公开(公告)号：US20110024750A1

公开(公告)日：2011-02-03

申请号：US12846534

申请日：2010-07-29

申请人： Shunpei YAMAZAKI ,  Hiroki OHARA ,  Toshinari SASAKI ,  Kosei NODA ,  Hideaki KUWABARA

发明人： Shunpei YAMAZAKI ,  Hiroki OHARA ,  Toshinari SASAKI ,  Kosei NODA ,  Hideaki KUWABARA

IPC分类号： H01L29/786 ,  H01L21/34 ,  H01L29/772 ,  H01L21/84

CPC分类号： H01L27/1225 ,  G02F1/133345 ,  G02F1/1337 ,  G02F1/134309 ,  G02F1/136227 ,  G02F1/136277 ,  G02F1/1368 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1248 ,  H01L29/24 ,  H01L29/517 ,  H01L29/78609 ,  H01L29/7869

摘要： An object is to provide a semiconductor device having a structure with which parasitic capacitance between wirings can be sufficiently reduced. An oxide insulating layer serving as a channel protective layer is formed over part of an oxide semiconductor layer overlapping with a gate electrode layer. In the same step as formation of the oxide insulating layer, an oxide insulating layer covering a peripheral portion of the oxide semiconductor layer is formed. The oxide insulating layer which covers the peripheral portion of the oxide semiconductor layer is provided to increase the distance between the gate electrode layer and a wiring layer formed above or in the periphery of the gate electrode layer, whereby parasitic capacitance is reduced.

摘要翻译： 目的在于提供一种半导体器件，其具有可以充分降低布线之间的寄生电容的结构。 用作沟道保护层的氧化物绝缘层形成在与栅电极层重叠的氧化物半导体层的一部分上。 在与氧化物绝缘层的形成相同的步骤中，形成覆盖氧化物半导体层的周边部分的氧化物绝缘层。 设置覆盖氧化物半导体层的周边部分的氧化物绝缘层以增加栅极电极层与形成在栅电极层的上方或周围的布线层之间的距离，从而降低寄生电容。

公开(公告)号：US20110284839A1

公开(公告)日：2011-11-24

申请号：US13107283

申请日：2011-05-13

申请人： Shunpei YAMAZAKI ,  Toshinari SASAKI ,  Kosei NODA

发明人： Shunpei YAMAZAKI ,  Toshinari SASAKI ,  Kosei NODA

IPC分类号： H01L29/04 ,  H01L21/20

CPC分类号： H01L29/66969 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02631 ,  H01L21/385 ,  H01L27/1225 ,  H01L29/7869

摘要： It is an object to provide a semiconductor device including an oxide semiconductor, which has stable electric characteristics and high reliability. An oxide semiconductor film serving as a channel formation region of a transistor is formed by a sputtering method at a temperature higher than 200° C., so that the number of water molecules eliminated from the oxide semiconductor film can be 0.5/nm3 or less according to thermal desorption spectroscopy. A substance including a hydrogen atom such as hydrogen, water, a hydroxyl group, or hydride which causes variation in the electric characteristics of a transistor including an oxide semiconductor is prevented from entering the oxide semiconductor film, whereby the oxide semiconductor film can be highly purified and made to be an electrically i-type (intrinsic) semiconductor.

摘要翻译： 本发明的目的是提供一种具有稳定的电特性和高可靠性的氧化物半导体的半导体装置。 通过溅射法在高于200℃的温度下形成用作晶体管的沟道形成区的氧化物半导体膜，从氧化物半导体膜中除去的水分子数可以为0.5nm / nm 3以下 到热解吸光谱。 包含氢原子的物质，例如氢，水，羟基或氢化物，其导致包括氧化物半导体的晶体管的电特性发生变化，从而防止氧化物半导体膜进入氧化物半导体膜，由此氧化物半导体膜可以被高度纯化 并制成电i型（本征）半导体。

公开(公告)号：US20110008931A1

公开(公告)日：2011-01-13

申请号：US12832329

申请日：2010-07-08

申请人： Shunpei YAMAZAKI ,  Miyuki HOSOBA ,  Kosei NODA ,  Hiroki OHARA ,  Toshinari SASAKI ,  Junichiro SAKATA

