09370225

申请日：1999-08-09

Applicant: Shuzo Sato ,  Hiizu Ootorii ,  Takaaki Kozuki

Inventor： Shuzo Sato ,  Hiizu Ootorii ,  Takaaki Kozuki

IPC: B24B900

CPC classification number: B23Q11/0032 ,  B24B37/04 ,  B24B41/042 ,  B24B49/16

Abstract: A polishing wheel is pushed up and down in the Z-axis direction owing to a wafer surface shape. And the polishing amount depends on the height of protrusions on a wafer surface. Where a spindle is a rigid body in the Z-axis direction, the pressing force of the polishing wheel caused by vertical movement of a tool varies depending on the position on a wafer and hence polishing is not performed uniformly. To solve this problem, the spindle is provided with a Z-axis parallel leaf spring mechanism. Push-up and push-down actions of the polishing wheel are absorbed by displacement of the parallel leaf spring mechanism. This enables uniform polishing. Since the tool can be hardened, the flatness can also be improved.

Abstract translation: 由于晶片表面形状，抛光轮在Z轴方向上下移动。 并且抛光量取决于晶片表面上的突起的高度。 在主轴是Z轴方向的刚体的情况下，由工具的垂直移动引起的抛光轮的按压力根据晶片上的位置而变化，因此不进行均匀的抛光。 为了解决这个问题，主轴设有Z轴平行板簧机构。 抛光轮的上推和下推动作被平行板簧机构的位移所吸收。 这使得均匀的抛光。 由于该工具可以硬化，所以也可以提高平坦度。

公开(公告)号：US06846227B2

公开(公告)日：2005-01-25

申请号：US10085747

申请日：2002-02-28

Applicant: Shuzo Sato ,  Zenya Yasuda ,  Masao Ishihara ,  Hiizu Ootorii ,  Takeshi Nogami ,  Naoki Komai

Inventor： Shuzo Sato ,  Zenya Yasuda ,  Masao Ishihara ,  Hiizu Ootorii ,  Takeshi Nogami ,  Naoki Komai

IPC: B23H3/00 ,  B24B7/22 ,  B24B21/04 ,  B24B37/04 ,  B24B57/02 ,  C25F7/00 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/768 ,  B24B29/00

CPC classification number: B24B37/04 ,  B24B7/228 ,  B24B21/04 ,  B24B57/02 ,  Y10S451/908

Abstract: The electro-chemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electro-chemical machining apparatus performs electro-chemical machining of an object to be machined having a metal film on the surface to be machined. Such apparatus has a means for holding the object to be machined, a wiper for wiping the surface of the object to be machined, a means for supplying electrolytic solution onto the surface of the object to be machined, a first electrode disposed at a position opposed to the surface of the object to be machined, a second electrode disposed at a peripheral portion on the surface of the object to be machined, and a power supply for causing electrical current to flow between the second electrode on the surface of the object to be machined and the first electrode.

Abstract translation: 本发明的电化学加工装置被设计成通过有效地降低初始粗糙表面并且减少对金属膜的损伤去除过量的金属膜来平滑金属膜。 为此，电化学加工装置对待加工表面上具有金属膜的被加工物进行电化学加工。 这种装置具有用于保持待加工物体的装置，用于擦拭待加工物体的表面的擦拭器，用于将电解液供给到待加工物体的表面上的装置，设置在相对的位置的第一电极 到被加工物的表面，设置在被加工物的表面的周边部分的第二电极，以及用于使电流在物体表面上的第二电极之间流动的电源为 加工和第一个电极。

公开(公告)号：US06797623B2

公开(公告)日：2004-09-28

申请号：US09800580

申请日：2001-03-08

Applicant: Shuzo Sato ,  Yuji Segawa ,  Akira Yoshio ,  Hiizu Ootorii ,  Zenya Yasuda ,  Masao Ishihara ,  Takeshi Nogami ,  Naoki Komai

