Invention Grant
- Patent Title: Electro-chemical machining appartus
- Patent Title (中): 电化学加工配件
-
Application No.: US10085747Application Date: 2002-02-28
-
Publication No.: US06846227B2Publication Date: 2005-01-25
- Inventor: Shuzo Sato , Zenya Yasuda , Masao Ishihara , Hiizu Ootorii , Takeshi Nogami , Naoki Komai
- Applicant: Shuzo Sato , Zenya Yasuda , Masao Ishihara , Hiizu Ootorii , Takeshi Nogami , Naoki Komai
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sonnenschein, Nath & Rosenthal LLP
- Priority: JPP2001-056027 20010228
- Main IPC: B23H3/00
- IPC: B23H3/00 ; B24B7/22 ; B24B21/04 ; B24B37/04 ; B24B57/02 ; C25F7/00 ; H01L21/3205 ; H01L21/321 ; H01L21/768 ; B24B29/00

Abstract:
The electro-chemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electro-chemical machining apparatus performs electro-chemical machining of an object to be machined having a metal film on the surface to be machined. Such apparatus has a means for holding the object to be machined, a wiper for wiping the surface of the object to be machined, a means for supplying electrolytic solution onto the surface of the object to be machined, a first electrode disposed at a position opposed to the surface of the object to be machined, a second electrode disposed at a peripheral portion on the surface of the object to be machined, and a power supply for causing electrical current to flow between the second electrode on the surface of the object to be machined and the first electrode.
Public/Granted literature
- US20020160698A1 Electro-chemical machining apparatus Public/Granted day:2002-10-31
Information query