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公开(公告)号：US11171018B2
公开(公告)日：2021-11-09
申请号：US17001150
申请日：2020-08-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Takahiro Tokumiya , Tatsuya Ishimoto
Abstract: A method of fabricating a semiconductor device with improved quality and an encapsulant are provided. The method may include coating a chip wafer including a plurality of semiconductor chips with an encapsulant, performing a pre-curing process to bring the encapsulant into a B-stage, dicing the chip wafer to divide the chip wafer into a plurality of semiconductor chips, forming a chip stack by stacking the semiconductor chip on the base wafer in such a way that a coupling electrode on the base wafer and a bump electrode of each of the semiconductor chips face each other with a conductive adhesive element interposed therebetween, performing a reflow process on the chip stack under pressurized gas to bond the coupling electrode and the bump electrode to each other with the conductive adhesive element interposed therebetween, and performing a post-curing process on the chip stack under pressurized gas to bring the encapsulant into a C-stage.
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公开(公告)号：US09772222B2
公开(公告)日：2017-09-26
申请号：US14959111
申请日：2015-12-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Wen Xi Chen , Takeshi Nagahiro , Yosuke Aoyagi , Naoyuki Takada , Takahiro Tokumiya
CPC classification number: G01J1/0271 , A61B5/02427 , A61B5/6843 , G01J5/0025 , G01J5/0275 , G01J5/04 , G01J5/0896
Abstract: A photoelectric sensor retainer and a photoelectric pulse wave measuring apparatus including the same are provided. The photoelectric sensor retainer includes a sensor mounting unit on which a photoelectric sensor having a light-receiving surface is attachable and detachable, the light-receiving surface facing a measuring direction. The photoelectric sensor retainer further includes a pressing unit configured to press an upper surface of the sensor mounting unit in the measuring direction to apply pressure to the sensor mounting unit, and a pedestal including a seating plate configured to support the pressing unit, the seating plate having a principal plane perpendicular to a pressing direction of the pressing unit.
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公开(公告)号：US11344208B2
公开(公告)日：2022-05-31
申请号：US16157635
申请日：2018-10-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yosuke Aoyagi , Takeshi Nagahiro , Takahiro Tokumiya
Abstract: Provided is a blood pressure measuring apparatus, a wrist watch type terminal, and a method of measuring blood pressure. The blood pressure measuring apparatus includes a light source that emits light onto a living body, a light receiver that receives light from the living body, and a signal processing device that calculates the blood pressure based on a detected signal received from the light receiver, wherein the signal processing device includes a subtractor that obtains a subtraction value by subtracting a moving average value of the detected signal in a second duration which is shorter than a first duration from a moving average value of the detection signal in the first duration, an extractor that extracts a feature point of a pulse wave based on the subtraction value, and a converter that converts a feature amount obtained based on the feature point to a blood pressure value.
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公开(公告)号：US20140188054A1
公开(公告)日：2014-07-03
申请号：US14139014
申请日：2013-12-23
Applicant: The University of Tokyo , Samsung Electronics Co., Ltd.
Inventor： Kazuo IIJIMA , Ken Masamune , Takahiro Tokumiya , Siyang Zuo
IPC: A61M25/00
CPC classification number: A61M25/0052 , A61M25/0144 , A61M2025/0003
Abstract: A medical tube which is highly flexible and has a very small diameter and a flexibility-variable mechanism having the medical tube are provided. The medical tube includes an interior tube and a plurality of annular segments of a cylindrical shape into which the interior tube is inserted. The medical tube is configured by sequentially connecting the plurality of annular segments while the interior tube is inserted inside of the plurality of annular segments. Each annular segment includes a fitting portion that allows any other annular segment to be fitted to the annular segment, and a fitted portion which may be fitted on the fitting portion of any other annular segment, which has a diameter that increases toward an end of the annular segment and includes at least one slit extending in a direction crossing a diametric direction. When the spacing of the slit is narrowed, the fitting portion of the annular segment and the fitted portion of any other annular segment are engaged with each other so that the annular segments are fixed to each other.
