公开(公告)号：US11984338B2

公开(公告)日：2024-05-14

申请号：US17745595

申请日：2022-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn Gon Oh ,  Ji Hun Kim ,  Seung Gu Bang ,  Sung-Hoon Lee ,  Ho Chan Lee ,  Hyeong Seok Choo

IPC: H01L21/677 ,  B66C19/00

CPC classification number: H01L21/6773 ,  B66C19/00 ,  H01L21/67736

Abstract: A substrate transfer system capable of performing efficient distribution exchange between fabricating facilities is provided. The substrate transfer system includes a lower rail, an upper rail which is located above the lower rail from a ground plane, and extends to be parallel to the lower rail, a conveyor which extends to intersect the lower rail and the upper rail, below the lower rail, a first lower transport unit which transports a first carrier along the lower rail and unloads the first carrier onto the conveyor, and a first upper transport unit which transports a second carrier along the upper rail and unloads the second carrier onto the conveyor, wherein the conveyor includes a linear module which moves the first carrier and the second carrier in a linear direction, and a turning module which turns the first carrier and the second carrier.

公开(公告)号：US12283502B2

公开(公告)日：2025-04-22

申请号：US17543025

申请日：2021-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Wook Kim ,  Sang Min Kim ,  Ji Hun Kim ,  Gi-Nam Park ,  Chul-Jun Park ,  Yong-Jun Ahn ,  Youn Gon Oh ,  Byung Kook Yoo ,  Hyun Woo Lee ,  Jeong Hun Lim

IPC: G06F7/00 ,  H01L21/67 ,  H01L21/677

Abstract: A substrate transfer device includes a transfer unit configured to transfer, in a first direction, a carrier in which substrates are stored, an upper interface unit configured to move the transfer unit, a lower interface unit configured to receive the carrier from the transfer unit, and a controller configured to control the upper interface unit and the lower interface unit integrally such that the transfer unit and the carrier move in the first direction at the same time.

公开(公告)号：US20240128109A1

公开(公告)日：2024-04-18

申请号：US18484562

申请日：2023-10-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Hun Kim ,  Youn Gon Oh ,  Woo-Ram Moon ,  Sang Hyuk Park ,  Jong Hun Lee ,  Kyu-Sik Jeong

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67706 ,  H01L21/67259 ,  H01L21/67715 ,  H01L21/67733 ,  H01L21/68764

Abstract: An apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a driving rail extending in a first direction that the substrate transfer unit moves and a stopper on a side of the driving rail in a second direction crossing the first direction, and a lifting unit configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the substrate transfer unit from the rail unit, wherein the lifting unit is configured to contact the stopper to move the stopper from a closed state to an open state.

公开(公告)号：US20240124230A1

公开(公告)日：2024-04-18

申请号：US18217058

申请日：2023-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn Gon Oh ,  Ji Hun Kim ,  Sang Hyuk Park ,  Young-Kyu Kim

IPC: B65G1/06 ,  B65G1/04 ,  B65G49/06

CPC classification number: B65G1/065 ,  B65G1/0414 ,  B65G49/062 ,  B65G49/067 ,  B65G2201/0297

Abstract: An inter-floor transport system includes a first interface unit at a first floor and configured to receive containers from a transport vehicle, and a car configured to receive containers from the first interface unit at the first floor and move containers to a second floor, where the car includes a cage, a storage unit in the cage and including a plurality of storage areas, and an arrangement unit in the cage, the arrangement unit being configured to receive containers from the first interface unit and store containers in respective storage areas of the plurality of storage areas of the storage unit.

公开(公告)号：US20240006215A1

公开(公告)日：2024-01-04

申请号：US18195757

申请日：2023-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Hyuk PARK ,  Youn Gon Oh ,  Hyuk Kwon ,  Young-Kyu Kim ,  Ji Hun Kim ,  Sung-Hoon Lee ,  Jeong Kwan Jung

IPC: H01L21/677

CPC classification number: H01L21/67733 ,  H01L21/67769 ,  H01L21/6773 ,  H01L21/67706 ,  H01L21/67736

Abstract: A wafer storage and transport system includes a ceiling surface which includes a first surface and a second surface, a first traveling rail installed on the second surface, a second traveling rail which is spaced apart from the first surface in a third direction, and extends in a first direction, a transport unit which is movable in the first direction along the second traveling rail and transports a FOUP, storage spaces installed on the first surface and which may store the FOUP, an interface port installed on the second surface and which temporarily stores the FOUP, and an OHT which is movable along the first traveling rail, wherein the transport unit grasps the FOUP arranged in the storage spaces and transports the FOUP to the interface port, and the OHT grasps the FOUP temporarily stored in the interface port and transports the FOUP to a semiconductor facility.

公开(公告)号：US20250136374A1

公开(公告)日：2025-05-01

申请号：US18608425

申请日：2024-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seong Sil JEONG ,  Youn Gon Oh ,  Sang Hyuk Park

IPC: B65G1/04

Abstract: A transport vehicle includes: a frame having an internal area; a driver on top of the frame, the driver being configured to travel along a rail; a support structure in the internal area, the support structure being configured to seat, thereon, a drone configured to transport an article; and a controller configured to control an operation of at least one of the driver and the support structure.

公开(公告)号：US11982705B2

公开(公告)日：2024-05-14

申请号：US17690317

申请日：2022-03-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn Gon Oh ,  Ji Hun Kim ,  Sae Yun Ko ,  Gil Ho Gu ,  Dong Su Kim ,  Eun Hee Lee ,  Ho Chan Lee ,  Seong Sil Jeong ,  Seong Pyo Hong

IPC: G01R31/28 ,  H01L21/673 ,  H01L21/677

CPC classification number: G01R31/2831 ,  H01L21/6735 ,  H01L21/6773

Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

公开(公告)号：US20220336241A1

公开(公告)日：2022-10-20

申请号：US17543025

申请日：2021-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Wook Kim ,  Sang Min Kim ,  Ji Hun Kim ,  Gi-Nam Park ,  Chul-Jun Park ,  Yong-Jun Ahn ,  Youn Gon Oh ,  Byung Kook Yoo ,  Hyun Woo Lee ,  Jeong Hun Lim

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate transfer device includes a transfer unit configured to transfer, in a first direction, a carrier in which substrates are stored, an upper interface unit configured to move the transfer unit, a lower interface unit configured to receive the carrier from the transfer unit, and a controller configured to control the upper interface unit and the lower interface unit integrally such that the transfer unit and the carrier move in the first direction at the same time.