Invention Grant
- Patent Title: Light emitting device-light receiving device assembly, and manufacturing method thereof
- Patent Title (中): 发光装置 - 光接收装置组件及其制造方法
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Application No.: US13410441Application Date: 2012-03-02
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Publication No.: US09159712B2Publication Date: 2015-10-13
- Inventor: Hiizu Ootorii
- Applicant: Hiizu Ootorii
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2011-072401 20110329
- Main IPC: H01S5/026
- IPC: H01S5/026 ; H01L25/16 ; H01L23/00

Abstract:
A light emitting device-light receiving device assembly includes: a mount substrate having first and second surfaces, and including a first base as a raised portion on the first surface; a light receiving device having first and second surfaces, the first surface of the light receiving device being anchored on the first base; and a light emitting device, the light receiving device including a light passage portion allowing for passage of light emitted by the light emitting device, the light emitted by the light emitting device emerging to outside through the light passage portion, the first base, and the mount substrate, the light receiving device receiving externally incident light through the mount substrate and the first base, the light receiving device including an annular second base as a raised portion on the second surface of the light receiving device, and the light emitting device being anchored on the second base.
Public/Granted literature
- US20120248977A1 LIGHT EMITTING DEVICE-LIGHT RECEIVING DEVICE ASSEMBLY, AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-10-04
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