Inventor： Shuzo Sato ,  Yuji Segawa ,  Akira Yoshio ,  Hiizu Ootorii ,  Zenya Yasuda ,  Masao Ishihara ,  Takeshi Nogami ,  Naoki Komai

IPC: H01L21302

CPC classification number: B24B37/042 ,  B23H5/08 ,  B24B37/046 ,  B24B37/16 ,  B24B37/26 ,  C25F3/30 ,  C25F7/00 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/7684 ,  H01L21/76843

Abstract: A method of production and a method of polishing a semiconductor device and a polishing apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in efficiency of removal of an excess metal film, and capable of suppressing damage to an interlayer insulation film below the metal film when flattening the metal film by polishing, the polishing method including the steps of interposing an electrolytic solution including a chelating agent between a cathode member and the copper film, applying a voltage between the cathode member used as a cathode and the copper film used as an anode to oxidize the surface of the copper film and forming a chelate film of the oxidized copper, selectively removing a projecting portion of the chelate film corresponding to the shape of the copper film to expose the projecting portion of the copper film at its surface, and repeating the above chelate film forming step and the above chelate film removing step until the projecting portion of the copper film is flattened.

Abstract translation: 一种生产方法和抛光半导体器件和抛光装置的方法，其能够容易地平坦化金属膜的初始不均匀性，除去过量金属膜的效率优异，并且能够抑制对层间绝缘膜的损伤 在通过抛光使金属膜平坦化时，金属膜下方的抛光方法包括以下步骤：在阴极构件和铜膜之间插入包含螯合剂的电解液，在用作阴极的阴极构件和铜 膜用作氧化铜膜的表面并形成氧化铜的螯合膜，选择性地除去与铜膜形状相对应的螯合膜的突出部分，以暴露铜膜的突出部分 并重复上述螯合膜形成步骤和上述螯合膜去除步骤，直到突出 使铜膜变平。

公开(公告)号：US07186322B2

公开(公告)日：2007-03-06

申请号：US10327860

申请日：2002-12-26

Applicant: Shuzo Sato ,  Yuji Segawa ,  Akira Yoshio ,  Hiizu Ootorii ,  Zenya Yasuda ,  Masao Ishihara ,  Takeshi Nogami ,  Naoki Komai

Inventor： Shuzo Sato ,  Yuji Segawa ,  Akira Yoshio ,  Hiizu Ootorii ,  Zenya Yasuda ,  Masao Ishihara ,  Takeshi Nogami ,  Naoki Komai

IPC: C25D17/00

CPC classification number: B24B37/042 ,  B23H5/08 ,  B24B37/046 ,  B24B37/16 ,  B24B37/26 ,  C25F3/30 ,  C25F7/00 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/7684 ,  H01L21/76843

Abstract: A method of production and a method of polishing a semiconductor device and a polishing apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in efficiency of removal of an excess metal film, and capable of suppressing damage to an interlayer insulation film below the metal film when flattening the metal film by polishing, the polishing method including the steps of interposing an electrolytic solution including a chelating agent between a cathode member and the copper film, applying a voltage between the cathode member used as a cathode and the copper film used as an anode to oxidize the surface of the copper film and forming a chelate film of the oxidized copper, selectively removing a projecting portion of the chelate film corresponding to the shape of the copper film to expose the projecting portion of the copper film at its surface, and repeating the above chelate film forming step and the above chelate film removing step until the projecting portion of the copper film is flattened.