Abstract translation: 提供高度柔性且具有非常小直径的医用管和具有医用管的柔性变化机构。 医疗管包括内管和多个圆柱形环形段，内管插入其中。 医疗管通过在将内管插入到多个环状部分的内部的状态下依次连接多个环状部分构成。 每个环形段包括允许任何其它环形区段装配到环形区段的装配部分，以及可以装配在任何其它环形区段的嵌合部分上的嵌合部分，该嵌合部分的直径朝向 并且包括沿与直径方向交叉的方向延伸的至少一个狭缝。 当狭缝的间隔变窄时，环形片段的装配部分和任何其它环形片段的装配部分彼此接合，使得环形片段彼此固定。
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Patent Agency Ranking
5.发明授权公开(公告)号：US12051604B2
公开(公告)日：2024-07-30
申请号：US17544197
申请日：2021-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Daisuke Nagatomo , Fumitaka Moroishi , Masanori Izumita , Shinji Ueyama , Takahiro Tokumiya , Takamasa Sugiura , Tatsuya Ishimoto , Masato Kajinami
CPC classification number: H01L21/67144 , B65G47/905 , H01L21/681
Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.
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公开(公告)号：US20210111040A1
公开(公告)日：2021-04-15
申请号：US17001150
申请日：2020-08-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Takahiro Tokumiya , Tatsuya Ishimoto
Abstract: A method of fabricating a semiconductor device with improved quality and an encapsulant are provided. The method may include coating a chip wafer including a plurality of semiconductor chips with an encapsulant, performing a pre-curing process to bring the encapsulant into a B-stage, dicing the chip wafer to divide the chip wafer into a plurality of semiconductor chips, forming a chip stack by stacking the semiconductor chip on the base wafer in such a way that a coupling electrode on the base wafer and a bump electrode of each of the semiconductor chips face each other with a conductive adhesive element interposed therebetween, performing a reflow process on the chip stack under pressurized gas to bond the coupling electrode and the bump electrode to each other with the conductive adhesive element interposed therebetween, and performing a post-curing process on the chip stack under pressurized gas to bring the encapsulant into a C-stage.
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公开(公告)号：US20230187249A1
公开(公告)日：2023-06-15
申请号：US18078249
申请日：2022-12-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Daisuke NAGATOMO , Fumitaka Moroishi , Masanori Izumita , Shinji Ueyama , Takahiro Tokumiya , Takamasa Sugiura , Tatsuya Ishimoto , Masato Kajinami
IPC: H01L21/68 , G06T7/00 , H01L21/67 , H01L23/544
CPC classification number: H01L21/681 , G06T7/0004 , H01L21/67259 , H01L23/544 , H01L2223/54426 , G06T2207/30148
Abstract: A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.
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8.发明申请公开(公告)号：US20220216077A1
公开(公告)日：2022-07-07
申请号：US17544197
申请日：2021-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Daisuke Nagatomo , Fumitaka Moroishi , Masanori Izumita , Shinji Ueyama , Takahiro Tokumiya , Takamasa Sugiura , Tatsuya Ishimoto , Masato Kajinami
Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.
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公开(公告)号：US09526862B2
公开(公告)日：2016-12-27
申请号：US14139014
申请日：2013-12-23
Applicant: Samsung Electronics Co., Ltd. , The University of Tokyo
Inventor： Kazuo Iijima , Ken Masamune , Takahiro Tokumiya , Siyang Zuo
CPC classification number: A61M25/0052 , A61M25/0144 , A61M2025/0003
Abstract: A medical tube which is highly flexible and has a very small diameter and a flexibility-variable mechanism having the medical tube are provided. The medical tube includes an interior tube and a plurality of annular segments of a cylindrical shape into which the interior tube is inserted. The medical tube is configured by sequentially connecting the plurality of annular segments while the interior tube is inserted inside of the plurality of annular segments. Each annular segment includes a fitting portion that allows any other annular segment to be fitted to the annular segment, and a fitted portion which may be fitted on the fitting portion of any other annular segment, which has a diameter that increases toward an end of the annular segment and includes at least one slit extending in a direction crossing a diametric direction. When the spacing of the slit is narrowed, the fitting portion of the annular segment and the fitted portion of any other annular segment are engaged with each other so that the annular segments are fixed to each other.
Abstract translation: 提供高度柔性且具有非常小直径的医用管和具有医用管的柔性变化机构。 医疗管包括内管和多个圆柱形环形段，内管插入其中。 医疗管通过在将内管插入到多个环状部分的内部的状态下依次连接多个环状部分构成。 每个环形段包括允许任何其它环形区段装配到环形区段的装配部分，以及可以装配在任何其它环形区段的嵌合部分上的嵌合部分，该嵌合部分的直径朝向 并且包括沿与直径方向交叉的方向延伸的至少一个狭缝。 当狭缝的间隔变窄时，环形片段的装配部分和任何其它环形片段的装配部分彼此接合，使得环形片段彼此固定。
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