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公开(公告)号：US11016034B2
公开(公告)日：2021-05-25
申请号：US15687229
申请日：2017-08-25
Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION , SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
Inventor： Manhua Shen , Qiang Wu
IPC: G01N21/00 , G01N21/88 , G02B13/00 , G02B21/00 , G01N21/95 , G02B21/18 , G02B3/00 , G01N21/956 , G06T7/00
Abstract: An apparatus for detecting a defect on a surface of a substrate includes an optical microlens array disposed adjacent to the substrate and including an array of microlenses configured to direct light incident on a second surface of the optical microlens array to exit a first surface of the optical microlens array opposite the second surface for irradiating the surface of the substrate and converge light emitted from the irradiated surface of the substrate, and an imaging member including a plurality of imaging units configured to receive the converged light of the optical microlens array. Each of the imaging units corresponds to a microlens of the optical microlens array and includes a plurality of pixels and a light transmission opening for transmitting a portion of the incident light. The apparatus requires significantly less time to detect surface defects than conventional substrate surface defect detection devices.
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公开(公告)号：US10647073B2
公开(公告)日：2020-05-12
申请号：US15659377
申请日：2017-07-25
Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION , SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
Inventor： Xiaofeng Yuan , Qiang Wu
IPC: B29D11/00 , G02B27/62 , G02B3/00 , G02B7/02 , G02B7/00 , G02B1/04 , G02B6/42 , G02B13/00 , G02B17/08 , G02B27/32
Abstract: A method for assembling a microlens array assembly including a set of microlens array elements having at least two array elements having a first array element and a second array element includes adsorbing the first array element using a mobile platform, adsorbing the second array element using a fixture platform, coarsely aligning the second array element with the first array element based on edges of the second array element and edges of the first array element, finely aligning the second array element with the first array element based on an array pattern of the second array element and an array pattern of the first array element, and attaching the second array element to the first array element. The method enables assembling of multiple microlens array elements.
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公开(公告)号：US09927601B2
公开(公告)日：2018-03-27
申请号：US15192006
申请日：2016-06-24
CPC classification number: G02B19/0095 , G02B19/0019 , H05G2/005 , H05G2/006 , H05G2/008
Abstract: In some embodiments of the disclosed subject matter, an extreme ultraviolet (EUV) light source is provided. The EUV light source comprises: a droplet nozzle array droplet nozzle array comprising multiple nozzles arranged in a ring, the nozzles are configured for sequentially ejecting droplets towards an annular radiation position; a laser source for generating a laser beam, wherein the laser beam is controlled to rotate and sequentially bombard the droplets that reach the annular radiation position; and an integrated rotary structure located between the droplet nozzle array and the laser source, the integrated rotary structure includes: a condenser mirror comprising a first surface and a second surface opposing to the first surface, and a motor driving shaft that is integrally connected with the condenser mirror.
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公开(公告)号：US09323163B2
公开(公告)日：2016-04-26
申请号：US14029939
申请日：2013-09-18
CPC classification number: G03F7/70741
Abstract: A cylindrical reticle system is provided for performing a unidirectional scan-exposure. The cylindrical reticle system includes a base and a center shaft fixed a one side of the base. The cylindrical reticle system also includes a first bearing fixed at the end of the center shaft near to the base and a second bearing fixed at the other end of the center shaft far from the base. Further, the cylindrical reticle system includes a cylindrical reticle having an imaging region and two non-imaging regions at both end of the imaging region.
Abstract translation: 提供圆柱形掩模版系统用于执行单向扫描曝光。 圆柱形掩模版系统包括基座和固定在基座一侧的中心轴。 圆柱形标线系统还包括固定在靠近基座的中心轴的端部处的第一轴承和固定在远离基座的中心轴的另一端的第二轴承。 此外，圆柱形掩模版系统包括具有成像区域和成像区域两端的两个非成像区域的圆柱形掩模版。
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公开(公告)号：US10204809B2
公开(公告)日：2019-02-12
申请号：US15404672
申请日：2017-01-12
Applicant: Semiconductor Manufacturing International (Beijing) Corporation , Semiconductor Manufacturing International (Shanghai) Corporation
Inventor： Qiang Wu , Huayong Hu , Deping Kong
IPC: H01L21/00 , H01L21/67 , H01L21/324 , H01L21/66 , H05B1/02
Abstract: The present disclosure provides a thermal treatment chamber. The thermal treatment chamber includes a wafer holder to hold a to-be-processed wafer; a heat reservoir located under the wafer holder, but being separated from the wafer holder, for adjusting a temperature of the wafer holder based on the to-be-processed wafer; and a first driving unit connected to the heat reservoir for adjusting a distance between the wafer holder and the heat reservoir to adjust the temperature of the wafer holder.
