公开(公告)号：US12051604B2

公开(公告)日：2024-07-30

申请号：US17544197

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daisuke Nagatomo ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/68

CPC classification number: H01L21/67144 ,  B65G47/905 ,  H01L21/681

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

公开(公告)号：US20220216077A1

公开(公告)日：2022-07-07

申请号：US17544197

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daisuke Nagatomo ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/67 ,  H01L21/68 ,  B65G47/90

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.