Abstract translation: 一种生产方法和抛光半导体器件和抛光装置的方法，其能够容易地平坦化金属膜的初始不均匀性，除去过量金属膜的效率优异，并且能够抑制对层间绝缘膜的损伤 在通过抛光使金属膜平坦化时，金属膜下方的抛光方法包括以下步骤：在阴极构件和铜膜之间插入包含螯合剂的电解液，在用作阴极的阴极构件和铜 膜用作氧化铜膜的表面并形成氧化铜的螯合膜，选择性地除去与铜膜形状相对应的螯合膜的突出部分，以暴露铜膜的突出部分 并重复上述螯合膜形成步骤和上述螯合膜去除步骤，直到突出 使铜膜变平。

公开(公告)号：US20050082165A1

公开(公告)日：2005-04-21

申请号：US10983545

申请日：2004-11-08

Applicant: Shuzo Sato ,  Zenya Yasuda ,  Masao Ishihara ,  Hiizu Ootorii ,  Takeshi Nogami ,  Naoki Komai

Inventor： Shuzo Sato ,  Zenya Yasuda ,  Masao Ishihara ,  Hiizu Ootorii ,  Takeshi Nogami ,  Naoki Komai

IPC: B23H3/00 ,  B24B7/22 ,  B24B21/04 ,  B24B37/04 ,  B24B57/02 ,  C25F7/00 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/768 ,  B23H7/14

CPC classification number: B24B37/04 ,  B24B7/228 ,  B24B21/04 ,  B24B57/02 ,  Y10S451/908

Abstract: The electrochemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electrochemical machining apparatus performs electrochemical machining of an object to be machined having a metal film on the surface to be machined. Such apparatus has a means for holding the object to be machined, a wiper for wiping the surface of the object to be machined, a means for supplying electrolytic solution onto the surface of the object to be machined, a first electrode disposed at a position opposed to the surface of the object to be machined, a second electrode disposed at a peripheral portion on the surface of the object to be machined, and a power supply for causing electrical current to flow between the second electrode on the surface of the object to be machined and the first electrode.

Abstract translation: 本发明的电化学加工装置被设计成通过有效地减少初始粗糙表面和去除对金属膜的损坏的过量金属膜来平滑金属膜。 为此，电化学加工装置对待加工表面上具有金属膜的被加工物进行电化学加工。 这种装置具有用于保持待加工物体的装置，用于擦拭待加工物体的表面的擦拭器，用于将电解液供给到待加工物体的表面上的装置，设置在相对的位置的第一电极 到被加工物的表面，设置在被加工物的表面的周边部分的第二电极，以及用于使电流在物体表面上的第二电极之间流动的电源为 加工和第一个电极。

公开(公告)号：US20130092850A1

公开(公告)日：2013-04-18

申请号：US13616261

申请日：2012-09-14

Applicant: Hiizu Ootorii

Inventor： Hiizu Ootorii

IPC: H01S5/02 ,  H01L31/12

CPC classification number: H01S5/02 ,  H01L31/167 ,  H01L2224/95001 ,  H01L2924/15311 ,  H01S5/0224 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02469 ,  H01S5/0425 ,  H01S5/18305 ,  H01S2301/176

Abstract: There is provided a semiconductor laser device that enables flip-chip assembly by providing an embedding section around a mesa section, and has an improved emission lifetime. There is also provided a photoelectric converter and an optical information processing unit each having the semiconductor laser device. The semiconductor laser device includes: a mesa section including an active layer, and having a first electrode on a top surface; an embedding section covering the mesa section, and having a first connection aperture that reaches the first electrode; and a first wiring provided on the embedding section to be laid across the first connection aperture, the first wiring being electrically connected to the first electrode through the first connection aperture.

Abstract translation: 提供了一种半导体激光器件，其通过在台面部分周围设置嵌入部分来实现倒装芯片组装，并且具有改善的发光寿命。 还提供了具有半导体激光装置的光电转换器和光信息处理单元。 半导体激光器件包括：台面部分，包括有源层，并且在顶表面上具有第一电极; 覆盖台面部分的嵌入部分，并具有到达第一电极的第一连接孔; 以及第一布线，设置在所述嵌入部分上以跨越所述第一连接孔径，所述第一布线通过所述第一连接孔与所述第一电极电连接。

公开(公告)号：US09188746B2

公开(公告)日：2015-11-17

申请号：US13367861

申请日：2012-02-07

Applicant: Hiizu Ootorii

Inventor： Hiizu Ootorii

IPC: G02B6/32 ,  G02B6/42

CPC classification number: G02B6/32 ,  G02B6/4239 ,  G02B6/4244 ,  Y10T156/1052

Abstract: An optical fiber and lens substrate assembly includes: an optical fiber component including an optical fiber core wire, and an end-surface-fixing resin block in which the optical fiber core wire is embedded, and cross section of an optical fiber element wire and a secondary coating that constitute the optical fiber core wire are exposed to a smooth surface thereof; and a lens substrate attached to the smooth surface of the end-surface-fixing resin block.

