公开(公告)号：US10444162B2

公开(公告)日：2019-10-15

申请号：US15938570

申请日：2018-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shinji Ueyama ,  Masato Kajinami ,  Tatsuya Ishimoto

IPC: G01N21/88 ,  H01L21/67 ,  H01L21/66 ,  G01B11/30 ,  G01N21/94 ,  G01N21/95 ,  G01B11/06 ,  G01B11/25 ,  H01L21/687

Abstract: An apparatus for testing an object includes a moving unit configured to hold and move the object. A transmissive illuminating unit includes a light source generating light and a transmissive mask pattern. The transmissive mask pattern includes a first region configured to convert the light generated from the light source into a slit light, and a second region arranged in a movement direction of the object with respect to the first region to partially transmit the light generated from the light source. The transmissive illuminating unit is configured to project a measuring light, which is provided by transmitting the light generated from the light source through the transmissive mask pattern, to the object. A detecting unit is configured to receive a reflected light of the measuring light from the object and to detect a height and surface state of the object based on the reflected light.

公开(公告)号：US20240201104A1

公开(公告)日：2024-06-20

申请号：US18533528

申请日：2023-12-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KENJI SUZUKI ,  Ingi Kim ,  Mitsunori Numata ,  Shinji Ueyama ,  Tomoki Onishi

IPC: G01N21/95 ,  G01N21/01 ,  G01N35/00

CPC classification number: G01N21/9501 ,  G01N21/01 ,  G01N35/0099

Abstract: An inspection device improves accuracy characteristics of an (MRAM), the inspection device including a stage on which a MRAM element is fixed, and electromagnets generating a first magnetic field. A magnetic field having a component in a direction perpendicular to the stage is changeable from a first direction to a second direction according to a position on the stage. A second magnetic field in which a direction of a magnetic field component is parallel to the stage changes from a third direction to a fourth direction according to the position on the stage, an optical system illuminating the MRAM element with light including polarized light, and condensing reflected light from reflected illumination light from the MRAM element, and a detector detecting reflected light when the position of the MRAM element is changed, and when the position of the MRAM element in the second magnetic field is changed.

公开(公告)号：US20230187249A1

公开(公告)日：2023-06-15

申请号：US18078249

申请日：2022-12-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daisuke NAGATOMO ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/68 ,  G06T7/00 ,  H01L21/67 ,  H01L23/544

CPC classification number: H01L21/681 ,  G06T7/0004 ,  H01L21/67259 ,  H01L23/544 ,  H01L2223/54426 ,  G06T2207/30148

Abstract: A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.

公开(公告)号：US20220216077A1

公开(公告)日：2022-07-07

申请号：US17544197

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daisuke Nagatomo ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/67 ,  H01L21/68 ,  B65G47/90

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

公开(公告)号：US20240272245A1

公开(公告)日：2024-08-15

申请号：US18427676

申请日：2024-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KEN OZAWA ,  Kenji Suzuki ,  Shinji Ueyama

IPC: G01R33/032

CPC classification number: G01R33/0325

Abstract: A semiconductor manufacturing device includes a detection unit that detects an extinction response of a perpendicular magnetic anisotropy PMA film in a sample from a polar Kerr effect signal, and a derivation unit that derives an anisotropic magnetic field (Hk) of the PMA film by extrapolating and fitting the detected extinction response, in magneto-optical Kerr effect measurement that uses a plurality of electromagnets that electrically apply magnetic fields to the sample on the stage by convert a perpendicular magnetic field that includes a vertical component normal to an upper surface of a stage, and a horizontal magnetic field parallel to the upper surface of the stage.

公开(公告)号：US11796608B2

公开(公告)日：2023-10-24

申请号：US17467967

申请日：2021-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Harutaka Sekiya ,  Shinji Ueyama ,  Tomoki Onishi

IPC: G01R33/07 ,  G01R33/032 ,  G01R33/00

CPC classification number: G01R33/0325 ,  G01R33/007 ,  G01R33/0017

Abstract: The inventive concepts provide a magnetic property measurement apparatus capable of quickly measuring a magnetic property of a subject without a decrease in a measurement speed that might occur due to an electromagnet. In addition, the inventive concepts provide a magnetic property measurement apparatus capable of monitoring a magnetization distribution of a memory device as an image and integrating images by using a TDI camera, thereby being capable of performing highly sensitive measurement and not having to capture images for a long time. The magnetic property measurement apparatus includes: a magnetic field generation unit configured to generate a magnetic field which is constant with time and varies with relative position; a mobile unit configured to move a subject to be measured in the magnetic field; and a measurement unit configured to measure a magnetic property of the subject moving in the magnetic field.

公开(公告)号：US09726204B2

公开(公告)日：2017-08-08

申请号：US14562179

申请日：2014-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Masato Kajinami ,  Fumitaka Moroishi ,  Keiji Murata ,  Shinji Ueyama ,  Tatsuya Ishimoto ,  Yoshiaki Yukimori

IPC: F01B31/12 ,  F15B15/08 ,  F15B15/28 ,  F15B15/06 ,  F15B15/14

CPC classification number: F15B15/088 ,  F15B15/063 ,  F15B15/1452 ,  F15B15/1461 ,  F15B15/2846 ,  F15B15/2876 ,  F15B2211/6336 ,  F15B2211/665 ,  F15B2211/6651 ,  F15B2211/8855

Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

公开(公告)号：US12051604B2

公开(公告)日：2024-07-30

申请号：US17544197

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daisuke Nagatomo ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/68

CPC classification number: H01L21/67144 ,  B65G47/905 ,  H01L21/681

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

公开(公告)号：US09082885B2

公开(公告)日：2015-07-14

申请号：US14283238

申请日：2014-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoshiaki Yukimori ,  Shinji Ueyama ,  Masato Kajinami

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L24/93 ,  H01L21/561 ,  H01L21/78 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L2224/83091 ,  H01L2224/83121 ,  H01L2224/83203

Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.

Abstract translation: 一种制造半导体器件的方法包括：提供包括内部布线的第一基板，所述第一基板包括具有第一芯片安装区域的芯片安装区域阵列; 将第一衬底放置在第一载体线上; 提供第一半导体芯片; 将第一半导体芯片放置在第一可移动托盘上; 将第一基板的第一芯片安装区域与第一半导体芯片垂直对准，并且将第一半导体芯片初始接合到第一基板的第一芯片安装区域; 以及在所述第一基板的初始结合的第一半导体芯片和第一安装区域上进行后续的接合，从而在所述第一安装区域将所述第一半导体芯片与所述第一基板更牢固地接合。 在执行第一衬底上的至少一个其它半导体芯片的后续接合之后发生初始接合。