发明人： Shunpei YAMAZAKI ,  Miyuki HOSOBA ,  Kosei NODA ,  Hiroki OHARA ,  Toshinari SASAKI ,  Junichiro SAKATA

IPC分类号： H01L21/36

CPC分类号： H01L29/66969 ,  H01L21/477 ,  H01L27/1225 ,  H01L29/7869

摘要： A highly reliable semiconductor device which includes a thin film transistor having stable electric characteristics, and a manufacturing method thereof. In the manufacturing method of the semiconductor device which includes a thin film transistor where a semiconductor layer including a channel formation region is an oxide semiconductor layer, heat treatment which reduces impurities such as moisture to improve the purity of the oxide semiconductor layer and oxidize the oxide semiconductor layer (heat treatment for dehydration or dehydrogenation) is performed. Not only impurities such as moisture in the oxide semiconductor layer but also those existing in a gate insulating layer are reduced, and impurities such as moisture existing in interfaces between the oxide semiconductor layer and films provided over and under and in contact with the oxide semiconductor layer are reduced.

摘要翻译： 一种高度可靠的半导体器件及其制造方法，其包括具有稳定电特性的薄膜晶体管。 在包括具有沟道形成区域的半导体层是氧化物半导体层的薄膜晶体管的半导体器件的制造方法中，减少诸如水分的杂质的热处理以提高氧化物半导体层的纯度并氧化氧化物 进行半导体层（脱水或脱氢的热处理）。 氧化物半导体层中的水分等杂质，以及存在于栅极绝缘层中的杂质都会降低，氧化物半导体层和氧化物半导体层之间的界面中存在的杂质如氧化物半导体层和与氧化物半导体层接触的薄膜 减少了

公开(公告)号：US20120193628A1

公开(公告)日：2012-08-02

申请号：US13353608

申请日：2012-01-19

申请人： Toshinari SASAKI ,  Kosei NODA ,  Yuta ENDO

发明人： Toshinari SASAKI ,  Kosei NODA ,  Yuta ENDO

IPC分类号： H01L29/786

CPC分类号： H01L29/78696 ,  H01L29/045 ,  H01L29/24 ,  H01L29/247 ,  H01L29/7869 ,  H01L29/78693

摘要： A highly reliable semiconductor device is manufactured by giving stable electric characteristics to a transistor in which an oxide semiconductor film is used. A p-type oxide semiconductor material is contained in an n-type oxide semiconductor film, whereby carriers which are generated in the oxide semiconductor film without intention can be reduced. This is because electrons generated in the n-type oxide semiconductor film without intention are recombined with holes generated in the p-type oxide semiconductor material to disappear. Accordingly, it is possible to reduce carriers which are generated in the oxide semiconductor film without intention.

摘要翻译： 通过对使用氧化物半导体膜的晶体管赋予稳定的电特性来制造高可靠性的半导体器件。 p型氧化物半导体材料包含在n型氧化物半导体膜中，由此可以减少在氧化物半导体膜中产生的载流子。 这是因为在n型氧化物半导体膜中产生的电子没有意图与在p型氧化物半导体材料中产生的空穴重新组合而消失。 因此，可以无意地减少在氧化物半导体膜中产生的载流子。

公开(公告)号：US20110284847A1

公开(公告)日：2011-11-24

申请号：US13110245

申请日：2011-05-18

申请人： Yuta ENDO ,  Toshinari SASAKI ,  Kosei NODA ,  Mizuho SATO

发明人： Yuta ENDO ,  Toshinari SASAKI ,  Kosei NODA ,  Mizuho SATO

IPC分类号： H01L29/786

CPC分类号： H01L29/7869 ,  H01L27/1225 ,  H01L29/78603 ,  H01L29/78606

摘要： Disclosed is a semiconductor device with a transistor in which an oxide semiconductor is used. An insulating layer on a back channel side of the oxide semiconductor layer has capacitance of lower than or equal to 1.5×10−10 F/m2. For example, in the case of a top-gate transistor, a base insulating layer has capacitance of lower than or equal to 1.5×10−10 F/m2, whereby the adverse effect of an interface state between the substrate and the base insulating layer can be reduced. Thus, a semiconductor device where fluctuation in electrical characteristics is small and reliability is high can be manufactured.