Abstract translation: 光纤和透镜基板组件包括：包括光纤芯线的光纤部件和嵌入有光纤芯线的端面固定树脂块，以及光纤元件线和 构成光纤芯线的二次涂层暴露于其光滑表面; 以及安装在端面固定树脂块的光滑表面上的透镜基板。

公开(公告)号：US08724670B2

公开(公告)日：2014-05-13

申请号：US13616261

申请日：2012-09-14

Applicant: Hiizu Ootorii

Inventor： Hiizu Ootorii

IPC: H01S5/183

CPC classification number: H01S5/02 ,  H01L31/167 ,  H01L2224/95001 ,  H01L2924/15311 ,  H01S5/0224 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02469 ,  H01S5/0425 ,  H01S5/18305 ,  H01S2301/176

Abstract: There is provided a semiconductor laser device that enables flip-chip assembly by providing an embedding section around a mesa section, and has an improved emission lifetime. There is also provided a photoelectric converter and an optical information processing unit each having the semiconductor laser device. The semiconductor laser device includes: a mesa section including an active layer, and having a first electrode on a top surface; an embedding section covering the mesa section, and having a first connection aperture that reaches the first electrode; and a first wiring provided on the embedding section to be laid across the first connection aperture, the first wiring being electrically connected to the first electrode through the first connection aperture.

Abstract translation: 提供了一种半导体激光器件，其通过在台面部分周围设置嵌入部分来实现倒装芯片组装，并且具有改善的发光寿命。 还提供了具有半导体激光装置的光电转换器和光信息处理单元。 半导体激光器件包括：台面部分，包括有源层，并且在顶表面上具有第一电极; 覆盖台面部分的嵌入部分，并具有到达第一电极的第一连接孔; 以及第一布线，设置在所述嵌入部分上以跨越所述第一连接孔径，所述第一布线通过所述第一连接孔与所述第一电极电连接。

公开(公告)号：US09159712B2

公开(公告)日：2015-10-13

申请号：US13410441

申请日：2012-03-02

Applicant: Hiizu Ootorii

Inventor： Hiizu Ootorii

IPC: H01S5/026 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83874 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01S5/0262 ,  Y10T29/49002 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device-light receiving device assembly includes: a mount substrate having first and second surfaces, and including a first base as a raised portion on the first surface; a light receiving device having first and second surfaces, the first surface of the light receiving device being anchored on the first base; and a light emitting device, the light receiving device including a light passage portion allowing for passage of light emitted by the light emitting device, the light emitted by the light emitting device emerging to outside through the light passage portion, the first base, and the mount substrate, the light receiving device receiving externally incident light through the mount substrate and the first base, the light receiving device including an annular second base as a raised portion on the second surface of the light receiving device, and the light emitting device being anchored on the second base.

Abstract translation: 发光器件光接收装置组件包括：安装基板，具有第一和第二表面，并且在第一表面上包括作为凸起部分的第一基座; 具有第一和第二表面的光接收装置，所述光接收装置的第一表面锚定在所述第一基座上; 以及发光装置，所述光接收装置包括允许由所述发光装置发射的光通过的光通过部分，所述发光装置发射的光通过所述光通过部分向所述外部流出，所述第一基座和 光接收装置通过安装基板和第一基座接收外部入射光，光接收装置在光接收装置的第二表面上包括作为凸起部分的环形第二基座，并且发光装置被锚定 在第二个基地。