公开(公告)号：US11982705B2

公开(公告)日：2024-05-14

申请号：US17690317

申请日：2022-03-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn Gon Oh ,  Ji Hun Kim ,  Sae Yun Ko ,  Gil Ho Gu ,  Dong Su Kim ,  Eun Hee Lee ,  Ho Chan Lee ,  Seong Sil Jeong ,  Seong Pyo Hong

IPC: G01R31/28 ,  H01L21/673 ,  H01L21/677

CPC classification number: G01R31/2831 ,  H01L21/6735 ,  H01L21/6773

Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.