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Patent Agency Ranking
公开(公告)号：US10042269B2
公开(公告)日：2018-08-07
申请号：US15136482
申请日：2016-04-22
Abstract: The present disclosure provides apparatus and methods for overlay measurement. An exemplary overlay measurement apparatus includes an illuminating unit, configured to generate light to illuminate a first overlay marker having a first sub-overlay marker along a first direction and a second overlay marker along a second direction; a first measuring unit, configured to receive light reflected from the first overlay marker to cause the reflected light to laterally shift and shear to generate interference light, to receive the interference light to form a first image and to determine existence of overlay offsets along the first direction and the second direction and values of the overlay offset; and a first drive unit connected to the first measuring unit, and configured to drive the first measuring unit to rotate from a first position to a second position to measure the first sub-overlay marker and the second sub-overlay marker, respectively.
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公开(公告)号：US20180080883A1
公开(公告)日：2018-03-22
申请号：US15706409
申请日：2017-09-15
Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
IPC: G01N21/95 , G06T7/00 , G01N21/88 , G01N21/956
CPC classification number: G01N21/9501 , G01N21/8806 , G01N21/956 , G01N2201/0638 , G02B3/0037 , G06T5/006 , G06T7/0002 , G06T7/0004 , G06T7/0008 , G06T2207/10052 , G06T2207/30121 , G06T2207/30148 , H01L22/12
Abstract: A substrate surface defect detection device includes an optical waveguide for receiving first light and directing the received first light to a surface of a to be tested substrate, the optical waveguide having a first surface facing toward the substrate and a second surface facing away from the substrate, a microlens array disposed on the second surface of the optical waveguide, the microlens array including a plurality of microlenses arranged in an array for receiving second light from the surface of the to be tested substrate and converging the received second light to converged light, and an imaging component for receiving the converged light from the at least one microlens array for optical imaging. The substrate surface defect detection device requires significantly less time than conventional substrate surface defect detection devices.
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公开(公告)号：US09835956B2
公开(公告)日：2017-12-05
申请号：US15131500
申请日：2016-04-18
CPC classification number: G03F7/70633 , G01B11/272 , G03F9/7088
Abstract: The present disclosure provides apparatus and methods for overlay measurement. An exemplary overlay measurement apparatus includes an illuminating unit configured to generate illuminating light to illuminate a first overlay marker formed on a wafer to generate reflected light; and a first measuring unit configured to receive the reflected light from the first overlay marker to cause the reflected light to laterally shift and shear to generate interference light, to receive the interference light to form a first image, and to determine existence of an overlay offset and an exact value of the overlay offset, according to the first image.
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公开(公告)号：US09606451B2
公开(公告)日：2017-03-28
申请号：US14560803
申请日：2014-12-04
Inventor： Qiang Wu , Chang Liu , Jing'An Hao , Huayong Hu , Yang Liu
CPC classification number: G03F7/70358 , G03F7/70283 , G03F7/70725
Abstract: An exposure apparatus is provided for performing a column scan-exposure process. The exposure apparatus includes a base for supporting the exposure apparatus; and a reticle stage configured for holding a reticle having at two mask pattern regions and carrying the reticle to move reciprocally along a scanning direction. The exposure apparatus also includes a wafer stage configured for holding a wafer and carrying the wafer to move reciprocally along the scanning direction. Further, the exposure apparatus includes a control unit configured to control the reticle stage and the wafer stage to cooperatively move to cause the at least two mask pattern regions of the reticle on the reticle stage to be continuously and sequentially projected on at least two corresponding exposure shots of the wafer on the wafer stage along the scanning direction to perform a column scan-exposure process.
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公开(公告)号：US09548225B2
公开(公告)日：2017-01-17
申请号：US14177346
申请日：2014-02-11
CPC classification number: G03F7/42 , B08B3/02 , B08B3/04 , B08B3/08 , B08B5/02 , F26B21/004 , H01L21/02041 , H01L21/02057 , H01L21/02087 , H01L21/67017 , H01L21/67051 , H01L21/6708
Abstract: An edge bead removal apparatus is provided. The edge bead removal apparatus includes a clamping unit configured to clamp a cylindrical reticle and cause the cylindrical reticle to incline with a pre-determined angle and to rotate around a central axis. The edge bead removal apparatus also includes an edge bead removal solvent nozzle configured to spray an edge bead removal solvent to remove edge beads on both edges of the cylindrical reticle.
Abstract translation: 提供了边缘珠去除装置。 边缘珠去除装置包括：夹紧单元，其构造成夹紧圆柱形掩模版并使圆柱形掩模版以预定角度倾斜并围绕中心轴线旋转。 边缘珠去除装置还包括边缘珠去除溶剂喷嘴，其构造成喷射边缘珠去除溶剂以去除圆柱形掩模版的两个边缘上的边缘珠。
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