公开(公告)号：US11984338B2

公开(公告)日：2024-05-14

申请号：US17745595

申请日：2022-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn Gon Oh ,  Ji Hun Kim ,  Seung Gu Bang ,  Sung-Hoon Lee ,  Ho Chan Lee ,  Hyeong Seok Choo

IPC: H01L21/677 ,  B66C19/00

CPC classification number: H01L21/6773 ,  B66C19/00 ,  H01L21/67736

Abstract: A substrate transfer system capable of performing efficient distribution exchange between fabricating facilities is provided. The substrate transfer system includes a lower rail, an upper rail which is located above the lower rail from a ground plane, and extends to be parallel to the lower rail, a conveyor which extends to intersect the lower rail and the upper rail, below the lower rail, a first lower transport unit which transports a first carrier along the lower rail and unloads the first carrier onto the conveyor, and a first upper transport unit which transports a second carrier along the upper rail and unloads the second carrier onto the conveyor, wherein the conveyor includes a linear module which moves the first carrier and the second carrier in a linear direction, and a turning module which turns the first carrier and the second carrier.