摘要翻译： 公开了具有使用氧化物半导体的晶体管的半导体器件。 氧化物半导体层的背面通道侧的绝缘层的电容为小于或等于1.5×10 -10 F / m 2。 例如，在顶栅晶体管的情况下，基极绝缘层具有小于或等于1.5×10 -10 F / m 2的电容，由此衬底和基底绝缘层之间的界面态的不利影响 可以减少 因此，可以制造电特性波动小，可靠性高的半导体装置。

公开(公告)号：US20120049189A1

公开(公告)日：2012-03-01

申请号：US13188992

申请日：2011-07-22

申请人： Toshinari SASAKI ,  Hitomi SATO ,  Kosei NODA ,  Yuta ENDO ,  Mizuho IKARASHI ,  Keitaro IMAI ,  Atsuo ISOBE ,  Yutaka OKAZAKI

发明人： Toshinari SASAKI ,  Hitomi SATO ,  Kosei NODA ,  Yuta ENDO ,  Mizuho IKARASHI ,  Keitaro IMAI ,  Atsuo ISOBE ,  Yutaka OKAZAKI

IPC分类号： H01L29/12 ,  H01L21/36

CPC分类号： H01L29/7869 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/78606

摘要： It is an object to manufacture a semiconductor device in which a transistor including an oxide semiconductor has normally-off characteristics, small fluctuation in electric characteristics, and high reliability. First, first heat treatment is performed on a substrate, a base insulating layer is formed over the substrate, an oxide semiconductor layer is formed over the base insulating layer, and the step of performing the first heat treatment to the step of forming the oxide semiconductor layer are performed without exposure to the air. Next, after the oxide semiconductor layer is formed, second heat treatment is performed. An insulating layer from which oxygen is released by heating is used as the base insulating layer.

摘要翻译： 本发明的目的是制造其中包括氧化物半导体的晶体管具有常态特性，电特性波动小，可靠性高的半导体器件。 首先，在基板上进行第一热处理，在基板上形成基极绝缘层，在基底绝缘层上形成氧化物半导体层，对形成氧化物半导体的工序进行第一热处理的工序 在不暴露于空气的情况下执行层。 接下来，在形成氧化物半导体层之后，进行第二热处理。 使用通过加热而释放氧的绝缘层作为基底绝缘层。

公开(公告)号：US20120032172A1

公开(公告)日：2012-02-09

申请号：US13193755

申请日：2011-07-29

申请人： Kosei NODA ,  Yuta ENDO ,  Toshinari SASAKI

发明人： Kosei NODA ,  Yuta ENDO ,  Toshinari SASAKI

IPC分类号： H01L29/786

CPC分类号： H01L29/7869 ,  H01L29/41733

摘要： A semiconductor device including the following components and a manufacturing method of the semiconductor device are provided. The semiconductor device includes a substrate; an oxide semiconductor layer over the substrate; a source electrode and a drain electrode whose end portion has a taper angle and whose upper end portion has a curved surface, the source electrode and the drain electrode being electrically connected to the oxide semiconductor layer; a gate insulating layer being in contact with a part of the oxide semiconductor layer and covering the oxide semiconductor layer, the source electrode, and the drain electrode; and a gate electrode overlapping with the oxide semiconductor layer and being over the gate insulating layer.

摘要翻译： 提供了包括以下部件的半导体器件和半导体器件的制造方法。 半导体器件包括衬底; 衬底上的氧化物半导体层; 源极电极和漏电极，其端部具有锥角并且其上端部具有弯曲表面，所述源电极和漏电极电连接到所述氧化物半导体层; 栅绝缘层与所述氧化物半导体层的一部分接触并覆盖所述氧化物半导体层，所述源电极和所述漏电极; 以及与氧化物半导体层重叠并在栅极绝缘层上方的栅电极。

公开(公告)号：US20120040495A1

公开(公告)日：2012-02-16

申请号：US13197825

申请日：2011-08-04

申请人： Kosei NODA ,  Toshinari SASAKI

发明人： Kosei NODA ,  Toshinari SASAKI

IPC分类号： H01L21/385

CPC分类号： H01L29/66969 ,  H01L21/02164 ,  H01L21/465 ,  H01L21/477 ,  H01L22/10 ,  H01L29/401 ,  H01L29/4908 ,  H01L29/78603 ,  H01L29/7869

摘要： A transistor with superior electric characteristics is manufactured. An oxide insulating film is formed over a substrate, an oxide semiconductor film is formed over the oxide insulating film, heat treatment is then conducted at a temperature at which hydrogen contained in the oxide semiconductor film is desorbed and part of oxygen contained in the oxide insulating film is desorbed, then the heated oxide semiconductor film is etched into a predetermined shape to form an island-shaped oxide semiconductor film, a pair of electrodes is formed over the island-shaped oxide semiconductor film, a gate insulating film is formed over the pair of electrodes and the island-shaped oxide semiconductor film, and a gate electrode is formed over the gate insulating film.

摘要翻译： 制造出具有优异电特性的晶体管。 在衬底上形成氧化物绝缘膜，在氧化物绝缘膜上形成氧化物半导体膜，然后在氧化物半导体膜中所含的氢被解吸的温度和氧化物绝缘中包含的部分氧进行热处理 膜被解吸，然后将加热的氧化物半导体膜蚀刻成预定形状以形成岛状氧化物半导体膜，在岛状氧化物半导体膜上形成一对电极，在该对上形成栅极绝缘膜 的电极和岛状氧化物半导体膜，并且栅极电极形成在栅极绝缘膜上。

公开(公告)号：US20110284845A1

公开(公告)日：2011-11-24

申请号：US13110240

申请日：2011-05-18

申请人： Yuta ENDO ,  Toshinari SASAKI ,  Kosei NODA ,  Mizuho SATO

发明人： Yuta ENDO ,  Toshinari SASAKI ,  Kosei NODA ,  Mizuho SATO

IPC分类号： H01L29/786 ,  H01L21/336 ,  H01L29/12

CPC分类号： H01L21/02554 ,  H01L21/02488 ,  H01L21/02664 ,  H01L27/1225 ,  H01L29/4908 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/7869

摘要： An insulating layer containing a silicon peroxide radical is used as an insulating layer in contact with an oxide semiconductor layer for forming a channel. Oxygen is released from the insulating layer, whereby oxygen deficiency in the oxide semiconductor layer and an interface state between the insulating layer and the oxide semiconductor layer can be reduced. Accordingly, a semiconductor device where reliability is high and variation in electric characteristics is small can be manufactured.

摘要翻译： 使用含有硅氧化物自由基的绝缘层作为与用于形成沟道的氧化物半导体层接触的绝缘层。 氧从绝缘层释放，由此可以减少氧化物半导体层中的氧缺乏和绝缘层与氧化物半导体层之间的界面状态。 因此，可以制造可靠性高，电特性变化小的半导体装置。

公开(公告)号：US20110284844A1

公开(公告)日：2011-11-24

申请号：US13110236

申请日：2011-05-18

申请人： Yuta ENDO ,  Toshinari SASAKI ,  Kosei NODA ,  Mizuho SATO

发明人： Yuta ENDO ,  Toshinari SASAKI ,  Kosei NODA ,  Mizuho SATO

IPC分类号： H01L29/786 ,  H01L21/336

CPC分类号： H01L29/78606 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869

摘要： An object of the present invention is to manufacture a semiconductor device where fluctuation in electrical characteristics is small and reliability is high in a transistor in which an oxide semiconductor is used. An insulating layer from which oxygen is released by heating is used as a base insulating layer of an oxide semiconductor layer which forms a channel. Oxygen is released from the base insulating layer, whereby oxygen deficiency in the oxide semiconductor layer and an interface state between the base insulating layer and the oxide semiconductor layer can be reduced. Thus, a semiconductor device where fluctuation in electrical characteristics is small and reliability is high can be manufactured.

摘要翻译： 本发明的目的是制造其中使用氧化物半导体的晶体管的电特性波动小并且可靠性高的半导体器件。 使用通过加热而释放氧的绝缘层作为形成沟道的氧化物半导体层的基极绝缘层。 氧从基底绝缘层释放出来，由此可以减少氧化物半导体层的缺氧和基底绝缘层与氧化物半导体层之间的界面状态。 因此，可以制造电特性波动小，可靠性高的半导体装置。